The invention discloses bottom filling glue for packaging an inverted chip type semiconductor, which is prepared from the following raw materials in percentage by weight: 5.8-59 percent of liquid epoxy resin, 2-10 percent of rubber toughening agent, 5.8-59 percent of modified organic silicon resin, 0.5-14.8 percent of multifunctional epoxy resin, 1.5-10.5 percent of epoxy diluent, 0.5-14.8 percent of aromatic amine curing agent, 1.1-10.8 percent of silane coupling agent, 20-59 percent of silicon micropowder and 0-6 percent of pigment. The invention has the advantages of low viscosity, proper flow property, no defect, no bubble and good heat resistance of resin condensate, low thermal expansion coefficient, low modulus, small internal stress, less warping degree, high bonding strength, low halogen content and high insulating performance, can maintain favorable bonding reliability and curing performance during thermal cycling treatment and improve the seal performance and the operating performance of the surface of a silicon wafer containing photosensitive polyimide and a silicon nitride film, can be widely used for the technical field of inverted chip packaging and is especially suitable for the field of high-end devices in a Flip-chip process and high-density packaging.