High-temperature-resistant phenolic carrier glue film and preparation method thereof

A technology of high temperature resistance and phenolic glue, which is applied in the direction of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problems of insufficient high temperature resistance, poor toughness of phenolic film, poor bonding strength, etc., and achieve improvement Effect of heat resistance, good toughness and adhesive performance, excellent heat resistance

Inactive Publication Date: 2018-09-04
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: to provide a high temperature resistant phenolic carrier film and its preparation method, use rubber toughened phenolic resin and epoxy resin as matrix resin, and continuous fiber as carrier to solve the problem of toughness, adhesion of phenolic film The disadvantages of poor bonding strength and insufficient high temperature resistance

Method used

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  • High-temperature-resistant phenolic carrier glue film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 1. Weigh 100 grams of boron phenolic resin, 30 grams of carboxyl-terminated liquid nitrile rubber (CTBN), 100 grams of ethanol solvent. Pour the materials into a high-speed mixer and stir fully at room temperature until the materials dissolve.

[0029] 2. Add 50 grams of F-51 epoxy resin and 5 grams of propylene oxide propylene ether into the above solution, stir well until the mixture is uniform, and obtain a phenolic / rubber / epoxy ternary system glue.

[0030] 3. Heat the glue solution obtained above to 60°C, and coat it on the glass fiber mesh cloth through a coating machine. After the glue solution is completely impregnated, put it in a 60°C oven for 1 hour to remove the ethanol solvent, and obtain a 0.5mm thickness High temperature resistant phenolic carrier film.

[0031] The adhesive film prepared above was used for the bonding of stainless steel, and samples were prepared according to GB7124-1986, and cured at 180°C for 3 hours to obtain test samples for tensile ...

Embodiment 2

[0033] 1. Weigh 100 grams of boron phenolic resin, 10 grams of powdered nitrile rubber (NBR), and 100 grams of ethanol solvent. Pour the material into a high-speed mixer and stir well at room temperature until the material is dispersed.

[0034] 2. Add 50 grams of F-51 epoxy resin and 5 grams of propylene oxide propylene ether diluent to the above solution, stir well until the mixture is uniform, and obtain a phenolic / rubber / epoxy ternary system glue.

[0035] 3. Heat the glue solution obtained above to 60°C, and coat it on the glass fiber mesh cloth through a coating machine. After the glue solution is completely impregnated, put it in a 60°C oven for 1 hour to remove the ethanol solvent, and obtain a 0.5mm thickness High temperature resistant phenolic carrier film.

[0036] 4. Use the adhesive film prepared above for bonding stainless steel, prepare samples according to GB7124-1986, and cure at 180° C. for 3 hours to obtain test samples for tensile shear strength. The meas...

Embodiment 3

[0038] 1. Weigh 100 grams of barium phenolic resin, 20 grams of powdered nitrile rubber (NBR), and 100 grams of ethanol solvent. Pour the material into a high-speed mixer and stir well at room temperature until the material is dispersed.

[0039] 2. Add 30 grams of F-51 epoxy resin and 5 grams of propylene oxide propylene ether diluent to the above solution, stir well until the mixture is uniform, and obtain a phenolic / rubber / epoxy ternary system glue.

[0040] 3. Heat the glue solution obtained above to 60°C, and coat it on the glass fiber mesh cloth through a coating machine. After the glue solution is completely impregnated, put it in a 60°C oven for 1 hour to remove the ethanol solvent, and obtain a 0.5mm thickness High temperature resistant phenolic carrier film.

[0041] 4. Use the adhesive film prepared above for bonding stainless steel, prepare samples according to GB7124-1986, and cure at 180° C. for 3 hours to obtain test samples for tensile shear strength. The mea...

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Abstract

The invention discloses a preparation method of a high-temperature-resistant phenolic carrier glue film. The prepared glue film is applicable to the bonding among honeycomb core sandwich materials, metal, ceramic and C-C composite materials. Particularly at high-temperature environment, good bonding performance is still maintained. The high-temperature-resistant phenolic carrier glue film providedby the invention is prepared by using modified phenolic glue liquid as matrix resin and using fiber fabric as a framework material by a hot melting film coating method; the modified phenolic glue liquid is prepared from the following ingredients in parts by mass: 100 mass parts of phenolic resin, 10 to 50 mass parts of rubber toughening agents, 50 to 80 mass parts of epoxy resin and 5 to 10 massparts of diluents. The prepared high-temperature-resistant phenolic carrier glue film has the characteristics that the preparation process is simple; the application is convenient and fast; the heat resistance and bonding performance are good, and the like.

Description

technical field [0001] The invention relates to a high temperature resistant phenolic carrier adhesive film and a preparation method thereof Background technique [0002] Adhesive film is a very important form of adhesive, which can be divided into carrier film and non-carrier film according to whether it contains fiber skeleton as carrier. Among them, the carrier adhesive film usually uses glass fiber cloth, aramid fiber and other fabrics as the skeleton, and is formed into a dimensionally stable adhesive film by infiltration or paving of the matrix resin. When using it, you only need to cut it according to the size required for the fit, and it can be directly pasted and cured. Compared with adhesives, the carrier film eliminates the process of compounding and smearing, and has the advantages of uniform thickness, accurate and controllable glue application, and simple construction technology. It is widely used in the aerospace field, especially as a honeycomb material and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J7/21C09J161/14C09J163/00C09J11/08
CPCC08L2201/08C08L2205/03C08L2205/06C09J11/08C09J161/14C09J2400/263C09J2409/00C09J2413/00C09J2461/00C09J2463/00C09J7/21C09J7/30C09J2301/122C08L63/00C08L13/00C08L9/02
Inventor 秦岩赵子晗邹镇岳黄志雄
Owner WUHAN UNIV OF TECH
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