Modified bisphenol-A epoxy resin inserted bar glue in complete underwater environment and preparation method

Abstract

The invention discloses modified bisphenol-A epoxy resin inserted bar glue in the complete underwater environment and a preparation method. The inserted bar glue comprises the following ingredients by weight ratio: ingredients A: 10-15 parts of bisphenol-A epoxy resin, 1.5-2.5 parts of a rubber toughening agent and 5-10 parts of a spherical filler with the degree of sphericity being 0.8-1; ingredients B: 3-5 parts of a modified base amines curing agent and 5-15 parts of a spherical filler with the degree of sphericity being 0.8-1. The ingredients A and the ingredients B are mixed for construction according to the ratio of 1:1. According to the inserted bar glue and the preparation method, steel bars can be inserted and screw rods can be embedded on the surfaces of substrates completely underwater; the inserted bar glue can be cured at ordinary temperature in the complete underwater environment, and the steel-steel shearing strength can reach to over 23 MPa after curing.

Description

technical field [0001] The invention relates to a planting glue and a preparation method thereof, in particular to a modified bisphenol A epoxy resin planting glue suitable for a completely underwater environment and a preparation method thereof. Background technique [0002] At present, planting glue is widely used in the field of construction for post-anchoring of screws and steel bars. Ordinary planting glue is composed of two components. Component A is mainly a mixture of bisphenol A epoxy resin and inorganic filler, and component B is mainly a curing agent and inorganic filler. When using it, components A and B must be fully stirred and mixed according to the specified ratio to cause a chemical reaction to occur. solidify. So as to achieve the purpose of anchoring screw rods and steel bars. The current planting glue products must be used in a dry or slightly humid environment, that is, the water content of the anchored substrate should not be too large, otherwise the...

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Problems solved by technology

The current planting glue products must be used in a dry or slightly humid environment, that is, the water content of the anchored substrate should not be too large, otherwise the durability and strength of the anchor will be affected

[0003] The main disadvantage of the current planting glue products is that they cannot be used in a completely underwater environment. The main reason is that the curing agent used cannot be successfully cured on the surface of the substrate in a completely underwater environment and the bisphenol A ring used Oxygen resins do not couple well to wet substrate surfaces

Bisphenol A epoxy resin curing agent is usually amines, amine curing agent has good compatibility with water, the curing agent partly dissolves in water on the surface of the substrate with water and then cures with bisphenol A epoxy resin The molecular weight generated after the reaction decreases, which affects the strength of the polymer. After curing, the free water evaporates to form fine pores, which makes the polymer and the surface of the substrate poorly coupled.

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