Room temperature controllable curing building adhesive and preparation method thereof

A room temperature curing, construction adhesive technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of high viscosity, short operating time, easy to explode, etc., and achieve low viscosity and long operating time. , The effect of large amount of glue

Active Publication Date: 2008-09-17
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the curing agents compounded by T-31 series curing agent and epoxy on the market have high viscosity, high manual operation strength, short operating time, and easy to burst when the temperature is slightly high, which is not conducive to

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Preparation of the first glue solution

[0024] 65 parts of bisphenol A epoxy resin (Wuxi Resin Factory) (the same as below by weight), 25 parts of bisphenol F epoxy resin (Wuxi Diaisheng Epoxy Co., Ltd.), 4 parts of long-chain fatty alkanes, ether diluent 3 parts, stir well, mix well.

[0025] 2. Preparation of the second glue solution

[0026] Mix 16 parts of long-chain liquid aliphatic amine, 15 parts of nitrile rubber, 1.6 parts of accelerator DMP-300, and 1 part of coupling agent KH-5501.

[0027] 3. Fully mix the two components of the first glue solution and the second glue solution and stir evenly before use. This formula can be operated for up to 4 hours (at 20°C), and can be fully cured in 24 hours. Steel-steel shear strength is greater than 20MPa, and can meet other performance requirements of building structure adhesives in national standards. Example 2:

Embodiment 2

[0028] 1. Preparation of the first glue solution

[0029] 15 parts of bisphenol A epoxy resin (Wuxi Resin Factory) (the same as below by weight), 5 parts of bisphenol F epoxy resin (Wuxi Diaisheng Epoxy Co., Ltd.), 0.4 part of long-chain fatty alkane, ether diluent 1 part, stir well and mix well.

[0030] 2. Preparation of the second glue solution

[0031] Mix 4.5 parts of long-chain liquid fatty amine, 5 parts of nitrile rubber, 1.6 parts of accelerator DMP-30, and 1 part of coupling agent KH-550, and mix well.

[0032] 3. Fully mix the two components of the first glue solution and the second glue solution and stir evenly before use. This formula can be operated for up to 3.6 hours (at 20°C), and a relatively complete cure can be achieved in 24 hours. Steel-steel shear strength is greater than 21MPa, and can meet other performance requirements of building structure adhesives in national standards. Example 3:

Embodiment 3

[0033] 1. Preparation of the first glue solution

[0034] 30 parts of bisphenol A epoxy resin (Wuxi Resin Factory) (the same as below by weight), 70 parts of bisphenol F epoxy resin (Wuxi Diaisheng Epoxy Co., Ltd.), 4 parts of long-chain fatty alkanes, ether diluent 1 part, stir well and mix well.

[0035] 2. Preparation of the second glue solution

[0036] Mix 18 parts of long-chain liquid fatty amine, 16 parts of nitrile rubber, 1.6 parts of accelerator DMP-30, and 08 parts of coupling agent KH-550, and mix well.

[0037] 3. Fully mix the two components of the first glue solution and the second glue solution and stir evenly before use. The working time of this formula can reach 3.0 hours (at 20°C), and a relatively complete cure can be achieved in 24 hours. The steel-steel shear strength can reach 28MPa, and can meet other performance requirements of building structure adhesives in national standards.

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Abstract

The invention relates to a room temperature controllable curing construction adhesive and the preparation method thereof, which belong to the adhesive used for bonding and anchoring of building elements, and the preparation field thereof. The room temperature controllable curing construction adhesive is a bi-component room temperature curing adhesive composed of first adhesive liquid and second adhesive liquid, the components and the contents (mass percent) of the first adhesive liquid are as follows: bisphenol A epoxy resin 30 to 95 percent, bisphenol F epoxy resin 0 to 95 percent, ester thinner 5 to 20 percent, and long-chain fatty alkane 5 to 25 percent; the components and the contents (mass percent) of the second adhesive liquid are as follows: fatty amines 15 to 65 percent, rubber toughening agent 10 to 50 percent, curing accelerant 2 to 15 percent, and coupling agent of KH series 2 to 8 percent. The construction adhesive has the advantages that the construction adhesive has environmental protection (without contaminants of formaldehyde,etc.) urgently needed by the building market, small viscosity, long operating time, larger amount of adhesive distribution, higher operating temperature range and controllable curing speed, thereby meeting the requirements of construction and operation under differnet conditions, and solving the problem of the requirement of the building market to the room temperature controllable curing environment-friendly building structural adhesive.

Description

technical field [0001] The invention relates to a room temperature controllable curing construction adhesive and a preparation method thereof, belonging to the field of adhesive for bonding and anchoring building components and the preparation thereof. Background technique [0002] With the implementation of my country's sustainable development strategy, new building materials, such as carbon fiber and other plates, emerge in endlessly. However, most construction light boards do not have a matching construction adhesive. The room temperature curing two-component epoxy resin construction structural adhesive is usually composed of bisphenol A epoxy resin, fatty amine and its modified products. At present, most of the curing agents compounded by T-31 series curing agent and epoxy on the market have high viscosity, high manual operation strength, short operating time, and easy to burst when the temperature is slightly high, which is not conducive to single glue compounding. It ...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/06
Inventor 贺高红石学堂吴雪梅
Owner DALIAN UNIV OF TECH
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