Epoxy structure adhesive applied to aramid fiber honeycomb composite materials and preparation method thereof

A technology of epoxy structural adhesive and composite material, applied in the field of structural adhesive, can solve the problems of low peel strength of bonding material, low temperature resistance and low impact resistance of epoxy structural adhesive, and avoid weak connection strength, Solve the effect of high brittleness and good temperature resistance

Inactive Publication Date: 2018-01-09
SICHUAN YUNTONG CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Technical problems to be solved by the present invention: the existing technical problems of epoxy structural adhesi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039]Add bisphenol A epoxy resin E54 to 500g in a 1000ml four-necked bottle with agitator, condenser, and nitrogen tube, and add 200g of carboxyl-terminated liquid nitrile rubber at the same time, and add triphenylphosphine to promote rubber and epoxy resin Prepolymerize, feed nitrogen, stir at a speed of 120 rpm and heat up to 175°C, keep the temperature for 120 minutes, cool down to 100°C, add 280g of nano-core-shell rubber particles, disperse evenly at a speed of 2000 rpm, and cool to At 60°C, add 300g of trifunctional epoxy resin TDE 85 and 450g of tetrafunctional epoxy resin AG80, stir and mix evenly at 100-150 rpm, lower to room temperature, and obtain component A of epoxy structural adhesive;

[0040] Component B is a modified temperature-resistant curing agent, specifically a combination of phenolic modified curing agent and aromatic amine modified curing agent. The specific preparation method of B component is: in a 1000ml Add 160g of aromatic amine modified curing a...

Embodiment 2

[0044] In the 1000ml four-necked bottle with stirrer, condenser, nitrogen tube, add bisphenol A epoxy resin E51 to be 400g, bisphenol A epoxy resin E44 is 100g, add carboxyl-terminated liquid nitrile rubber 200g simultaneously, add three Phenylphosphine, feed nitrogen, stir at 120 rpm, heat up to 165°C with stirring, keep warm for 160 minutes, cool down to 90°C, add 1600g of nano core-shell rubber particles, and then quickly disperse at 200 rpm Evenly, cool down to 60°C, add 1000g of four-functional epoxy resin AG80, stir and mix evenly at a speed of 150 rpm, and cool down to room temperature to obtain component A of epoxy structural adhesive;

[0045] Component B is a modified temperature-resistant curing agent, specifically a combination of phenolic modified curing agent and aromatic amine modified curing agent. The specific preparation method of B component is: in a 1000ml Add 300g of aromatic amine modified curing agent, 700g of phenalkamine modified curing agent, 3g of si...

Embodiment 3

[0049] Add bisphenol A ring epoxy E51 to 450g, bisphenol A epoxy resin E54 to 50g in a 1000ml four-necked bottle with stirring, condenser, and nitrogen tube, add 200g of hydroxyl-terminated nitrile rubber at the same time, add triphenyl Phosphine, feed nitrogen, start stirring at a speed of 120 rpm, heat up to 150°C, keep warm for 120 minutes, cool down to 100°C, add 60g of nano-core-shell rubber particles, quickly disperse evenly at 2000 rpm, and cool down To 60°C, add novolac epoxy resin F51 to 1000g, stir at 150 rpm, mix evenly, and lower to room temperature to obtain component A of epoxy structural adhesive;

[0050] Component B of epoxy structural adhesive is a modified temperature-resistant curing agent. Its preparation method is: add 375g of aromatic amine modified curing agent into a 1000ml four-necked bottle with stirring, condenser and nitrogen tube, and then modify and cure with phenalkamine 1125g of silane coupling agent, 3.5g of silane coupling agent, 6g of fumed ...

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Abstract

The invention discloses an epoxy structure adhesive applied to aramid fiber honeycomb composite materials and a preparation method thereof. The epoxy structure adhesive is prepared from the followingcomponents: matrix epoxy resin, heat-resistant epoxy resin and a rubber toughening agent, wherein the mass ratio of the matrix epoxy resin to the heat-resistant epoxy resin and the rubber toughening agent is 1 to (1.5-3) to (2-5). The epoxy structure adhesive of the technical scheme is mainly applied to connection between aramid fiber honeycomb materials; the mass ratio of the matrix epoxy resin to the heat-resistant epoxy resin and the rubber toughening agent is optimized to obtain an equilibrium value, so that the prepared epoxy structure adhesive has relatively high adhesion strength and better temperature resistance after the epoxy structure adhesive is cured under normal temperature; meanwhile, the preparation method is simple to operate; the epoxy structure adhesive is cured under normal temperature and is used under high temperature; the peeling strength of the adhesive material is improved.

Description

technical field [0001] The invention relates to the technical field of structural adhesives, in particular to a method for preparing epoxy structural adhesives for aramid honeycomb composite materials. Background technique [0002] With the rapid development of the aramid honeycomb industry, its application fields are also expanding, and aramid honeycomb composite material, as one of its application fields, has been widely concerned by the material industry for its excellent performance. It has the properties of light weight, high strength, temperature resistance and flame retardancy, and is especially suitable for the production and processing of composite material products. [0003] Since the aramid honeycomb is a porous structure, the existing connection technology such as rivet connection and bolt connection cannot be used to complete the splicing and lapping of the aramid honeycomb material after being made into a composite sandwich structure composite part. The connec...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
Inventor 刘晓东徐江
Owner SICHUAN YUNTONG CHEM IND CO LTD
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