The application belongs to the technical field of
phosphine salt catalysts and packaging, and discloses a tetraphenyl
phosphonium salt high-latency catalyst and application of the catalyst in a
chip packaging
epoxy plastic packaging material; tetraphenyl
phosphonium cations and large steric hindrance
aryl organic acid anions are combined through ionic bonds in a
molar ratio of 1:0.95-1.05, and the
organic acid anions are selected from
naphthalene ring
dicarboxylic acid monoanions, diphenyl
sulfonic acid anions or tert-butyl phenyl
phosphoric acid anions; the catalyst has no
epoxy ring opening catalytic activity, the ionic bond is quickly dissociated when the temperature reaches 160 DEG C or above, the
solubility is greater than or equal to 10 wt% at 170 DEG C, the total
halide content is less than 10 ppm, and the
thermal decomposition temperature is higher than 220 DEG C. The application adopts an ionic structure design, solves the problems of normal temperature pre-crosslinking of existing small-molecule organic
phosphine accelerators, reduction of
halogen impurities to reduce device reliability, poor compatibility of microcapsule type accelerators, and complex process, is suitable for existing
epoxy plastic packaging material production processes, and can be used in the field of
semiconductor packaging.