Thermosetting rubber film for flexible circuit assembly and its preparing method

A heat-curing adhesive, flexible circuit technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems that the adhesive film cannot be well satisfied, and the peeling strength is high.

Inactive Publication Date: 2005-02-16
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Existing thermosetting adhesive films for flexible circuit assembly cannot well meet the comprehensive requirements for adhesive films that are stable at room temperature, quickly cured under high temperature and hot pressure, have no glue overflow, and have high peel strength.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Weigh 80g of 1702 carboxybutyl nitrile, add 288g of butanone, dissolve under stirring at 40-60°C, then add 30g of E-44 epoxy resin, 30g of F-44 novolac epoxy resin, 20g of E-20 epoxy resin, 20g of EX-46 brominated epoxy resin was stirred and dissolved at the same temperature, then 8g of diaminodiphenyl sulfone was added, and 2g of imidazole derivative HX3748 was added after stirring and dissolved. The solution was coated on the release paper, dried at 80°C for 7 minutes, and laminated with a polyester film to obtain a heat-cured adhesive film with a thickness of 35 μm.

[0027] Put the adhesive film between polyimide, stainless steel sheet, FR-4 glass cloth reinforced epoxy resin copper-clad laminate and other materials, and heat press it at 180°C and 4Mpa pressure for 5 seconds to obtain the sample. After testing: its peel strength 1.2kg / cm2, resistance to soldering temperature 288 ℃.

Embodiment 2

[0029] Weigh 50g of Dingqing-40, add 288g of butanone, dissolve under stirring at 40-60°C, then add E-44, 30g of epoxy resin, 30g of F-44 novolac epoxy resin, 20g of E-20 epoxy resin , 20g of EX-46 brominated epoxy resin, stirred and dissolved at the same temperature, then added 15g of diaminodiphenyl sulfone, stirred and dissolved, then added 8g of imidazole derivative HX3748, after dissolving, placed at room temperature for 12 hours to obtain glue, put The glue solution was coated on the release paper, dried at 80°C for 7 minutes, and laminated with a polyester film to obtain a heat-cured adhesive film with a thickness of 35 μm.

[0030] Put the adhesive film between polyimide, stainless steel sheet, FR-4 and other materials, and heat press it at 180°C and 4Mpa pressure for 5 seconds to obtain a sample. After testing: its peel strength is 1.0kg / cm 2 , Resistance to soldering temperature 280 ℃.

Embodiment 3

[0032] Weigh 100g of 1702 carboxybutyl nitrile, add 288g of butanone, dissolve under stirring at 40-60°C, then add E-44, 30g of epoxy resin, 30g of F-44 novolac epoxy resin, and 20g of E-20 epoxy resin , EX-46 Brominated Epoxy Resin 20g, stir and dissolve at the same temperature, then add 8g of diaminodiphenyl sulfone, stir and dissolve, then add imidazole derivative 2,4 diamino-6-[2-undecylimidazole ]-2 base-cis-triazine 4g, dissolve and place at room temperature for 12 hours to obtain a glue solution, apply the glue solution on a release paper, dry it at 80°C for 7 minutes, and compound it with a polyester film to obtain a heat-curing glue Membrane, thickness 35 μm.

[0033] Put the film between polyimide, stainless steel sheet, FR-4 and other materials, heat press at 180°C and 4Mpa pressure for 5 seconds to obtain the sample, after testing: its peel strength is 1.1kg / cm 2 , Resistance to soldering temperature 280 ℃.

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PUM

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Abstract

It is about hot set rubber film for flexibility circuit assemblage and its preparation methods. This -can be used in ---circuit construction. It is made from epoxy resin, butadiene acrylonitrile rubber toughening agent, fixing tanning agents of imidazole derivates and solvent by form them into liquid cement and application. The binding strength and tenacity can be advanced by the combination of epoxy resin. The curing speed in the high temperature can be improved by the complex fixing tanning agents of aromatic polyamines and imidazole derivates. The whole process can finish within decades of seconds in temperature of 180 degree. So it is propitious to snap couple flexible electric. Compared with the exiting technique, the invention can keep the film of rubber stable in normal temperature and can fast set in high temperature and hot pressing without excessive glue and uncover.

Description

technical field [0001] The present invention relates to the preparation of polymer adhesives, and more particularly to the preparation of thermosetting adhesive films used in the assembly of flexible circuits. Background technique [0002] As the current electronic industry products are developing towards miniaturization and thinning, flexible circuits are used more and more widely, so it is very important to ensure the reliability of the connection between flexible circuits and other components. When the polyimide flexible circuit is connected with other flexible or rigid components, a heat-curing adhesive film must be used, that is, this film is pasted between the flexible circuit and other substrates, and it is quickly cured under heat and pressure. It has high bonding strength, good heat resistance, chemical resistance and electrical properties to polyimide film surface, copper foil surface, stainless steel and FR-4 epoxy resin and other materials. Sold as a commodity, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J109/02C09J163/00
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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