Thermosetting rubber film for flexible circuit assembly and its preparing method
A heat-curing adhesive, flexible circuit technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems that the adhesive film cannot be well satisfied, and the peeling strength is high.
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Embodiment 1
[0026] Weigh 80g of 1702 carboxybutyl nitrile, add 288g of butanone, dissolve under stirring at 40-60°C, then add 30g of E-44 epoxy resin, 30g of F-44 novolac epoxy resin, 20g of E-20 epoxy resin, 20g of EX-46 brominated epoxy resin was stirred and dissolved at the same temperature, then 8g of diaminodiphenyl sulfone was added, and 2g of imidazole derivative HX3748 was added after stirring and dissolved. The solution was coated on the release paper, dried at 80°C for 7 minutes, and laminated with a polyester film to obtain a heat-cured adhesive film with a thickness of 35 μm.
[0027] Put the adhesive film between polyimide, stainless steel sheet, FR-4 glass cloth reinforced epoxy resin copper-clad laminate and other materials, and heat press it at 180°C and 4Mpa pressure for 5 seconds to obtain the sample. After testing: its peel strength 1.2kg / cm2, resistance to soldering temperature 288 ℃.
Embodiment 2
[0029] Weigh 50g of Dingqing-40, add 288g of butanone, dissolve under stirring at 40-60°C, then add E-44, 30g of epoxy resin, 30g of F-44 novolac epoxy resin, 20g of E-20 epoxy resin , 20g of EX-46 brominated epoxy resin, stirred and dissolved at the same temperature, then added 15g of diaminodiphenyl sulfone, stirred and dissolved, then added 8g of imidazole derivative HX3748, after dissolving, placed at room temperature for 12 hours to obtain glue, put The glue solution was coated on the release paper, dried at 80°C for 7 minutes, and laminated with a polyester film to obtain a heat-cured adhesive film with a thickness of 35 μm.
[0030] Put the adhesive film between polyimide, stainless steel sheet, FR-4 and other materials, and heat press it at 180°C and 4Mpa pressure for 5 seconds to obtain a sample. After testing: its peel strength is 1.0kg / cm 2 , Resistance to soldering temperature 280 ℃.
Embodiment 3
[0032] Weigh 100g of 1702 carboxybutyl nitrile, add 288g of butanone, dissolve under stirring at 40-60°C, then add E-44, 30g of epoxy resin, 30g of F-44 novolac epoxy resin, and 20g of E-20 epoxy resin , EX-46 Brominated Epoxy Resin 20g, stir and dissolve at the same temperature, then add 8g of diaminodiphenyl sulfone, stir and dissolve, then add imidazole derivative 2,4 diamino-6-[2-undecylimidazole ]-2 base-cis-triazine 4g, dissolve and place at room temperature for 12 hours to obtain a glue solution, apply the glue solution on a release paper, dry it at 80°C for 7 minutes, and compound it with a polyester film to obtain a heat-curing glue Membrane, thickness 35 μm.
[0033] Put the film between polyimide, stainless steel sheet, FR-4 and other materials, heat press at 180°C and 4Mpa pressure for 5 seconds to obtain the sample, after testing: its peel strength is 1.1kg / cm 2 , Resistance to soldering temperature 280 ℃.
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