66results about How to "No glue overflow" patented technology

The invention relates to a die-cutting waste discharge device with an inner frame die-cutting piece and a die-cutting waste discharge method. The die-cutting waste discharge device comprises a first opposite-pressing roller, first-stamping die-cutting cutters, first waste discharge rollers, a second opposite-pressing mechanism, second-stamping die-cutting cutters and second waste discharge rollers which are arranged sequentially. The first opposite-pressing roller attaches a first single face gummed protective film to a first release film; indent inner frames are punched in first stamping by the first-stamping die-cutting cutters; the first waste discharge rollers is used to take up the first single face gummed protective films attached to wastes of the inner frames after the first-stamping punching; the second opposite-pressing mechanism attaches a second single face gummed protective film to the non-release surface of the first release film, and sequentially attaches double faced adhesive tape and a second release film to the release surface of the first release film; normal inner frames are punched in second-stamping by the second-stamping die-cutting cutters; the second waste discharge rollers are used to take up the second single face gummed protective films attached to wastes of the inner frames after the second-stamping punching; and the size of each normal inner frame is bigger than the size of each indent inner frame. Compared with the prior art, the die-cutting waste discharge device has the advantages that the effect of waste discharge is good, the product has no deformation, and efficiency is high.

The invention discloses a machining method of a printed circuit board (PCB) of a step blind slot. The method includes that a first core board and a second core board are provided, and holes are arranged on the first core plate; a light panel is provided and holes are arranged on the light panel; a first semi-curing plate and a second semi-curing plate are provided, holes are arranged on the semi-curing plates, and the first semi-curing plate and the second semi-curing plate are attached to the upper surface and the lower surface of the light panel respectively; the core plates are arranged on the outer lateral sides of the semi-curing plates, and the holes of the first core plate, the first semi-curing plate, the light panel and the second semi-curing plate form the step blind slot; a silica gel gasket is placed in the step blind slot, the thickness of the silica gel gasket is larger than the depth of the step blind slot, a gap is reserved between the silica gel gasket and an inner wall of the step blind slot, and the silica gel gasket is provided with a relief groove; a film is arranged on the upper face of the first core plate; a steel plate is arranged on the upper face and the lower face of a lamination and pressed through a press machine, glue of the semi-curing plates flows, and the semi-curing plates are molded; and the silica gel gasket in the step blind slot is taken out. By means of an embodiment of the machining method, glue blocking effect is good and seam abnormality of the blind slot is effective reduced.

This invention relates to a plane salient point encapsulation technology and its structure of IC or discrete components, among which, the technology includes: taking a base plate, dry-film layers are pasted to the front and back side of the base plate, removing part of the upper layer for the preparation of forming a basic island and pins, plating metal layers on the front, removing the rest dry film on the upper layer of the base plate, semi-etching it, removing the dry film on the back, implanting the chip, wiring, packaging with plastic capsule, pasting a dry film on the back of the base plate again, etching the dry film at the back and the rest of the metal of the semi-etched zone again so as to enable the back of the basic island and the pin projecting over the plastic capsule, removing the rest dry film, plating metal layers on the surface, pasting film on the front of the plastic capsule then cutting.

The invention discloses a conductive die bond glue solution which comprises components in parts by weight as follows: 2-10 parts of CTBN (carboxy-terminated butadiene nitrile liquid rubber) modified epoxy resin, 5-10 parts of a diluent, 2-10 parts of thermoplastic resin, 2-5 parts of a curing agent, 1-2 parts of a coupling agent and 70-90 parts of a conductive material. The invention further discloses a preparation method of the conductive die bond glue solution, an application of the conductive die bond glue solution in chip packaging, a conductive die bond glue film, a preparation method of the conductive die bond glue film and an application of the conductive die bond glue film in the chip packaging. The conductive die bond glue solution and the conductive die bond glue film prepared from the conductive die bond glue solution have excellent performance, avoid glue overflowing during application, have good manufacturability and can realize packaging of thinner and smaller chips. The processes for preparing the conductive die bond glue solution and the conductive die bond glue film with the methods are simple and easy.

The invention discloses a waterproof metal outer shell of an electronic product and a manufacturing method of the waterproof metal outer shell. According to the manufacturing method, a metal shell provided with a protrusive waterproof rib on the inner surface is formed, and the positions, spaced by a preset distance, on the two sides of the waterproof rib respectively protrude upwards to form a sealant boss; a mold is directly pressed on the sealant bosses, so that the sealant bosses deform, at least a part of each sealant boss is pressed in a containing groove, then a closed cavity is formed by the mold and the metal shell through the sealant bosses, then silica gel is injected to the cavity, the mold is opened after the silica gel is heated and vulcanized, a waterproof silica gel part integrated with the metal shell is formed on the waterproof rib, and the side surface or the top of the waterproof silica gel part is provided with a protrusive part. According to the waterproof metal outer shell, due to the design of the sealant bosses, when the waterproof metal outer shell is manufactured, silica gel overflowing and scratches on the surface of the metal product are not prone to occurring in the injection molding process, and compression or damage to the mold is also avoided.

The invention discloses a hot-melt pressure-sensitive structural adhesive film which is composed of an epoxy adhesive film core material and hot-melt pressure-sensitive adhesive films which are respectively covered on both sides of the epoxy adhesive film core material, wherein the epoxy adhesive film core material is mainly composed of epoxy resin, and the hot-melt pressure-sensitive adhesive films are mainly composed of thermoplastic elastomer. The hot-melt pressure-sensitive structural adhesive film is very convenient to use, has pressure sensitivity at ordinary temperature, can generate a strong bonding function after being cured by heating, and can be directly used for structure bonding or substructure bonding.

The invention discloses a low-liquidity acrylate adhesive on multiple flexible printing circuits, whose superior information: 2005100189758 CN 2005-6-23. The adhesive is composed of polybasic acrylate monomer, crosslinking modified monomer, organic solvent, reaction initiator and special polyester rubber macromolecular modifier. The preparing method of acrylate adhesive comprises the following steps: selecting polybasic acrylate monomer; crosslinking monomer; putting the monomers, organic solvent and initiator in the reactor at certain proportion; stirring the reaction to polymerize; blending the macromolecular compound and acrylate adhesive to constitute a new gel type with half-interpirecing network structure.

The invention provides a semiconductor packaging piece, a prefabricated lead frame and a manufacturing method thereof. The semiconductor packaging piece comprises packaging colloid; a plurality of guide pins partially embedded into the packaging colloid; surface processing layers formed on the top surface, the bottom surface and the recess of each guide pin; and a semiconductor chip embedded in the packaging colloid and used for being electrically connected with the guide pins.

The invention relates to a coating method of a non-woven fabric hot melt adhesive tape. The coating method comprises the following steps: (1) recombining for the first time: enabling release paper A and release paper B to be recombined together by utilizing hot melt adhesive, and preserving heat to enable the hot melt adhesive to keep a fluid state, wherein the release force between the release paper B and the hot melt adhesive is less than the release force between the release paper A and the hot melt adhesive; (2) peeling off the release paper B: peeling off the release paper B and the hot melt adhesive to enable one side of the hot melt adhesive to be exposed to become a to-be-recombined surface; (3) recombining for the second time: enabling non-woven fabric and the to-be-recombined surface of the hot melt adhesive to be recombined, cooling simultaneously to enable the hot melt adhesive to be solidified so as to obtain the non-woven fabric hot melt adhesive tape; and (4) rolling-up: rolling-up the obtained non-woven fabric hot melt adhesive tape. The invention further discloses a coating device of the non-woven fabric hot melt adhesive tape, and the obtained non-woven fabric hot melt adhesive tape has the following characteristics: (1) by enabling the hot melt adhesive and the non-woven fabric to be combined together, the dressing meets hydroscopicity and air permeability simultaneously; and (2) as the hot melt adhesive is recombined on the non-woven fabric, not only is the hot melt adhesive difficult to peel off, but also adhesive overflowing cannot happen.

The invention includes following technical steps: pasting dry film layer on both sides of metal base plate; removing part of dry film layer for preparing basic island and pins to be formed; plating metal layer at place, where basic island and pins are to be formed, on both sides, then removing remanent dry film layer on front face; carrying out half etching so as to form concave half etched area including basic island and pins, and removing remanent dry film layer on back face; embedding chip on metal layer of basic island on front face, making metal wire, enveloping plastic package, printing at front face; etching remanent partial metal at half etching area, and pasting rubber film onto plastic package and incising. Features are: good weldability, low cost, high adaptability, flexible to arrange multiple chips, and avoiding infiltration of material of plastic package.

The invention discloses a thermoplastic carbon fiber product forming process. The thermoplastic carbon fiber product forming process comprises the following steps of cutting a thermoplastic carbon fiber raw material to obtain a to-be-processed sheet; performing pre-pressing forming on the to-be-processed sheet, and obtaining a pre-pressed semi-finished product with the side wall contour face being in a straight cylinder shape; performing hot press molding on the pre-pressed semi-finished product again so as to adjust the side wall contour surface of the pre-pressed semi-finished product to form an inverted buckle structure, and obtaining a hot-pressed product with the side wall contour surface having the inverted buckle structure; and processing the hot-pressed product to remove excess materials on the edge of the hot-pressed product. According to the thermoplastic carbon fiber product forming process, the problems of material clamping and glue overflowing of a thermoplastic carbon fiber product of a complex structure in the hot press forming process can be effectively solved, and therefore the product quality and the production efficiency are improved.

The invention discloses a battery module and an assembling method thereof. The battery module comprises a battery cell assembly and a shell assembly, wherein the battery cell assembly comprises a plurality of battery cell units which are arranged side by side, the battery cell assembly is arranged in the shell assembly, the battery cell assembly is bonded with the shell assembly through a double-faced adhesive tape layer of an adhesive tape, the adhesive tape comprises an isolation layer and a double-faced adhesive tape layer, and the double-faced adhesive tape layer is bonded on one surface of the isolation layer. The battery cell assembly and the shell assembly of the battery module are bonded through the double-faced adhesive tape layer, the adhesive layer is uniform, other areas of themodule cannot be polluted in the assembling process, the battery module can be used immediately after being pasted, and adhesive overflowing is avoided.

The invention discloses a double-side coated conducting film and a preparation method thereof. The double-side coated conducting film includes a film body, wherein the film body includes a base film,a graphene layer on both sides of the base film, and a sealant layer on both sides of the graphene layer; the base film can be prepared into a conducting film by a film processing device; and the filmprocessing device includes a film processing assembly, a hot press roll set and a cold press roll set; the film processing assembly comprises successively connected smooth rolling roll set, rough rolling roll set, coating roll set, graphene nozzle set, and ultraviolet laser emitter set. The preparation method of the double-side coated conducting film is simple in the process, satisfies the requirements of products with high adhesion requirements, enables the film body to be compact and strong through two or more times of rolling, and can effectively prevent the coated glue and the sprayed conductive powder from falling off and greatly improve the conductive performance of the conducting film through two or more times of coating the glue by means of the coating roll set, two or more timesof spraying conductive powder by means of the graphene nozzles, and two or more times of laser drying.

The invention relates to the technical field of paper-plastic edge bandings with hot-melt adhesives, in particular to a paper-plastic edge banding with a hot-melt adhesive and a preparation process for the paper-plastic edge banding. The paper-plastic edge banding with the hot-melt adhesive sequentially comprises a protective layer, a decorative layer, a paper-plastic substrate layer and a hot-melt adhesive layer from top to bottom, wherein the lower surface of the paper-plastic substrate layer is blade-coated with the hot-melt adhesive layer. According to the paper-plastic edge banding with the hot-melt adhesive, the hot-melt adhesive layer is combined, the paper-plastic substrate layer is adhered to and seamlessly connected with the hot-melt adhesive layer in a molten state, and the adhesion force of the hot-melt adhesive layer with the paper-plastic substrate layer and a product to be banded is high, so that the phenomenon of degumming is avoided; in addition, when the paper-plastic edge banding is used, adhesive overflow, the formation of an adhesive line and preparation work during the sticking of a conventional edge banding can be avoided, the effects of reducing the using amount of the adhesive and avoiding adhesive overflow during sticking, the adhesive line and tedious preparation are achieved, and the quality of a product and the production efficiency are greatly improved; a preparation method is simple, easy, high in production efficiency and applicable to industrial production.

The invention provides a die-cutting machining die structure. A narrow-edge double-faced adhesive tape is attached to the lower bottom surface of a product; the product is attached to a die-cutting machining die; a stop strip is arranged along the side, which is required to be cut, of a frame of the die-cutting machining die; the stop strip and the inside position of the narrow-edge double-faced adhesive tape are positioned in the same horizontal line; the distance between the stop strip and the inside of the narrow-edge double-faced adhesive tape is 0.03 to 0.05 mm; the height of the stop strip is 0.03 to 0.05 mm lower than that of a cutting edge of the die. Due to the adoption of the technical scheme, the current common die structure of the die-cutting machining die structure provided by the invention is redesigned on the basis of not changing a material, and the same linear stop strip is added to the position which is 0.03 to 0.05 mm away from the narrow-edge double-faced adhesive tape, so that the product quality problems of glue overflowing and transformation after the narrow-edge double-faced adhesive tape is die-cut and stamped are avoided.

The invention discloses a double-sealing-type socket press-fit pipe fitting and an assembling method thereof. The double-sealing-type socket press-fit pipe fitting comprises a pipe material and a socket press-fit welding head, the pipe material is inserted from the open end to the welding end, after insertion, the part located in the socket press-fit welding head is an insertion part, a circle ofsealing tape are connected to the outer wall of the insertion part in a sleeving mode, one end of the sealing tape is parallel and level to the open end, the other end of the sealing tape is close tothe welding end, the gap between the other end of the sealing tape and the welding end is filled with an anaerobic adhesive layer, and an annular groove is formed in the position, corresponding to thesealing tape, of an outer pipe body; the pipe fitting and the socket press-fit welding head are subjected to confining pressure through a hydraulic tool and are connected with each other tightly, andtwo confining pressure positions of confining pressure are separately located on the sealing tape and the anaerobic adhesive layer. According to the double-sealing-type socket press-fit pipe fitting,the structure and assembling method of the socket press-fit pipe fitting are improved, the amount of adhesive filling is effectively reduced, and the phenomenon of adhesive overflowing is avoided; and meanwhile, the installation cost is greatly saved, the sealing performance can be increased, and the installation quality of pipeline engineering can be ensured under extreme conditions such as high-and-low temperature area and high pressure environment.

The invention relates to a clamping jig and a glue filling system thereof, the clamping jig comprises a main body provided with a supporting part and a fastening part, a product to be clamped is located between the supporting part and the fastening part, and the fastening part is provided with a screw hole; the screw is matched with the screw hole, and a screw rod of the screw is provided with scale marks; wherein the screw is screwed into one end of the screw hole and penetrates through the fastening part, the distance between the screw and the supporting part is the clamping thickness, and the screw is screwed in or screwed out to adjust the clamping thickness to be the same as the thickness of the product to be clamped. According to the clamping jig and the glue filling system thereof, the clamping jig utilizes the screws with the scale marks to accurately adjust the clamping thickness, the clamping precision of products including curved screens is improved, the fixing effect is good, the thickness uniformity of the products can be guaranteed to the maximum extent, it is guaranteed that glue failure and glue overflowing do not occur in the follow-up process, the corresponding glue filling system is high in automation degree, and the production efficiency is improved. The product is not easy to damage.

The invention relates to a plane point-protruded type packaging process and its structure of integrated circuit or discrete component, comprising following steps: pasting dry films (2, 3) on the two surfaces of a metallic base plate (1) while removing some dry films relatively; plating active compound and metallic layer on the area of base plate for forming base island and pins; removing the left dry film on the front of base plate; half etching to form a depressed half etched region (1, 3), base island 1.1 and pin 1.2; removing the dry film left on the back of base plate; planting chip (9) into the front metal layer of base island, tie metallic thread (10), packaging plastic packaging body (11), front printing (12), and etching again on the left metal 1.4 of half etched region (1.3); pasting film (13) on the face of plastic packaging body, and slicing. Said invention has strong welding property, better quantity, low cost, good adaptability, reflex able arrangement of chips, while avoiding the problem of infiltration of plastic packaging material.