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Conductive die bond glue solution, conductive die bond glue film, preparation methods and applications

A technology for bonding adhesive films and solid crystals, which is applied in the direction of conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, adhesives, etc., can solve the problems of glue overflow, chip tilting, etc., and achieve thin packaging and good craftsmanship The effect of sex and simple process

Active Publication Date: 2015-07-29
深圳广恒威科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the existing conductive silver glue package has the following problems: 1. there are kerfs and wall marks 101 (such as figure 1 (a) shown); ② there is glue overflow phenomenon 102 (such as figure 1 (b) shown); ③ cause the chip to tilt 103 (as figure 1 (c) shown)

Method used

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  • Conductive die bond glue solution, conductive die bond glue film, preparation methods and applications
  • Conductive die bond glue solution, conductive die bond glue film, preparation methods and applications
  • Conductive die bond glue solution, conductive die bond glue film, preparation methods and applications

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preparation example Construction

[0045] The embodiment of the present invention also provides a method for preparing a conductive die-bonding glue, comprising the following steps:

[0046] Step S10: Weigh the raw materials according to the above-mentioned formula of conductive die-bonding glue.

[0047] Step S20: Mix the CTBN modified epoxy resin, the diluent and the thermoplastic resin uniformly at 60-70° C. to obtain a first mixed solution.

[0048] Step S30: adding the conductive material to the first mixed liquid, mixing evenly and cooling to room temperature to obtain a second mixed liquid. Preferably, the mixing time is preferably 30 to 50 minutes.

[0049] Step S40: Add the curing agent and the coupling agent to the second mixed liquid, mix evenly, then vacuumize, and cool to room temperature to obtain a conductive die-bonding glue.

[0050] The above process can be carried out in equipment such as a reactor, and the whole preparation process can be stirred to make the mixing more uniform.

[0051] ...

Embodiment 1

[0062] Table 1 shows the formula of the conductive die-bonding bonding glue in Example 1. Among them, the CTBN modified epoxy resin is prepared by the following process: 40 parts of carboxyl-terminated nitrile rubber CTBN and 60 parts of modified bisphenol A epoxy resin DGEBA are reacted at 120 ° C for 30 minutes to obtain the first mixture, and 2 parts of bisphenol A and 0.08 parts of ethyltriphenylphosphine iodide were added to the first mixture, reacted at 110° C. for 6 h, then vacuumed, and cooled to room temperature to obtain a CTBN modified epoxy resin. Weigh each raw material according to the formula shown in Table 1. Stir and mix the CTBN modified epoxy resin, diluent and thermoplastic resin at 60° C. to obtain a first mixed solution. The conductive material was added to the first mixed solution, mixed for 30 minutes and cooled to room temperature to obtain the second mixed solution. Add the curing agent and the coupling agent to the second mixed solution, stir and m...

Embodiment 2

[0064]The formula of the conductive die-bonding bonding glue in Example 2 is shown in Table 1. Among them, the CTBN modified epoxy resin is prepared by the following process: 10 parts of carboxyl-terminated nitrile rubber CTBN and 40 parts of modified bisphenol A epoxy resin DGEBA are reacted at 110 ° C for 40 minutes to obtain the first mixture, and 1 part of bisphenol A and 0.01 part of ethyltriphenylphosphine iodide were added to the first mixture, reacted at 100°C for 6 hours, then vacuumed, and cooled to room temperature to obtain a CTBN modified epoxy resin. Weigh each raw material according to the formula shown in Table 1. Stir and mix the CTBN modified epoxy resin, the diluent and the thermoplastic resin at 70° C. to obtain a first mixed liquid. The conductive material was added to the first mixed solution, mixed for 50 minutes and cooled to room temperature to obtain the second mixed solution. Add the curing agent and the coupling agent to the second mixed solution,...

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Abstract

The invention discloses a conductive die bond glue solution which comprises components in parts by weight as follows: 2-10 parts of CTBN (carboxy-terminated butadiene nitrile liquid rubber) modified epoxy resin, 5-10 parts of a diluent, 2-10 parts of thermoplastic resin, 2-5 parts of a curing agent, 1-2 parts of a coupling agent and 70-90 parts of a conductive material. The invention further discloses a preparation method of the conductive die bond glue solution, an application of the conductive die bond glue solution in chip packaging, a conductive die bond glue film, a preparation method of the conductive die bond glue film and an application of the conductive die bond glue film in the chip packaging. The conductive die bond glue solution and the conductive die bond glue film prepared from the conductive die bond glue solution have excellent performance, avoid glue overflowing during application, have good manufacturability and can realize packaging of thinner and smaller chips. The processes for preparing the conductive die bond glue solution and the conductive die bond glue film with the methods are simple and easy.

Description

technical field [0001] The invention belongs to the technical field of conductive crystal-bonding adhesive materials, and in particular relates to a conductive crystal-bonding adhesive liquid, a preparation method of a conductive crystal-bonding adhesive liquid, an application of a conductive crystal-bonding adhesive liquid, and the use of the conductive bonding adhesive. A conductive die-bonding adhesive film prepared from glue, a preparation method of the conductive die-bonding adhesive film, and an application of the conductive die-bonding adhesive film. Background technique [0002] With the development of social science and technology, human beings' pursuit of high-tech products, smart phones, electronic products, etc. is becoming more and more intense. The requirements for product and technology development are getting higher and higher, and products are constantly required to achieve more functions in smaller and smaller dimensions, prompting semiconductor packaging e...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J133/00C09J9/02C09J7/00C08G59/14H01B1/22
Inventor 艾瑞克·C·王毛志平
Owner 深圳广恒威科技有限公司
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