High-performance conducting resin and preparation method thereof

A conductive adhesive, high-performance technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of not meeting high temperature conditions, endangering human health, and poor workability, and achieving excellent resistance to atmospheric aging. , easy operation, low cost effect

Inactive Publication Date: 2010-07-21
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are also some problems in the epoxy resin adhesive system: (1) solvent type: the volatilization of the solvent pollutes the environment and endangers human health; (2) solvent-free type: high viscosity, poor manufacturability, and partial bonding strength Low; low heat resistance, can not meet the application under high temperature conditions

Method used

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  • High-performance conducting resin and preparation method thereof
  • High-performance conducting resin and preparation method thereof
  • High-performance conducting resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Put 100 grams of silver powder into 500 milliliters of ethanol solution (mass percentage concentration is 0.5%) containing 3-glycidyl ether oxypropyl trimethoxysilane coupling agent, stir for 1-2 hours, filter, dry, obtain through Surface-treated conductive particles are denoted as A-1.

[0037] Put 30.0 grams of ES216 epoxy resin, 16.0 grams of CE127 epoxy resin, and 2.0 grams of carboxy-terminated nitrile rubber active toughening agent into the reaction bottle, react at a temperature of 80 ° C to 90 ° C for 0.5 hours, and add 4.0 at 50 ° C gram of dicyandiamide latent curing agent, after being stirred evenly, a solvent-free adhesive is obtained, which is denoted as SLA-1.

[0038] Take 26.0 grams of the above-mentioned SLA-1 solvent-free adhesive, add 74.0 grams of surface-treated conductive particles A-1, stir evenly, vacuum defoam, weigh and pack to obtain a high-performance conductive adhesive, which is designated as ECA-1.

[0039] Take an appropriate amount of E...

Embodiment 2

[0046] Put 100 grams of silver powder into 500 milliliters of ethanol solution (mass percent concentration: 1.0%) containing terminal aminopropyltriethoxysilane coupling agent, stir for 1-2 hours, filter, and dry to obtain a surface-treated conductive silver powder. Particles, denoted as A-2.

[0047] Put 20.0 grams of ES216 epoxy resin, 2.0 grams of E-51 epoxy resin, 2.0 grams of YAG-80 epoxy resin, 16.0 grams of CE127 epoxy resin, and 3.0 grams of amino-terminated polyetherimide resin active toughening agent into the reaction In the bottle, react at a temperature of 80°C to 90°C for 0.5 hours, add 4.0 grams of phenyl-substituted dicyandiamide latent curing agent and 2.0 grams of adipic acid dihydrazide latent curing agent at 50°C, and stir evenly to obtain Solvent-free adhesive, denoted as SLA-2.

[0048] Take 24.5 grams of the above-mentioned SLA-2 solvent-free adhesive, add 75.5 grams of surface-treated conductive particles A-2, stir evenly, vacuum defoam, weigh and pack ...

Embodiment 3

[0056] Put 100 grams of silver-plated copper powder into 500 milliliters of ethanol solution (mass percentage concentration is 0.8%) containing isopropyl dioleic acid acyloxy (dioctyl phosphate acyloxy) titanate coupling agent, stir After 1-2 hours, filter and dry to obtain surface-treated conductive particles, which are designated as A-3.

[0057] 20.0 grams of ES216 epoxy resin, 2.0 grams of E-44 epoxy resin, 2.0 grams of YAG-80 epoxy resin, 16.0 grams of CE127 epoxy resin, 0.5 gram of hydroxyl-terminated nitrile rubber and 1.5 gram of carboxyl-terminated nitrile rubber activity enhancer Put the toughening agent into the reaction bottle, react at 80°C to 90°C for 0.5 hours, add 3.0 g of dicyandiamide and 1.0 g of 2-ethyl-4-methylimidazole latent curing agent at 50°C, and stir evenly Finally, a solvent-free adhesive is obtained, denoted as SLA-3.

[0058] Take 23.0 grams of the above SLA-3 solvent-free adhesive, add 77.0 grams of surface-treated conductive particles A-3, sti...

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Abstract

The invention relates to a high-performance conducting resin, comprising the following components: epoxy, latent curing agent, active toughener and conducting particles. The preparation method comprises the following steps: adding the epoxy and the active toughener in a reaction bulb to react, then adding the latent curing agent, uniformly stirring, adding the surface-treated conducting particles, uniformly stirring, and defoaming in vacuum to obtain the high-performance conducting resin. The conducting resin in characterized in that the bonding strength reaches up to 24.1 MPa; the volume resistivity is 4.30*10<-5>-2.12*10<-4> ohm.cm; the Tonset thermal decomposition temperature reaches up to 398.7 DEG C; the water absorption is only 0.2%; and storage life at the room-temperature is as long as more than 3 months. The invention has the advantages of simple preparation process, low cost, convenient operation and convenient reaction material source, can complete the preparation process in universal devices, is beneficial to realizing industrial production, and has wide application prospects in the fields of electronic components, resonators, relays, electronic capacitors and the like.

Description

technical field [0001] The invention belongs to the field of conductive adhesive and its preparation, in particular to a high-performance conductive adhesive and its preparation method. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: the curing of epoxy resin is mainly It relies on the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/06C09J11/08C09J11/04
Inventor 虞鑫海刘万章
Owner DONGHUA UNIV
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