2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high price, unfavorable large-scale popularization and application, polyetherimide High resin cost and other issues, to achieve the effect of convenient operation, good application prospects, and strong hydrophobicity

Inactive Publication Date: 2013-06-12
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of component A

[0045] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 27.4 g (0.05 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]hexafluoropropane into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 127.4 g of a homogeneous and transparent copolymer, which is designated as A1 .

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 21.9 g (0.04 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]hexafluoropropane into a reaction kettle, heat up to 60°C, and stir for 1 hour to obtain 121.9 g of a homogeneous and transparent copolymer, which is designated as A2 .

[0047] Mix 100 grams of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin (epoxy value 0.85) with 25.8 grams (0.047 moles) of 2,2-bis[4-(2 ,4-diaminophenoxy)phenyl]hexafluoropropane was put into a reaction kettle, heated to 60°C, stirred and reacted for 1....

Embodiment 2

[0051] Preparation of Component B

[0052] At room temperature, 54.8 g (0.1 mole) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 772 g of N,N-dimethylacetamide were added to the reactor , after stirring and dissolving completely, add 52 grams (0.1 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 64.4 grams (0.2 moles) of 3,3' , 4,4'-tetracarboxybenzophenone dianhydride and 21.8 grams (0.1 moles) of pyromellitic dianhydride, stirred for 0.5 hours to obtain 965 grams of homogeneous transparent solution, added 160 grams of toluene, heated to reflux , carry out reflux water separation reaction, the temperature is 130°C, and the reaction time is 2 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is within the range of 15%-30%, which is recorded as B1.

[0053] At room temperature, mix 54.8 grams (0.1 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 350 grams of N,N-dimet...

Embodiment 3

[0056] Preparation of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane type high temperature resistant epoxy adhesive

[0057] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]6 Fluoropropane-type high-temperature-resistant epoxy adhesive is recorded as HTEA-p, where p is a natural number. The specific formula is shown in Table 1.

[0058] Table 12, 2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane type high temperature resistant epoxy adhesive formula unit: g

[0059] Component

[0060] HTEA-3

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Abstract

The invention relates to a 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and a preparation method thereof. The 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesive and its preparation, in particular to a 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane type high temperature resistant epoxy adhesive and its preparation method. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C08G59/50C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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