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Hot-melt pressure-sensitive structural adhesive film and preparation technique thereof

A hot-melt pressure-sensitive adhesive and preparation process technology, applied in the direction of adhesives, film/sheet-like adhesives, etc., can solve the problem of inconvenient initial bonding and positioning, unsuitable for the cleanliness of the operation site, and not pressure-sensitive and other problems, to achieve the effect of low curing shrinkage, high degree of automation, and fast coating speed

Inactive Publication Date: 2011-08-17
CHANGZHOU TABANG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in most cases, the epoxy resin is liquid before it is cured at room temperature, which is easy to cause on-site dripping, and is not suitable for workplaces that have high requirements for the cleanliness of the operation site.
It has been reported that the epoxy resin is made into a film shape, which greatly facilitates the process operation, but it is not pressure-sensitive at room temperature, and it needs to be heated and pressurized before it can be bonded, which is inconvenient for the positioning of the initial bond. effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Preparation of hot melt epoxy film:

[0036] Mix 85 parts (parts by weight, the same below) of bisphenol A epoxy resin from Wuxi Lanxing Resin Factory, 5 parts of dicyandiamide from Ningxia Darong Company, 4 parts of 2-methylimidazole, and 4 parts of carbon black after mixing uniformly. The three-roll mill grinds to make a one-component adhesive, and the prepared adhesive is heated by an electric heating roller on an epoxy film hot-melt coating machine and coated on a high-temperature resistant release paper to form a 0.3mm thick adhesive film. .

[0037] Preparation of hot melt pressure sensitive adhesive:

[0038] First add 30 parts of plasticizer naphthenic oil KN4010 and 2 parts of antioxidant Ciba 168 into a stainless steel kneader for kneading and stirring; after the temperature of the material rises to 80°C, add 50 parts of tackifying resin terpene phenolic resin 803L, and knead for 20 Minutes; after the material temperature rises to 150°C, add 40 parts of ther...

Embodiment 2

[0045] Preparation of hot melt epoxy film:

[0046] After mixing 70 parts of bisphenol A epoxy resin of Wuxi Diaisheng Factory, 4 parts of dicyandiamide of Degussa Company, 3 parts of N-p-chlorophenyl-dimethylurea and 5 parts of white carbon black The one-component adhesive is made by three-roller milling, and the formulated adhesive is coated on the high-temperature-resistant release paper to form a 0.4mm-thick adhesive film on the epoxy film hot-melt coating machine by heating the electric heating roller. .

[0047] Preparation of hot melt pressure sensitive adhesive:

[0048] First add 40 parts of plasticizer naphthenic oil KN4010 and 2 parts of antioxidant Ciba 1076 into a stainless steel kneader for kneading and stirring; when the temperature of the material rises to 80°C, add 60 parts of tackifying resin rosin KF388F and knead for 20 minutes; After the material temperature rises to 150°C, add 40 parts of thermoplastic elastomer SIS 1209 and knead for 20 minutes; raise ...

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Abstract

The invention discloses a hot-melt pressure-sensitive structural adhesive film which is composed of an epoxy adhesive film core material and hot-melt pressure-sensitive adhesive films which are respectively covered on both sides of the epoxy adhesive film core material, wherein the epoxy adhesive film core material is mainly composed of epoxy resin, and the hot-melt pressure-sensitive adhesive films are mainly composed of thermoplastic elastomer. The hot-melt pressure-sensitive structural adhesive film is very convenient to use, has pressure sensitivity at ordinary temperature, can generate a strong bonding function after being cured by heating, and can be directly used for structure bonding or substructure bonding.

Description

technical field [0001] The invention belongs to the technical field of polymer adhesives, and in particular relates to a hot-melt pressure-sensitive structural adhesive and a preparation method thereof. Background technique [0002] Hot-melt pressure-sensitive adhesives are known as the third generation of pressure-sensitive adhesives after solvent-based and emulsion-based pressure-sensitive adhesives. It is an adhesive based on thermoplastic elastomer polymers, which has both hot-melt and pressure-sensitive properties. It is coated in a molten state, and can be quickly bonded by applying light pressure after cooling and solidification. At the same time, it can be easily glued. Peel off without polluting the surface of the adherend. [0003] Compared with traditional solvent-based and emulsion-based pressure-sensitive adhesives, hot-melt pressure-sensitive adhesives mainly have the following advantages: no organic solvents, in line with environmental protection requirements...

Claims

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Application Information

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IPC IPC(8): C08L63/00C09J201/00C09J153/02C08L63/02C09J7/02
Inventor 何敏
Owner CHANGZHOU TABANG NEW MATERIAL TECH
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