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Modified epoxy resin composition, adhesive film and preparation method thereof

An epoxy resin glue, epoxy resin technology, applied in the field of materials, can solve the problems of not meeting the cutting-edge technology field, poor fatigue resistance, poor mechanical properties, etc., to compensate for instability, strengthen thermal shock resistance, performance boosted effect

Inactive Publication Date: 2020-07-10
江门市瑞祥复合材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the current epoxy resins still have excellent properties in one aspect, but cannot meet the more stringent requirements in other aspects, such as epoxy resins with outstanding heat resistance, but their mechanical properties are poor; or they have excellent anti-corrosion properties. Impact performance, but poor fatigue resistance and high temperature resistance; or high temperature resistance, excellent mechanical properties, but cannot meet the special needs of cutting-edge technology fields, such as wave transparency, antibacterial properties, etc.

Method used

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  • Modified epoxy resin composition, adhesive film and preparation method thereof
  • Modified epoxy resin composition, adhesive film and preparation method thereof
  • Modified epoxy resin composition, adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047](1) Preparation of silica sol: Take 30g of ethyl orthosilicate and 30g of ethanol, mix and stir, then add 25mL of deionized water, add hydrochloric acid dropwise to adjust the pH of the reaction system to 3.0, hydrolyze at 35°C for 1h, and then heat up to 50°C ℃, polymerization reaction 2h, prepared SiO2 sol. Take 35g of SiO2 sol, add 30g of trimethoxyphenylsilane and 25g of ethanol, stir, gradually dropwise add 20mL of deionized water, and dropwise add hydrochloric acid to adjust the pH of the reaction system to 3.0, react at a constant temperature of 70°C for 4h, add excess sodium carbonate, and stir Neutralize the reaction system, and when the pH of the system is greater than 7.0, filter the product and distill off water and ethanol under reduced pressure to obtain a silicone copolymer.

[0048] (2) Prepare modified epoxy resin: get 80g of bisphenol A type epoxy resin (molecular weight 4500-6500), add in acetone and dissolve completely, then add 30g acrylate oligomer ...

Embodiment 2

[0053] (1) Preparation of silica sol: Take 30g of ethyl orthosilicate and 30g of ethanol, mix and stir, then add 25mL of deionized water, add hydrochloric acid dropwise to adjust the pH of the reaction system to 3.0, hydrolyze at 35°C for 1h, and then heat up to 50°C ℃, polymerization reaction 2h, prepared SiO2 sol. Take 35g of SiO2 sol, add 30g of trimethoxyphenylsilane and 25g of ethanol, stir, gradually dropwise add 20mL of deionized water, and dropwise add hydrochloric acid to adjust the pH of the reaction system to 3.0, react at a constant temperature of 70°C for 4h, add excess sodium carbonate, and stir Neutralize the reaction system, and when the pH of the system is greater than 7.0, filter the product and distill off water and ethanol under reduced pressure to obtain a silicone copolymer.

[0054] (2) Prepare modified epoxy resin: get 80g of bisphenol A type epoxy resin (molecular weight 4500-6500), add in acetone and dissolve completely, then add 30g acrylate oligomer...

Embodiment 3

[0059] (1) Preparation of silica sol: Take 30g of ethyl orthosilicate and 30g of ethanol, mix and stir, then add 25mL of deionized water, add hydrochloric acid dropwise to adjust the pH of the reaction system to 3.0, hydrolyze at 35°C for 1h, and then heat up to 50°C ℃, polymerization reaction 2h, prepared SiO2 sol. Take 35g of SiO2 sol, add 30g of trimethoxyphenylsilane and 25g of ethanol, stir, gradually dropwise add 20mL of deionized water, and dropwise add hydrochloric acid to adjust the pH of the reaction system to 3.0, react at a constant temperature of 70°C for 4h, add excess sodium carbonate, and stir Neutralize the reaction system, and when the pH of the system is greater than 7.0, filter the product and distill off water and ethanol under reduced pressure to obtain a silicone copolymer.

[0060] (2) Prepare modified epoxy resin: get 80g of bisphenol A type epoxy resin (molecular weight 4500-6500), add in acetone and dissolve completely, then add 30g acrylate oligomer...

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Abstract

The invention belongs to the field of materials, and discloses modified epoxy resin, which is mainly obtained by jointly modifying epoxy resin with an organic silicon copolymer and an acrylate oligomer. The organic silicon copolymer is obtained by polymerizing SiO2 and an organic silicon monomer, and the organic silicon monomer is silane containing phenyl and alkoxy; and the molecular weight of the acrylate oligomer is 1000-10000. The invention also discloses a modified epoxy resin composition, which comprises the modified epoxy resin, a modified liquid nitrile butadiene rubber flexibilizer, asingle-walled carbon nanotube and zirconium phosphate. The adhesive film prepared from the modified epoxy resin composition has excellent weather resistance, mechanical properties and good wave permeability, and can be used in the field of stealth technology or radio. Meanwhile, the modified epoxy resin composition also has remarkable antibacterial and bacteriostatic performance and is not proneto being polluted by microorganisms in the production process, and the prepared epoxy resin adhesive film has antibacterial performance and can be used in severe environments.

Description

technical field [0001] The invention belongs to the field of materials, in particular to a modified epoxy resin composition, an adhesive film and a preparation method thereof. Background technique [0002] Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in their molecules. Because their molecular structures contain hydroxyl groups, ether bonds and active polar groups of epoxy resins, they have high Cohesion, can cross-link with various types of curing agents and form a three-dimensional network structure. Epoxy resin has the advantages of good mechanical properties, water resistance, solvent resistance and low curing shrinkage, and is widely used in adhesives, coatings and other fields. [0003] With the continuous research on epoxy resin, various epoxy resins with high temperature resistance, impact resistance or good storage stability have come out one after another, expanding the application field of epoxy resin. However, mo...

Claims

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Application Information

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IPC IPC(8): C08G77/42C09D183/10C09D113/00C09D5/14C09D7/61
CPCC08G77/42C08K2003/328C09D5/14C09D183/10C09D7/61C08L13/00C08K3/36C08K3/041C08K3/32
Inventor 吴德山张瑞祥张至祥黄伟强裴明霞李滨
Owner 江门市瑞祥复合材料研究院有限公司
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