Heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of unsuitable structural parts, fatigue resistance of adhesive parts, and limited application, etc., and achieve high practical value, Improved thermal stability and flame retardancy, and easy handling

Inactive Publication Date: 2013-04-24
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the rapid development of industry, in some special industries, the thermal performance and flame retardancy of epoxy res

Method used

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  • Heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and preparation method thereof
  • Heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and preparation method thereof
  • Heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Preparation of terpolymer of bromophenylmaleimide / styrene / glycidyl methacrylate

[0028] The mass composition is 25 grams of 2,4,6-tribromosubstituted phenylmaleimide, 60 grams of styrene, 15 grams of glycidyl methacrylate and 1,41 g of azobisisobutyronitrile dissolved in 500ml of 4-dioxane (the same below) is added to a reactor equipped with a stirrer, a thermometer and a nitrogen device, and the whole process is protected by nitrogen. A super constant temperature water bath was used to react at 70°C for 7 hours. After the reaction was completed, the reaction kettle was placed in an ice-water bath to terminate the reaction, and then the mixed solution was poured into a large amount of methanol, filtered with suction, and then used The oxane was dissolved and dispersed in methanol twice to remove unreacted monomers and oligomers, and dried in a vacuum oven at 60°C for 24 hours, and the obtained white powder was the target product.

[0029] (2) Preparation of heat-...

Embodiment 2

[0032] (1) Preparation of terpolymer of bromophenylmaleimide / styrene / glycidyl methacrylate

[0033] The mass composition is 30 grams of 2,5,6-tribromosubstituted phenylmaleimide, 40 grams of styrene, 30 grams of glycidyl methacrylate and 1,4- Dioxane was added into a reactor equipped with a stirrer, a thermometer and a nitrogen device, and the whole process was protected by nitrogen. A super constant temperature water bath was used to react at 75°C for 6.5 hours. After the reaction was completed, the reaction kettle was placed in an ice-water bath to terminate the reaction, and then the mixture was poured into a large amount of methanol, filtered with suction, and then 1,4-bis The oxane was dissolved and dispersed in methanol twice to remove unreacted monomers and oligomers, and dried in a vacuum oven at 60°C for 24 hours, and the obtained white powder was the target product.

[0034] (2) Preparation of heat-resistant, flame-retardant, and brittle-cracking-resistant modified ...

Embodiment 3

[0037](1) Preparation of terpolymer of bromophenylmaleimide / styrene / glycidyl methacrylate

[0038] The mass composition is 45 grams of 3,4-difluoro-2,5,6-tribromosubstituted phenylmaleimide, 30 grams of styrene, 25 grams of glycidyl methacrylate and dissolved azobisiso The 1,4-dioxane of butyronitrile is added to a reactor equipped with a stirrer, a thermometer and a nitrogen device, and the whole process is protected by nitrogen. Use a super constant temperature water bath to react at 80 °C for 6 hours. After the reaction is completed, place the reaction kettle in an ice-water bath to terminate the reaction, then pour the mixed solution into a large amount of methanol, filter it with suction, and then use 1,4-bis The oxane was dissolved and dispersed in methanol twice to remove unreacted monomers and oligomers, and dried in a vacuum oven at 60°C for 24 hours, and the obtained white powder was the target product.

[0039] (2) Preparation of heat-resistant, flame-retardant, an...

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Abstract

The invention belongs to the technical field of epoxy resin adhesives, and particularly relates to a heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and a preparation method thereof. The adhesive is prepared from the substances in parts by weight as follows: 50-60 parts of low-viscosity bisphenol A type epoxy resin, 25-30 parts of bromo-phenyl maleimide/styrene/glycidyl methacrylate terpolymer, 15-30 parts of a curing agent, 2-8 parts of a nuclear shell type rubber toughening agent, 26-29 parts of a diluting agent and 3-7 parts of a curing accelerator. The heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive improves heat stability and flame resistance thereof efficiently, reduces brittleness of cured products, has a simple process, low cost and convenience in operation, can finish the preparation process thereof in a universal device and has a very high practical value for the development of the adhesive industry, and has a wide application foreground in the fields such as electronics, microelectronics and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin adhesives, and in particular relates to a heat-resistant, flame-retardant, and anti-brittle cracking-resistant modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Bisphenol A epoxy resin is an important thermosetting resin, which contains unique epoxy groups, hydroxyl groups, ether bonds and other active groups and polar groups, so it shows many excellent properties. Such as: good mechanical properties, excellent bonding performance, small curing shrinkage, good manufacturability, electrical properties, stability, high heat resistance, excellent comprehensiveness, etc., can be used as coatings, adhesives, composite resin matrix and electronics Packaging materials are widely used in machinery, aviation, aerospace, electronics, electrical appliances, chemicals, transportation, construction and other fields, and play an extremely important role in the dev...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/08C08F212/08C08F222/40C08F220/32
Inventor 刘国际李延勋徐丽刘伟雒廷亮
Owner ZHENGZHOU UNIV
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