Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition

A polyimide resin and polyimide chain technology, applied in the direction of epoxy resin glue, adhesive additive, adhesive, etc., can solve the problem of dielectric properties and ion migration resistance, low dielectric properties , Ion migration resistance, poor flame retardancy, chemical resistance and heat aging resistance, etc., to achieve excellent room temperature storage, aging resistance, outstanding dielectric properties, and good processability
CN103483586AActive Publication Date: 2014-01-01GUANGDONG SHENGYI SCI TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUANGDONG SHENGYI SCI TECH
Publication Date
2014-01-01

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Abstract

The invention provides modified polyimide resin. A molecular structure of the modified polyimide resin comprises the repeated units of the following chain segments: polysiloxane polyimide chain segments, cycloaliphatic polyimide chain segments and aromatic polyimide chain segments, wherein the molar contents of the polysiloxane polyimide chain segments, the cycloaliphatic polyimide chain segments and the aromatic polyimide chain segments in a chemical formula of the modified polyimide resin are 20-40%, 20-50% and 30-60% respectively. The modified polyimide resin can be used as a toughening agent of an epoxy resin adhesive and is more excellent in characteristics such as higher thermal ageing resistance, higher glass-transition temperature and the like in comparison with a buna-n rubber toughened epoxy adhesive agent.
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Description

technical field

[0001] The present invention relates to the technical field of adhesives, in particular to a modified polyimide resin, an adhesive composition containing the modified polyimide resin, and a cover film containing the adhesive composition. Background technique

[0002] With the rapid development of the electronic field, especially the communication and consumer electronic devices are increasingly miniaturized and thinned, and the requirements for flexible circuits (FPC) are also getting higher and higher. At present, the most common manufacturing method of flexible printed circuit board (FPC) is to form a flexible copper clad laminate (FCCL) into a circuit, and then set a cover film (Coverlay) on the circuit. The cover film as a protective material not only has the function of protecting the circuit, but also can improve the flex resistance and foldability of the flexible wiring board.

[0003] In recent years, with the complexity of large-scale integrated cir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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