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Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition

A polyimide resin and polyimide chain technology, applied in the direction of epoxy resin glue, adhesive additive, adhesive, etc., can solve the problem of dielectric properties and ion migration resistance, low dielectric properties , Ion migration resistance, poor flame retardancy, chemical resistance and heat aging resistance, etc., to achieve excellent room temperature storage, aging resistance, outstanding dielectric properties, and good processability

Active Publication Date: 2014-01-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Chinese patent document CN101314705A discloses an adhesive containing epoxy resin with a highly flame-retardant skeleton as the main component. The adhesive exhibits excellent flame retardancy and ion migration resistance, etc., but the adhesive formula still contains Contains a nitrile rubber component to toughen the epoxy, still has poor chemical and thermal aging resistance
Chinese patent document CN101914357A developed an epoxy silicone adhesive, which has low water absorption and good heat resistance, but the dielectric properties and ion migration resistance did not show advantages
Chinese patent document CN101747854A provides an adhesive composition with epoxy-terminated polyphenylene ether as the key component, which has excellent low dielectric properties, ion migration resistance, and flame retardancy, but the adhesive’s The glass transition temperature exceeds 200°C, so that the cover film prepared with it requires a higher pressing temperature to soften the adhesive layer and press it well with the circuit. At present, the common pressing temperature in the FPC manufacturing process is below 200°C , so the processability of the cover film is poor

Method used

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  • Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition
  • Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition
  • Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition

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preparation example Construction

[0032] 1. Preparation of the modified polyimide resin

[0033] The raw materials used for the synthesis of the modified polyimide resin of the present invention and a brief expression are described as follows:

[0034] KF-8010: Silicone diamine monomer (manufactured by Shin-Etsu Chemical Co., Ltd., amino group equivalent: 450 g / mol)

[0035] X-2290: Silicone dianhydride monomer (manufactured by Shin-Etsu Chemical Co., Ltd., acid anhydride equivalent: 500 g / mol)

[0036] DACH: 1,4-cyclohexanediamine (molecular weight 114)

[0037] DDCM: 4,4'-Methylenebiscyclohexylamine (210)

[0038] CHDA: cyclohexane-1,2,4,5-tetraacid dianhydride (224)

[0039] CBDA: Cyclobutane-1,2,3,4-Tetraacid Dianhydride (196)

[0040] ODA: 4,4'-diaminodiphenyl ether (200)

[0041] BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride (294)

Embodiment 1

[0043] A modified polyimide resin containing repeating units of a polysiloxane polyimide segment, an alicyclic polyimide segment and an aromatic polyimide segment in its molecular structure; and The molar ratio of the siloxane polyimide segment, the alicyclic polyimide segment and the aromatic polyimide segment in the chemical formula of the modified polyimide resin is 3:2:5.

[0044] Its preparation method is as follows:

[0045] In the reactor equipped with temperature control device, stirring device, reflux device and dehydration device, add 90Kg toluene and cyclohexanone weight ratio of 1:1 mixed solution, add liquid KF-801018Kg (20mol) and X-229010Kg (10mol) and stir until completely dissolved, add BPDA8.82Kg (30mol) and CHDA2.24Kg (10mol) under stirring, slowly add DACH1.14Kg (10mol) and ODA4Kg (20mol) after the system is evenly dispersed, and heat the reaction kettle to 80°C and continue stirring for 24 hours to generate a polyamic acid solution, then add 50Kg of a mix...

Embodiment 2

[0047] A modified polyimide resin containing repeating units of a polysiloxane polyimide segment, an alicyclic polyimide segment and an aromatic polyimide segment in its molecular structure; and The molar ratio of the siloxane polyimide segment, the alicyclic polyimide segment and the aromatic polyimide segment in the chemical formula of the modified polyimide resin is 4:3:3.

[0048] Its preparation method is as follows:

[0049] In the reactor equipped with temperature control device, stirring device, reflux device and dehydration device, add 110Kg mixed solution of ethylene glycol methyl ether and xylene with a weight ratio of 1:1, add liquid KF-801018Kg (20mol) and Liquid X-229020Kg (20mol) and stir until completely dissolved, add BPDA2.94Kg (10mol) and CHDA4.48Kg (20mol) under stirring, and slowly add DDCM2.1Kg (10mol) and ODA4Kg (20mol) after the system is uniformly dispersed , the reactor was heated to 80°C and stirred continuously for 24 hours to generate polyamic aci...

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Abstract

The invention provides modified polyimide resin. A molecular structure of the modified polyimide resin comprises the repeated units of the following chain segments: polysiloxane polyimide chain segments, cycloaliphatic polyimide chain segments and aromatic polyimide chain segments, wherein the molar contents of the polysiloxane polyimide chain segments, the cycloaliphatic polyimide chain segments and the aromatic polyimide chain segments in a chemical formula of the modified polyimide resin are 20-40%, 20-50% and 30-60% respectively. The modified polyimide resin can be used as a toughening agent of an epoxy resin adhesive and is more excellent in characteristics such as higher thermal ageing resistance, higher glass-transition temperature and the like in comparison with a buna-n rubber toughened epoxy adhesive agent.

Description

technical field [0001] The present invention relates to the technical field of adhesives, in particular to a modified polyimide resin, an adhesive composition containing the modified polyimide resin, and a cover film containing the adhesive composition. Background technique [0002] With the rapid development of the electronic field, especially the communication and consumer electronic devices are increasingly miniaturized and thinned, and the requirements for flexible circuits (FPC) are also getting higher and higher. At present, the most common manufacturing method of flexible printed circuit board (FPC) is to form a flexible copper clad laminate (FCCL) into a circuit, and then set a cover film (Coverlay) on the circuit. The cover film as a protective material not only has the function of protecting the circuit, but also can improve the flex resistance and foldability of the flexible wiring board. [0003] In recent years, with the complexity of large-scale integrated cir...

Claims

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Application Information

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IPC IPC(8): C08G73/10C09J179/04C09J163/02C09J163/00C09J11/04C09J11/06C09J11/08C09J7/02
Inventor 周韶鸿茹敬宏刘生鹏
Owner GUANGDONG SHENGYI SCI TECH
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