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High-frequency glue and high-frequency flexible copper-clad laminate applying high-frequency glue

A flexible copper-clad laminate and high-frequency technology, which is applied in the field of copper-clad laminate preparation, can solve problems such as the inability to obtain processing technology, and achieve the effects of low cost, low dielectric loss, and low dielectric constant

Inactive Publication Date: 2020-04-10
SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are Kuraray, Murata, Denka and KGK that can mass-produce LCP films, all of which are concentrated in Japan, and this material and processing technology cannot be obtained in China

Method used

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  • High-frequency glue and high-frequency flexible copper-clad laminate applying high-frequency glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A

[0028] A high-frequency glue consisting of the following components by mass fraction: 100g of DCPD-modified epoxy resin from Japan DIC 7200H, 200g of DCPD-modified benzo resin from Taiwan Jinlong Chemical, Japan KI Chemical BMI-70 20g of BMI resin, 80g of SMA anhydride curing agent from Greville EF40 in the United States, 40g of low-dielectric phosphazene flame retardant from Fushimi Pharmaceutical PF-300B in Japan, 60g of low-dielectric rubber toughening agent from JSR-906 in Japan, and Sinopec’s Butanone solvent 400g.

[0029] Weigh the raw materials according to the mass fraction of the above formula, put them into a stirring tank, and stir at a temperature of 50°C at a speed of 300rpm for 2 hours; Frequency glue A.

Embodiment B

[0031] A kind of high-frequency glue, is made up of the component of following mass fraction: the trifunctional epoxy resin 150g of Japan Mitsubishi 1031H60, the polyphenylene ether resin (PPO) 150g of American Sabic 9000, the BMI resin 20g of Japan KI chemical industry BMI-70, 80g of SMA anhydride curing agent from Greville EF40 in the United States, 40g of low-dielectric phosphazene flame retardant from Fushimi Pharmaceutical PF-300B in Japan, 60g of low-dielectric rubber toughening agent from Japan JSR-906, and 400g of butanone solvent from Sinopec .

[0032] Weigh the raw materials according to the mass fraction of the above formula, put them into a stirring tank, and stir at a temperature of 50°C at a speed of 300rpm for 2 hours; Frequency glue B.

Embodiment 1

[0034] Take the high-frequency glue A and apply it on the PTFE film, and bake it at 120°C for 30 minutes; then cover the copper foil on the side of the PTFE film coated with the high-frequency glue, and press it at 180°C for one hour; finally, the hot-pressed PTFE The film was cured in an oven at 200° C. for 2 hours to obtain a single-sided high-frequency substrate 1 .

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Abstract

The invention provides a high-frequency glue and a high-frequency flexible copper-clad laminate applying the high-frequency glue, and mainly relates to the field of copper-clad laminate preparation. The high-frequency glue is prepared from the following components in parts by mass: 10-15 parts of an epoxy resin, 10-30 parts of a DCPD modified benzo resin or 8-18 parts of a polyphenylene oxide resin (PPO), 2-8 parts of a BMI resin, 5-10 parts of an SMA anhydride curing agent, 2-8 parts of a low-dielectric phosphazene flame retardant, 5-10 parts of a low-dielectric rubber toughening agent and 25-45 parts of butanone. The high-frequency flexible copper-clad laminate is bonded by using the high-frequency glue. According to the invention, by preparing the high-frequency glue, the AiP antenna material with low dielectric constant, low dielectric loss and low water absorption is obtained by applying the high-frequency glue to a copper-clad laminate so as to provide the hardware support for application of 5G technology.

Description

technical field [0001] The invention mainly relates to the field of copper-clad laminate preparation, in particular to a high-frequency glue and a high-frequency flexible copper-clad laminate using the high-frequency glue. Background technique [0002] 2019 is the first year of 5G commercial use. Compared with the fourth-generation (4G) network, its fifth-generation wireless network and technology have made great leaps in terms of data transmission speed, capacity, and data transmission delay. But as consumers, they actually pay more attention to 5G terminal applications. The realization of the 5G era is inseparable from the upgrade of the internal materials of the mobile phone. The mobile phone antenna is also an important part. Among them, the FPC antenna wiring has high density, light weight, and thin thickness, which can significantly reduce the size of the hardware. Nowadays, whether it is only a mobile phone or a computer are widely used. [0003] FPC is a highly rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J163/00C09J171/12C09J179/08B32B7/12B32B15/08B32B15/085B32B15/20B32B27/06B32B27/28B32B27/32
CPCB32B7/12B32B15/08B32B15/085B32B15/20B32B27/06B32B27/286B32B27/322B32B2457/08C08L2203/20C08L2205/035C09J163/00C09J171/12C09J201/00C08L63/00C08L79/08C08L71/12
Inventor 郭品玺张波高玉华叶启思
Owner SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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