High-toughness photosensitive epoxy acrylic resin composition capable of developing in weakly basic water and preparation method of epoxy acrylic resin composition

A technology of epoxy acrylic and resin composition, which is applied in the direction of photosensitive materials for photomechanical equipment, photomechanical equipment, photoplate making process of patterned surface, etc., which can solve the problems of high product cost, poor dispersion and heat resistance. Poor property and alkali resistance, etc., to achieve the effect of electrical insulation balance, enhanced toughness, and high adhesion

Active Publication Date: 2017-12-08
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
View PDF10 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disclose a kind of end group as the photosensitive resin composition that the alkane of oxetane is used as curing agent in CN1420998A number of Japanese sun ink, this composition has higher storage stability higher and better toughness, but resistance Heat resistance and alkali resistance are not good; No. Sun Ink CN 1461318A discloses a kind of novolac novolac light-curing-heat-curing composition through alkylene oxide chain extension, and the composi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-toughness photosensitive epoxy acrylic resin composition capable of developing in weakly basic water and preparation method of epoxy acrylic resin composition
  • High-toughness photosensitive epoxy acrylic resin composition capable of developing in weakly basic water and preparation method of epoxy acrylic resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Preparation of alkali-soluble epoxy acrylic resin

[0029] Under a nitrogen atmosphere, add 0.27 mol of tetrahydrophthalic anhydride, 0.0046 mol of pyridine, and 0.0007 mol of hydroquinone monomethyl ether to 100 parts of epoxy acrylic resin, heat the mixture to 90°C, react for 6 hours and then cool to obtain a solid content of 67 wt. %, acid value 90mgKOH / g alkali-soluble epoxy acrylic resin, denoted as A-1.

[0030] (2) Preparation of photosensitive epoxy acrylic resin composition glue

[0031] Add to 100 parts of alkali-soluble epoxy acrylic resin

[0032] 0.08 part tetrahydrofuran acrylate;

[0033] 26 parts of multifunctional acrylate monomers, which include tripropylene glycol diacrylate, ethoxylated trimethylolpropane triacrylate, and 1,6-hexanediol diacrylate, and the mass ratio of the three is 2: 3:3;

[0034] 1 part of photoinitiator, including photopolymerization initiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-acetone-1, 0.994 parts, photosen...

Embodiment 2

[0039] (1) Alkali-soluble epoxy acrylic resin adopts resin A-1 synthesized in embodiment 1;

[0040] (2) Preparation of photosensitive epoxy acrylic resin composition glue:

[0041] Add to 100 parts of alkali-soluble epoxy acrylic resin

[0042] 8 parts tetrahydrofuran acrylate;

[0043] 26 parts of multifunctional acrylate monomers, including tripropylene glycol diacrylate, ethoxylated trimethylolpropane triacrylate, and 1,6-hexanediol diacrylate, the mass ratio of the three monomers is 2 :3:3;

[0044]1 part of photoinitiator, including photopolymerization initiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-acetone-1, 0.0993 parts, photosensitizer 2-isopropyl 0.0007 part of thioxanthone, the weight ratio of the two is 150:1;

[0045] 30 parts bisphenol A epoxy resin;

[0046] 20 parts of nano core-shell rubber toughened resin;

[0047] Stir at room temperature to promote its dissolution, filter to obtain the glue solution of the photosensitive epoxy acrylic resin ...

Embodiment 3

[0049] (1) Alkali-soluble epoxy acrylic resin adopts resin A-1 synthesized in embodiment 1;

[0050] (2) Preparation of photosensitive epoxy acrylic resin composition glue:

[0051] Add to 100 parts of alkali-soluble epoxy acrylic resin

[0052] 0.08 part tetrahydrofuran acrylate;

[0053] 26 parts of multifunctional acrylate monomers, including tripropylene glycol diacrylate, ethoxylated trimethylolpropane triacrylate, 1,6-hexanediol diacrylate, the mass ratio of the three is 2:3 :3;

[0054] 1 part of photoinitiator, including photopolymerization initiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-acetone-1, 0.0995 parts, photosensitizer 2-isopropyl 0.0005 part of thioxanthone, the weight ratio of the two is 200:1;

[0055] 30 parts bisphenol A epoxy resin;

[0056] 20 parts of nano core-shell rubber toughened resin;

[0057] Stir at room temperature to promote its dissolution, filter to obtain the glue solution of the photosensitive epoxy acrylic resin compositio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Acid valueaaaaaaaaaa
Acid valueaaaaaaaaaa
Login to view more

Abstract

The invention discloses a high-toughness photosensitive epoxy acrylic resin composition capable of developing in weakly basic water. The composition is prepared by the following steps: adding 0.08-8 weight parts of acrylic monomers with oxygen heterocycles, 20-70 parts by weight of polyfunctionality acrylic monomers, 0.1-10 parts by weight of a photoinitiator, 20-60 parts by weight of a thermal curing agent and 5-20 parts by weight of a nano core-shell rubber toughening resin into 100 parts by weight of an alkaline-soluble epoxy acrylic resin with an acid value of 40-200mg of KOH/g, stirring, dissolving, filtering, thereby obtaining the high-toughness photosensitive epoxy acrylic resin composition. The composition has excellent soldering heat resistance, acid and alkali resistance and solvent resistance after curing and has high adhesive force and high bending resistance.

Description

technical field [0001] The invention relates to a resin composition applied to a flexible printed circuit board (FPC), in particular to a photosensitive epoxy acrylic resin composition which has high toughness and can be developed with weak alkaline water and a preparation method thereof. Background technique [0002] In recent years, the demand for miniaturization and thinning of information equipment terminals such as smartphones and tablet computers has become higher and higher, and circuit boards need to be denser and space-saving. This requires expanding the use of flexible printed circuit boards. Also make it more reliable. [0003] At present, the traditional method of making flexible printed circuit boards is to first open a window on the polyimide film, then bond it, and finally apply photosensitive ink, exposure and development. Above-mentioned process step is various, and yield rate is low. For this reason, scientific research workers have researched and develop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/004G03F7/027
Inventor 林晓英童荣柏李春锐周光大林建华周慧
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap