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High-temperature resistant copper foil glue and preparation and application thereof

A technology of high temperature resistance and copper foil adhesive, which is applied in the field of organic polymer adhesives and its preparation and application, and can solve the problems of limited heat resistance improvement, limited reactive groups, and low content of adhesive systems , to achieve the effects of good viscosity controllability, industrialized production, and excellent bonding performance

Inactive Publication Date: 2010-06-02
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also some disadvantages: (1) Reactive groups are limited, especially the content of unsaturated double bonds is low
Because maleic anhydride is used as an end-capping agent, the amount of maleic anhydride is very small; (2) the content of polyetherimide resin (HPEI) in the system is low (≤10%), resulting in Limited improvement in thermal resistance of

Method used

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  • High-temperature resistant copper foil glue and preparation and application thereof
  • High-temperature resistant copper foil glue and preparation and application thereof
  • High-temperature resistant copper foil glue and preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Mix 5.0 g of activated vinyl polyetherimide (AEPEI) powder, 15.0 g of 1,3-bis(4-maleimido-2-trifluoromethylphenoxy)benzene, 10.0 g of N, N,N',N'-tetraglycidyl-3,3'-dimethyl-4,4'-diaminodiphenylmethane and 40.0 grams of ES-216 bisphenol A epoxy resin were added to the reaction kettle, After reacting at 90℃~120℃ for 30min-90min, cool to 40℃, add 25.0 grams of N,N-dimethylacetamide organic solvent, stir until completely dissolved, add 5.0 grams of dicyandiamide curing agent, stir evenly, A homogeneous transparent and clear high temperature resistant copper foil adhesive was obtained, which was recorded as CFA-1.

[0036] Take an appropriate amount of CFA-1 high temperature resistant copper foil adhesive and evenly apply it on the surface of thick copper test piece or phenolic hydroxyl polyimide film to prepare copper-adhesive-copper and copper-adhesive-phenolic hydroxyl polyimide film The sample is cured: heat from room temperature to 100 °C, hold for 1 h, continue to hea...

Embodiment 2

[0039] 15.0 g of activated vinyl polyetherimide (AEPEI) powder, 5.0 g of 2,2-bis[4-(4-maleimido-2-trifluoromethylphenoxy)phenyl] Propane, 20.0 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl ether, 5.0 g of E-51 and 5.0 g of ES-216 bisphenol A epoxy resin were added to the reaction In the kettle, react at 90℃~120℃ for 30min-90min, cool to 40℃, add 35.0g N,N-dimethylformamide and 10.0g methylene chloride organic solvent, stir until completely dissolved, add 3.0g 4,4'-diaminodiphenylsulfone and 2.0 g of 1,4-bis(2,6-diamino-4-trifluoromethylphenoxy)benzene curing agent, stir well to obtain a homogeneous transparent and clear resistant High temperature copper foil adhesive, recorded as CFA-2.

[0040] Take an appropriate amount of CFA-2 high temperature resistant copper foil adhesive and evenly apply it on the surface of thick copper test piece or phenolic hydroxyl polyimide film to prepare copper-adhesive-copper and copper-adhesive-phenolic hydroxyl polyimide film The sample ...

Embodiment 3

[0043]8.0 g of activated vinyl polyetherimide (AEPEI) powder, 3.0 g of 4,4'-bis(4-maleimido-2-trifluoromethylphenoxy) biphenyl and 8.0 g of 1,3-Bis(4-maleimido-2-trifluoromethylphenoxy)benzene, 10.0 g N,N,N',N'-tetraglycidyl-3,3'-di Methyl-4,4'-diaminodiphenylmethane, 20.0 g N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl ether, 5.0 g E-44 and 6.0 g ES-216 bisphenol A epoxy resin was added to the reaction kettle, reacted at 90℃~120℃ for 30min-90min, cooled to 40℃, added 30.0g N,N-dimethylacetamide organic solvent, stirred until complete After dissolving, add 5.0 grams of 2-ethyl-4-methylimidazole and 5.0 grams of dicyandiamide curing agent, stir evenly, and obtain a homogeneous transparent and clear high temperature copper foil adhesive, which is recorded as CFA-3.

[0044] Take an appropriate amount of CFA-3 high temperature resistant copper foil adhesive and evenly apply it on the surface of thick copper test piece or phenolic hydroxyl polyimide film to prepare copper-adhesive...

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Abstract

The invention relates to high-temperature resistant copper foil glue containing the following components: 5-15wt percent of trifluoromethyl-contained maleimide resin, 10-30wt percent of polyfunctional ethoxyline resin, 10-40wt percent of bisphenol A epoxy resin, 5-15wt percent of ethylene-contained polyetherimide, 5-10wt percent of curing agent and 25-45wt percent of organic solvent; the preparation comprises the following steps of: adding the trifluoromethyl-contained maleimide resin and the ethylene-contained polyetherimide to the mixture of the polyfunctional ethoxyline resin and the bisphenol A epoxy resin, stirring while heating for reacting, and then cooling to 30-50 DEG C; adding the organic solvent and the curing agent; evenly stirring to obtain the high-temperature resistant copper foil glue the homogeneous phase of which is transparent and clear. The high-temperature resistant copper foil glue has Tonset temperature reaching up to 415 DEG C and excellent comprehensive performance, can be applied to the high-tech fields of electronics and microelectronics, automobiles, electrical machines, aerospace and the like; moreover, the invention has simple preparation process, low cost, convenient operation and available reaction raw materials, thereby being beneficial to realizing industrial production.

Description

technical field [0001] The invention belongs to the field of organic polymer adhesive and its preparation and application, in particular to a high temperature resistant copper foil adhesive and its preparation and application. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding properties: high bonding strength and wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non- The bonding strength of metal materials (such as glass, ceramics, wood, plastic, etc.) is very high, and some even exceed the strength of the material to be bonded, so it can be used in many stress-bearing structural parts and is the main component of structural adhesives One of them; (2) Good processing performance: the flexibility of epoxy resin formulation, processing technology and product performance diversity are the most prominent among polymer materials; (3) Good stability: the cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J179/08H05K3/38
Inventor 虞鑫海徐永芬赵炯心
Owner DONGHUA UNIV
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