31 results about "Copper test" patented technology

The invention discloses a method for forming an amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on a copper surface, which comprises the following steps of: polishing pure copper step by step by metallographical sand paper from No.1 to No.6, degreasing with absolute ethyl alcohol and cleaning with deionized water for later use; processing a copper test specimen by using aqueous solution of amino acid to obtain the copper test specimen modified by the amino acid; and assembling fluorescent reagent onto the surface of the copper test specimen indirectly under the electrostatic attraction action between 1-naphthylamine sodium diacetate (NADA) serving as the fluorescent reagent and the amino acid to prepare a dual-layer photosensitive corrosion inhibition self-assembly corrosion inhibition functional membrane, and characterizing the fluorescent characteristics and corrosion inhibition effect of the membrane respectively by adopting fluorescence spectra and an electrochemic impedance method. Researches show that in the corrosion inhibition functional membrane with the fluorescent characteristics, the relevance exists between fluorescence intensity and corrosion inhibition performance, and the corrosion inhibition characteristics of the assembly membrane are subjected to on-line detection and real-time monitoring through a fluorescence signal,so the method has great significance for promoting the application of the amino acid self-assembly membrane.

Described herein are antimicrobial articles having improved antimicrobial efficacy and antireflective properties. Further described are methods of making and using the improved articles. The antimicrobial articles generally include an antimicrobial element and an antireflective element. The antireflective element, in some cases, can be disposed directly on a glass, glass-ceramic or ceramic substrate and the antimicrobial element is disposed on the antireflective element. The article can exhibit a reflectance of about 4% or less (and less than 1% in some cases) in the range of about 425 nm to about 725 nm. Further, the article can be characterized with an antimicrobial efficacy by exhibiting at least a 2 log reduction in a concentration of at least Staphylococcus aureus, Enterobacter aerogenes, and Pseudomonas aeruginosa bacteria under a Modified EPA Copper Test Protocol.

The invention discloses a dynamic simulation experiment device for a circulating cooling water system and a running method thereof. A cooling water draining valve and a supplemental water feeding valve are arranged on one side of a tank body of a circulating water tank; a fixing hole is formed on the circulating water tank between the cooling water draining valve and the supplemental water feedingvalve; a heating rod and a thermocouple are arranged in the fixing hole; the heating rod and the thermocouple are respectively connected with an external temperature controller through wires; a carbon steel test block and a red copper test block are respectively fixed on the two sides of the middle part on the upper part of the circulating water tank; air distributors are respectively arranged onthe lower parts of the carbon steel test block and the red copper test block; the air distributors are connected with an external air blower; a circulating water pump is arranged on the bottom of thecirculating water tank; the circulating water pump is connected with a circulating water meter fixed on the circulating water tank; water distributors on the upper ends of the carbon steel test blockand the red copper test block are respectively connected with the circulating water meter through water pipes. The dynamic simulation experiment device disclosed by the invention is high in degree ofautomation of equipment, can be conveniently controlled and operated and can be used for researching the problems related to equipment corrosion and scaling of the circulating cooling water system.

The invention discloses a method for calibrating a Rockwell hardness tester. The method comprises the following steps: (1) taking a cylindrical pure copper test block, and grinding the upper and lower surfaces of pure copper to smoothness and flatness; (2) cleaning the top surface of a screw rod and the upper and lower end surfaces of a workbench; (3) putting the workbench on a screw rod table; (4) putting the pure copper test block horizontally on the workbench, rotating a hand wheel, so that the workbench slowly rises and extrudes a pressure head, and stopping applying force to the hand wheel when a small pointer in an indicator panel points at a red point. According to the method disclosed by the invention, the pure copper test block is prepared, the hardness values of multiple measurement points on the pure copper test block are measured by the Rockwell hardness tester, and the average value of the hardness values is calculated; the average value is compared with a standard hardness value of the pure copper to obtain an indication error; during calculating the average value, the measurement error is effectively avoided by removing the maximum value and the minimum value, thus the calibration is more accurate; the method disclosed by the invention is easy to operate and has high precision.

The invention relates to a printed circuit board hole copper abnormity monitoring method, which comprises the following steps: S1, manufacturing a test board, including S1.1, selecting raw materials;S1.2, manufacturing copper testing PADs, namely, manufacturing a plurality of copper testing PADs on a circuit board as surface copper testing points, and enabling the plurality of surface copper testing points to be distributed in a square array shape; and S1.3, manufacturing through holes, namely, drilling a plurality of through holes with different sizes in the circuit board, and enabling the through holes with the same size to be arranged in the same row or the same column; and S2, carrying out a testing method, including S2.1, placing the test board and a normal board together, and conducting copper deposition, electroplating and board baking according to normal steps; S2.2, testing through hole resistance and surface copper data, namely, measuring the through hole resistance by usinga universal meter, and measuring the surface copper data by using the copper measuring PADs; and S2.3, performing screening and analysis, namely, screening out normal holes and abnormal holes according to test results in the step S3, observing the deep plating capacity in the normal holes by slicing the normal holes, and judging the cause of abnormality by slicing the abnormal holes and combiningsurface copper data. According to the invention, the problem of electroplating hole copper can be periodically and diversely monitored.

The invention provides a test device and a corresponding test method for simulating corrosion of a hollow copper conductor of a generator in inner cooling water. The provided test device is characterized by comprising a kettle body, a kettle lid closely covering the kettle body, a wide-mouth glass bottle arranged in the kettle body and used for accommodating demineralized water, a gas inlet part, a gas outlet part, a test piece suspending part and a temperature control part, wherein the gas inlet part comprises a short gas inlet pipe arranged on the kettle lid and a soft polyethylene extending pipe, the upper end of the soft polyethylene extending pipe is connected with a bottom outlet of the short gas inlet pipe, and the lower end of the soft polyethylene extending pipe extends into the wide-mouth glass bottle; the gas outlet part is arranged on the kettle lid and used for exhausting gas; the test piece suspending part comprises a mounting part mounted on the inner surface of the kettle lid and a suspending line for suspending a copper test piece in a proper position in the wide-mouth glass bottle; the temperature control part comprises a thermocouple component which is inserted into the kettle lid and extends into the kettle body, a polyethylene outer sleeve sleeving upper and lower end sealing ports of the thermocouple component as well as a temperature adjuster connected with the thermocouple component.

The invention discloses a method for calibrating a Rockwell hardometer. The method comprises the following steps: (1) selecting a cylindrical pure copper test block, polishing the upper surface and the lower surface of pure copper to be smooth and flat; (2) placing cotton cloth in cleaning fluid, soaking, taking out, wringing out and scrubbing the top surface of a lead screw table of a hardometer and the upper and lower end surfaces of a workbench, then placing the cotton cloth in clear water, cleaning, wringing out and scrubbing the surface of the lead screw table and the upper and lower end surfaces of the workbench again; (3) placing the workbench on the lead screw table; (4) horizontally placing the pure copper test block on the workbench, rotating a hand wheel to slowly raise the workbench and extrude a pressure head and stopping applying the force to the hand wheel after a small pointer in an indicating dial points to a red dot. The method disclosed by the invention has the benefits that the indication error can be determined through preparing the pure copper test block, measuring hardness values of a plurality of measuring points on the pure copper test block by using the Rockwell hardometer and then calculating and comparing an average hardness with a standard hardness value of the pure copper, and further, the purpose of calibrating the Rockwell hardometer is achieved; the method is simple and easy to operate.

The invention discloses a method for calibrating a Rockwell hardometer. The method comprises the following steps that firstly, a cylindrical fine copper test block is selected, the two ends of the fine copper test block are subjected to coarse grinding by using a grinding wheel, the two ends of the fine copper test block obtained after coarse grinding are sequentially polished with 200 # dry abrasive paper, 400 # dry abrasive paper, 600 # dry abrasive paper and800 # dry abrasive paper, and the fine copper test block after polishing is subjected to buffing; secondly, the top face of a lead screw and the upper and lower end faces of a working table are wiped up; thirdly, the working table is placed on a lead screw table; fourthly, the fine copper test block is horizontally placed on the working table, a hand wheel is rotated so that the working table slowly rise, a pressure head is extruded, and force application is stopped until a small pointer in an indicating dial points to a red dot. In the method, by preparing the fine copper test block, the hardness numbers on a plurality of measurement points on the fine copper test block are measured by using the Rockwell hardometer, the average value of the hardness numbers is calculated, the average value is compared with the standard hardness number of finer copper, and the indication error can be obtained; while the average value is calculated, the maximum value and the minimum value are removed, so that the measuring errors are effectively avoided, and calibration is more accurate.

The invention discloses a PCB CAF test module design method. The method comprises the steps that the number of designed layers of a PCB CAF test module is determined; the CAF test module is divided into a hole-to-hole CAF test sub-module and a hole-to-copper CAF test sub-module; the hole-to-hole CAF test sub-module is designed; the hole-to-copper CAF test sub-module is designed; and the hole-to-hole CAF test sub-module and the hole-to-copper CAF test sub-module are combined and spliced into a complete CAF test module, and testing is performed. The CAF test module is divided into the hole-to-hole CAF test sub-module and the hole-to-copper CAF test sub-module, the hole-to-hole CAF test sub-module can analyze CAF probabilities under different hole center-to-hole center distances and measure the influence proportion of drilling on CAF, and the hole-to-copper CAF test sub-module can analyze CAF probabilities under different hole center-to-hole center distances, and measures the influence proportion of the distances from different holes to the copper sheet, and the refined test module design is convenient for the true cause analysis of the CAF influence factors and is beneficial to the discrimination of primary and secondary factors.

The invention discloses an environmental corrosion severity recognition method based on convolutional neural network deep learning. The method comprises the following steps: carrying out the training through a neural network deep learning model, and building the incidence relation between the photo data and service time of a copper test piece and the actually measured corrosion severity level of an electric appliance service environment; an environment corrosion severity grade recognition model is obtained; and collecting photo data after the copper test piece is placed in the service environment of the target electric appliance for a preset service time, so that the predicted corrosion severity grade of the service environment of the target electric appliance can be quickly recognized through an environment corrosion severity grade recognition model. The application stage shown in the step S3 can be completed on site in the service environment of the target electric appliance, and the test sample does not need to be transported to a laboratory for testing, so that the time for recognizing the predicted corrosion severity grade of the service environment of the target electric appliance can be greatly shortened, and the cost for transporting the test sample and manually analyzing and judging is reduced.

The invention relates to the technical field of nickel corrosion detection of gold lines, and discloses a rapid detection method for nickel corrosion of immersion gold lines. The rapid detection method comprises the following steps: 1) preparation of tools, 2) preparation, 3) inspection, and 4) evaluation criteria. In the rapid detection method for nickel corrosion of immersion gold lines, tools including a 15*10cm bare copper test board, a 200ml beaker, a 150ml of nitric acid solution with 40% concentration, a stopwatch timer and a nickel tank are prepared, so that the nickel corrosion of immersion gold lines can be conveniently achieved by the simple tools, effectively controlling detection cost. The detection method can be adopted by small and medium-sized production units, improving the practicability of the method. By putting the test board into the 200ml beaker containing the 150ml of nitric acid solution with 40% concentration for 20s, the detection time is effectively reduced.The nitric acid solution with 40% concentration effectively controls corrosion intensity, avoids excessive intensity, resulting in rapid damage of the test board and inaccurate results.

A water-cooling mechanical moving device for a test piece in a high-vacuum single-crystal growth furnace relates to a mechanical device. The water-cooling mechanical moving device mainly comprises a speed reducer, a transmission lead screw, a square nut, a connecting base, a water-cooling machine frame, a moveable lifting and pulling rod, a connecting flange and the like. The water-cooling mechanical moving device is arranged on the high-vacuum single-crystal growth furnace through the connecting flange. The mechanical moving device is subjected to heat-sink cooling by a circulating water-cooling method. The lower end of an output piece of the set of water-cooling mechanical moving device penetrates into the high-vacuum single-crystal growth furnace, and a copper test piece which needs heat treatment is clamped at the lower end head of the moveable lifting and pulling rod. The moving speed of the moveable lifting and pulling rod in the water-cooling mechanical moving device is controlled according to requirements of a heat treatment process, and the copper test piece can be slowly and uniformly changed from a high-temperature solid-state phase to a low-temperature solid-state phase, so that metal single-crystal copper with low-temperature solid-state phase is obtained. The water-cooling mechanical moving device can effectively solve the problem about control on moving and heat treatment states of the test piece in the high-vacuum single-crystal growth furnace.

An antimicrobial floor coating is provided that includes a matrix comprising a polymeric material; and a plurality of second phase particles comprising a controlled release agent, the controlled release agent comprising a plurality of antimicrobial copper ions. The polymeric material comprises an epoxy and an acrylic, and the plurality of second phase particles is distributed within the matrix. Further, an exterior surface of the coating exhibits at least a 2 log reduction in a concentration of Staphylococcus aureus under a Modified EPA Copper Test Protocol. Further, the controlled release agent can comprise a phase-separable glass.

The invention discloses a quantitative evaluation method for measuring corrosive sulfur by X-fluorescence. The quantitative evaluation method for measuring corrosive sulfur by the X-fluorescence comprises the following steps that (1) a sample is placed into a container; (2) a sulfur-free copper test piece is placed into the container with the sample taken out, it is ensured that the copper test piece is completely immersed into oil, and the container is sealed; (3) the container containing the cooper test piece in the step (2) is placed into an oven with the temperature of 150 DEG C+/-3 DEG C,constant temperature is carried out for 24-72h, and the container is taken out after an experiment is completed; (4) the sample is poured out after heating is completed, the cooper test piece is taken out and immersed into a cleaning solvent, and the attached sample on the cooper test piece is cleaned; (5) sulfur content test is carried out on the cooper test piece by using the X-fluorescence; and (6) a result is judged. According to the quantitative evaluation method for measuring corrosive sulfur by the X-fluorescence, after cooper, sulfur and a compound generate chemical reaction through the experiment, the condition of cooper test piece sulfur-containing compound is tested through X-fluorescence to judge whether an active sulfur compound exists in the oil or not, the quantitative evaluation method for measuring corrosive sulfur by the X-fluorescence can accurately judge the condition of corrosive sulfur and non-corrosive sulfur, and the operation practicability is high.

The invention provides a method for quickly calculating the copper thickness of a PCB via hole, comprising: measuring the copper thickness of the surface copper through a surface copper tester, measuring the copper thickness of the via hole through a slicing technique and calculating the deep plating capacity, and the statistics are not less than the designed A certain number of PCB boards are measured, and the average value of surface copper thickness and deep plating ability are obtained respectively, and then the surface copper thickness of the PCB board to be tested is measured by the surface copper tester, and the correction error is also introduced. The measurement results are corrected, and finally the calculation formula can be used to quickly calculate the copper thickness of the via hole center of the PCB board to be tested by measuring the surface copper thickness of the target PCB board. In the case that the PCB board has only via holes, the invention quickly calculates the hole copper thickness in the center of the via hole without destroying the PCB board to be tested.