Method for forming amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on copper surface

A technology with fluorescent properties and amino acids, which is applied in the coating process of metal materials, etc.

Inactive Publication Date: 2013-03-06
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the fluorescence analysis technology of the corrosion-inhibiting assembled film used to prevent the corrosion of commonly used metals has not been reported at home and abroad.

Method used

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  • Method for forming amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on copper surface
  • Method for forming amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on copper surface
  • Method for forming amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on copper surface

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The copper samples were polished step by step with metallographic sandpaper (1#-6#), then degreased with absolute ethanol, and finally rinsed with deionized water. Soak the above copper sample in 0.0001mol / L DL-cysteine ​​solution for three hours (pH=5~6), take it out and rinse it with deionized water twice to remove the adsorbate around the electrode, and dry the electrode That is, a Cys / Cu electrode is obtained. The Cys / Cu electrode prepared above was acidified in 0.5mol / L HCl solution for ten minutes, and after the acidified electrode was rinsed with high-purity water, in 0.0001mol / L fluorescent reagent 1-Naphthylamine diacetate (NADA) aqueous solution Soak for 1 hour and keep the pH between 5 and 6. Rinse twice with deionized water, blow dry with nitrogen, and the double-layer membrane electrode is assembled, and a NADA / Cys / Cu double-layer membrane electrode with fluorescence characteristics is obtained, which is stored away from light.

Embodiment 2

[0028] Fluorescence spectrum measurement was performed on the NADA / Cys / Cu bilayer film electrode obtained in Example 1. figure 1 Fluorescence spectra of NADA / Cys / Cu fluorescent double-layer self-assembled membrane electrode soaked in 0.5M NaCl solution for different time. From figure 1 It can be seen that there are two peaks in the fluorescence emission spectrum, the peak at 375nm is the Rayleigh scattering peak, and the peak at around 420nm is the fluorescence absorption peak of the NADA / Cys / Cu bilayer film. The intensities of fluorescence peaks after different soaking times are shown in Table 1. From Table 1, it can be seen that the fluorescence intensity of fluorescent double-layer membrane electrodes does not show a single increase or decrease trend over time, but decreases, increases, and then decreases. and re-increasing periodic changes.

[0029] Table 2 Fluorescence peak intensities of NADA / Cys / Cu double-layer membrane electrode soaked in 0.5M NaCl solution for diffe...

Embodiment 3

[0032] The electrochemical impedance spectrum of the NADA / Cys / Cu bilayer film electrode obtained in Example 1 was measured. figure 2 It is the electrochemical impedance spectroscopy of NADA / Cys / Cu fluorescent bilayer self-assembled film electrode soaked in 0.5M NaCl solution for different time. image 3 Nyquist plots of NADA / Cys / Cu double-layer membrane electrode soaked in 0.5M NaCl solution for different times. From figure 2 neutralize image 3 It can be seen that with the increase of time, the electrical uuxe resistance of the double-layer film electrode does not show a single increase or decrease trend, but a periodic change of decrease, increase, decrease and increase again, which corresponds to The protective film on the surface of the copper electrode is continuously damaged and then repaired.

[0033] The corrosion resistance of the electrode is determined by the electrochemical polarization resistance Rp, which is given by:

[0034]

[0035] In the formula, Re...

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Abstract

The invention discloses a method for forming an amino acid self-assembly corrosion inhibition membrane with fluorescent characteristics on a copper surface, which comprises the following steps of: polishing pure copper step by step by metallographical sand paper from No.1 to No.6, degreasing with absolute ethyl alcohol and cleaning with deionized water for later use; processing a copper test specimen by using aqueous solution of amino acid to obtain the copper test specimen modified by the amino acid; and assembling fluorescent reagent onto the surface of the copper test specimen indirectly under the electrostatic attraction action between 1-naphthylamine sodium diacetate (NADA) serving as the fluorescent reagent and the amino acid to prepare a dual-layer photosensitive corrosion inhibition self-assembly corrosion inhibition functional membrane, and characterizing the fluorescent characteristics and corrosion inhibition effect of the membrane respectively by adopting fluorescence spectra and an electrochemic impedance method. Researches show that in the corrosion inhibition functional membrane with the fluorescent characteristics, the relevance exists between fluorescence intensity and corrosion inhibition performance, and the corrosion inhibition characteristics of the assembly membrane are subjected to on-line detection and real-time monitoring through a fluorescence signal, so the method has great significance for promoting the application of the amino acid self-assembly membrane.

Description

technical field [0001] The corrosion and protection of metal materials involves the surface treatment of metals in machinery, steel and other industries, especially a method for forming an amino acid self-assembled corrosion-inhibiting film with fluorescent properties on the copper surface. Background technique [0002] Self-assembled membranes (SAMs) are thermodynamically stable and regularly arranged molecular membranes formed spontaneously by membrane molecules through chemical interactions between molecules and substrate materials. Organic molecules form a dense and ordered self-assembled film on the metal surface, which can prevent the corrosion of the metal by the corrosive medium. Copper has been widely used in the fields of chemical industry, machinery manufacturing and construction industry. Therefore, the research on the corrosion and protection of copper is very necessary. So far, studies on the formation of self-assembled films on copper surfaces by self-assembl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/02C23F11/16
Inventor 张大全李瑾高立新谢彬辛志玲
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER
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