Polyimide-epoxy resin adhesive and preparation method and application thereof

A technology of epoxy resin and polyimide, which is applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problem of limited heat resistance improvement, limited reactive groups, unsaturated adhesive system Low double bond content and other issues, to achieve the effect of industrialized production, low cost, and convenient source

Inactive Publication Date: 2010-01-20
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Though this method has carried out toughening modification to epoxy resin by synthesizing the polyetherimide resin (HPEI) that contains active reaction group (hydroxyl, unsaturated double bond), and obtained better technical effect; But , there are also some disadvantages: (1) Reactive groups are

Method used

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  • Polyimide-epoxy resin adhesive and preparation method and application thereof
  • Polyimide-epoxy resin adhesive and preparation method and application thereof
  • Polyimide-epoxy resin adhesive and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] 10.0 grams of maleimide-based polyimide (MHPI) powder, 10.0 grams of N,N,N′,N′-tetraglycidyl-3,3′-dimethyl-4,4′-bis Amino diphenylmethane and 60.0 grams of novolac epoxy resin were added to the reaction kettle, reacted at 80°C to 120°C for 1 to 2 hours, then cooled, and 65.5 grams of N,N-dimethylacetamide organic solvent was added at room temperature. Stir and dissolve to form a homogeneous transparent solution to obtain component A.

[0032] 19.1 grams of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane curing agent, 0.9 grams of 2-ethyl-4-methylimidazole accelerator and 34.5 grams of N,N-di Methylacetamide organic solvents are mixed, stirred and dissolved to obtain a homogeneous and transparent B component solution.

[0033] Mix components A and B and stir evenly to obtain a polyimide-epoxy resin adhesive, which is referred to as PIEP-1.

[0034] Take an appropriate amount of PIEP-1 polyimide-epoxy resin adhesive, and evenly coat it on the standard stee...

Example Embodiment

[0036] Example 2

[0037] Add 70.0 grams of maleimide-based polyimide (MHPI) powder and 10.0 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane into the reactor, After reacting at 80℃~120℃ for 1~2 hours, cooling, adding 45.5g of chloroform and 20.0g of N,N-dimethylformamide organic solvent, stirring and dissolving at room temperature, it is a homogeneous transparent solution, obtaining A Components.

[0038] 9.8 grams of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane curing agent, 0.2 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 accelerator and 44.5 Grams of N,N-dimethylacetamide organic solvents are mixed, stirred and dissolved to obtain a homogeneous and transparent B component solution.

[0039] Mix components A and B and stir evenly to obtain a polyimide-epoxy resin adhesive, which is referred to as PIEP-2.

[0040] Take an appropriate amount of PIEP-2 polyimide-epoxy resin adhesive, and evenly coat it on the standard steel test piece, superimpose, clamp, and place i...

Example Embodiment

[0042] Example 3

[0043] 24.0 grams of maleimide-based polyimide (MHPI) powder, 40.0 grams of novolac epoxy resin and 20.0 grams of N,N,N′,N′-tetraglycidyl-4,4′-diamino Diphenylmethane was added to the reaction kettle, reacted at 80°C to 120°C for 1 to 2 hours, then cooled, 50.0 g of dichloromethane and 10.0 g of N-methyl-2-pyrrolidone organic solvent were added, and the mixture was stirred and dissolved at room temperature. Homogeneous transparent solution to obtain component A.

[0044] 15.5 g of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride curing agent, 0.5 g of 1,8-diaza-bicyclo[5.4.0]undecene -7 accelerator was mixed with 40.0 grams of N-methyl-2-pyrrolidone organic solvent, stirred and dissolved to obtain a homogeneous and transparent B component solution.

[0045] Mix components A and B and stir evenly to obtain a polyimide-epoxy resin adhesive, which is referred to as PIEP-3.

[0046] Take an appropriate amount of PIEP-3 polyimide-epoxy resin adhesive, and eve...

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Abstract

The invention relates to a polyimide-epoxy resin adhesive and a preparation method and an application thereof; the adhesive comprises the following components: maleimidopolyimide, polyfunctional epoxy resin, curing agent, promoter and organic solvent; the preparation method comprises the following steps: adding maleimidopolyimide powder and polyfunctional epoxy resin in a reaction rank to react for 1-2h, cooling, adding organic solvent, stirring the solution for dissolving, obtaining component A; mixing curing agent, promoter and organic solvent, stirring the solution for dissolving, obtaining component B; mixing the component A and component B, stirring evenly and obtaining the finished product. The adhesive has good adhesive property, the tensile shear strength is up to 30MPa; the preparation process is simple, the cost is low, the operation is simple, the reaction raw materials are accessible so that the method is applicable to industrialized production; and the adhesive can be used in high-tech fields such as electronics and microelectronics, flexible clad-copper laminates, flexible printed wiring boards, hard clad-copper laminates, automobiles, motors, aviation and aerospace and the like, and has broad application prospect.

Description

technical field [0001] The invention belongs to the field of organic polymer adhesives and their preparation and application, in particular to a polyimide-epoxy resin adhesive and its preparation and application. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: the curing of epoxy resin is...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J163/00
Inventor 虞鑫海
Owner DONGHUA UNIV
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