High-temperature-resistant benzoxazine resin adhesive and preparation method thereof

A benzoxazine and adhesive technology, applied in the field of benzoxazine resin adhesive and its preparation, can solve the problems of low tensile shear strength, poor high temperature resistance and the like, and achieve increased crosslinking density and excellent heat resistance. and bonding performance, the effect of improving toughness

Inactive Publication Date: 2016-08-10
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problems of poor high temperature resistance and low tensile shear strength of existing benzoxazine resin adhesives at high temperatures, and provides a high temperature resistant benzoxazine resin adhesive and a preparation method thereof

Method used

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  • High-temperature-resistant benzoxazine resin adhesive and preparation method thereof
  • High-temperature-resistant benzoxazine resin adhesive and preparation method thereof
  • High-temperature-resistant benzoxazine resin adhesive and preparation method thereof

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specific Embodiment approach 1

[0025] Specific Embodiment 1: The high-temperature-resistant benzoxazine resin adhesive in this embodiment includes 100 parts by weight of alkynyl-terminated benzoxazine resin, 5-50 parts of toughening agent, 30-150 parts of organic solvent, 0.1-5 Part coupling agent and 10-150 parts inorganic filler.

specific Embodiment approach 2

[0026] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the structural formula of the alkynyl-terminated benzoxazine resin is:

[0027]

[0028] where X is:

[0029]

[0030] . Others are the same as in the first embodiment.

specific Embodiment approach 3

[0031] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the toughening agent is polyphenylene sulfide, polysulfone, polyarylsulfone, polyethersulfone, polycarbonate, polyphenylene, poly Ether ether ketone, polyaryl sulfone amide, polyparabenamide, polyparaphenylene terephthalamide, polypyromellitic imide, polyamide-imide, polyaminobismaleimide, A mixture of one or more of polyetherimide and liquid crystal polymer in any ratio. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a high-temperature-resistant benzoxazine resin adhesive and a preparation method thereof, relates to a benzoxazine resin adhesive and a preparation method thereof, and aims to solve the problems of poor resistance of an existing benzoxazine resin adhesive to high temperature and weak tensile shear strength at high temperature. The adhesive comprises acetylene-terminated benzoxazine resin, a toughening agent, an organic solvent, a coupling agent and an inorganic filler. The method comprises the following steps: 1, placing dihydric phenol, aminophenylacetylene and paraformaldehyde in a four-neck flask, performing heating reaction and cooling, adding trichloromethane for dissolution, performing extraction, performing washing to neutral with de-ionized water, and performing drying to obtain the acetylene-terminated benzoxazine resin; 2, uniformly mixing the acetylene-terminated benzoxazine resin, the toughening agent and the organic solvent to obtain a base adhesive; 3, sequentially adding the coupling agent and the inorganic filler into the base adhesive, and performing uniform mixing to obtain the high-temperature-resistant benzoxazine resin adhesive. The adhesive is resistant to high temperature, has strong tensile shear strength at high temperature, and is used in the field of adhesives.

Description

technical field [0001] The invention relates to a benzoxazine resin adhesive and a preparation method thereof. Background technique [0002] With the development of science and technology, the application of high temperature resistant adhesives is becoming more and more extensive, especially in the technical fields of aviation, aerospace, electronics, automobile and machinery manufacturing industries in recent years, higher requirements have been put forward for the high temperature resistance of synthetic adhesives. As a new type of thermosetting resin, benzoxazine has the advantages of heat resistance and flame retardancy of phenolic resin, and at the same time has some special properties, such as flexible molecular design, no small molecule release during curing, and a volume close to Zero shrinkage, low porosity of the product, and it also has a low dielectric constant, and the water absorption is much lower than that of phenolic resin. Therefore, benzoxazine can be use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/04C09J11/08
CPCC09J179/04C08L2201/08C09J11/08C08L61/16C08L81/06C08L79/08
Inventor 刘彩召孙明明李奇力张斌张绪刚李坚辉薛刚王磊宋彩雨赵明梅格史利利
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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