High-toughness high-heat-conduction epoxy-imine resin system and preparation method and application thereof

A technology of imine resin and epoxy resin, applied in epoxy-imine resin system and its preparation and application fields, can solve problems such as poor glass fiber adhesion performance, and achieve good adhesion, moderate viscosity and thermal conductivity. Good results

Inactive Publication Date: 2012-10-03
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has high heat resistance and can be used for a long time at 200°C. It has good mechanical properties, dielectric properties, chemical corrosion resistance and low temperature resistance, but its adhesion to glass fibers is poor

Method used

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  • High-toughness high-heat-conduction epoxy-imine resin system and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] At room temperature, 54.8 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 3000 milliliters of N,N-dimethylacetamide solvent were added to the reaction In the container, after stirring and dissolving at room temperature to form a homogeneous solution, add 19.6 grams (0.2 moles) of maleic anhydride powder, stir and react at room temperature for 0.5 hours, add 76.0 grams (0.5 moles) of 3,5-diaminobenzoic acid, stir and dissolve Finally, add 263.5 grams (0.85 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride powder, stir and react at room temperature for 2 hours, then add 1500 milliliters of toluene, heat up, reflux and divide water for 4 hours , cooled to room temperature, added 110.5 grams (0.5 moles) of aminopropyltriethoxysilane, stirred evenly, and adjusted the solid content to 10%, to obtain a carboxyl-containing polyimide resin solution, which was designated as MCPIS-1.

Embodiment 2

[0042] At room temperature, 54.8 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 800 milliliters of N,N-dimethylacetamide solvent were added to the reaction In the container, after stirring and dissolving at room temperature to form a homogeneous solution, add 19.6 grams (0.2 moles) of maleic anhydride powder, stir and react at room temperature for 1 hour, add 15.2 grams (0.1 moles) of 3,5-diaminobenzoic acid, stir and dissolve Finally, add 77.5 grams (0.25 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride powder, stir and react at room temperature for 3 hours, add 800 milliliters of toluene, heat up, reflux and divide water for 8 hours , cooled to room temperature, added 22.1 grams (0.1 mole) of aminopropyltriethoxysilane, stirred evenly, adjusted the solid content to 15%, and obtained a carboxyl-containing polyimide resin solution, which was designated as MCPIS-2.

Embodiment 3

[0044] At room temperature, 54.8 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 1200 milliliters of N,N-dimethylacetamide solvent were added to the reaction In the container, after stirring and dissolving at room temperature to form a homogeneous solution, add 19.6 grams (0.2 moles) of maleic anhydride powder, stir and react at room temperature for 0.5 hours, add 45.6 grams (0.3 moles) of 3,5-diaminobenzoic acid, stir and dissolve Finally, add 125.6 grams (0.405 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride powder, stir and react at room temperature for 3 hours, add 800 milliliters of toluene, heat up, reflux and divide water for 6 hours , cooled to room temperature, added 2.2 grams (0.01 moles) of aminopropyltriethoxysilane, stirred evenly, and adjusted the solid content to 12%, to obtain a carboxyl-containing polyimide resin solution, which was designated as MCPIS-3.

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Abstract

The invention relates to a high-toughness high-heat-conduction epoxy-imine resin system and a preparation method and application thereof. The high-toughness high-heat-conduction epoxy-imine resin system comprises epoxy resin, carboxyl-containing polyimide resin solution, firming agent, filler and organic solvent in a weight ratio of 100:100-200:30-50:30-50:150-250. The preparation method includes sequentially adding the epoxy resin, the carboxyl-containing polyimide resin solution, the firming agent, the filler and the organic solvent into a mixer, and mixing well to obtain the high-toughness high-heat-conduction epoxy-imine resin system. The high-toughness high-heat-conduction epoxy-imine resin system is applicable to preparation of glass cloth reinforced composite material. The high-toughness high-heat-conduction epoxy-imine resin system is moderate in viscosity and fine in usability. The preparation process is simple and convenient to operate. The glass cloth enhanced composite is high in impact resistance, fine in heat conductivity, high in heat resistance, and fine in electrical insulation.

Description

technical field [0001] The invention belongs to the field of epoxy-imine resin system and its preparation and application, in particular to an epoxy-imine resin system with high toughness and high thermal conductivity and its preparation method and application. Background technique [0002] With the development of aerospace, electronic and electrical industries and the improvement of electrical and electrical technology, there is a demand for high-temperature-resistant electrical insulation materials, including electrical insulation boards, electrical insulation tapes (such as mica tapes, etc.), impregnated insulating varnishes, and electromagnetic wire varnishes. getting bigger. [0003] With the advancement of science and technology of the times and the rapid development of high-power electrical and electronic products, more heat will inevitably be generated during the operation of high-performance technological products. If the generated heat is not dissipated in time, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08G59/38C08G73/10C08K13/04C08K7/14B29C70/50
Inventor 虞鑫海陈梅芳李俊明
Owner DONGHUA UNIV
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