Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board)

Abstract

The invention discloses an organosilicon electronic pouring sealant good in impact resistance and used for a PCB (printed circuit board). The organosilicon electronic pouring sealant is prepared by vinyl-terminated silicone oil-1, vinyl-terminated silicone oil-2, 12% platinum catalyst, acetenyl cyclohexanol, vinyl silicone resin, 1-allyloxy radicals-2,3-epoxy propane, 1,3,5,7-tetramethyl cyclotetrasiloxane, a silane coupling agent A171, an appropriate amount of hydrogen-containing silicone oil, alkali magnesium sulfate whiskers, (Heptadecafluoro-1,1,2,2-tetradecyl)trimethoxysilane, sodium dodecyl sulfate, ammonium persulfate, maleic anhydride, fluorine silicone resin emulsion, methyl ethyl ketone peroxide, an appropriate amount of deionized water and an appropriate amount of ethanol. The prepared organosilicon electronic pouring sealant is excellent in comprehensive performance, fast in curing, good in adhesion, high in flowability, simple in preparation process, low in production cost, wide in application range and worthy of popularization.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone electronic potting glue for PCB circuit boards with good impact resistance. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The equipment is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual methods, and proces...

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market for PCB circuit boards, and its performance is not high in all aspects, so it must be further improved to expand the scope of use.