Process for improving the adhesion of polymeric materials to metal surfaces

A metal surface and polymeric material technology, which is applied in the coating process of metal materials, the improvement of the metal adhesion of insulating substrates, and the manufacture of printed circuits, etc., can solve the problems of separation/delamination, and achieve the goal of reducing waste and eliminating pink rings The effect of producing and reducing the amount of etching

Inactive Publication Date: 2005-11-23
MACDERMID INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there can be problems with the adhesion between the dielectric layer and the inner layer of the metallic copper circuit because, firstly, the bonding surface is metallic copper, and secondly, the metallic copper mainly occurs in a different phase (i.e., (1) from the oxidized Copper-reduced copper is on (2) the copper of the copper foil), which is prone to separation / delamination along the phase interface

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] An example bath of the following composition was prepared:

[0068] 4.5% by volume concentrated sulfuric acid

[0069] 1.2 g / L benzotriazole

[0070] 0.7 g / L 3,5-Dinitrosalicylic acid

[0071] 0.15 g / L cinnamic acid

[0072] 15 mg / L NaCl

[0073] 10 mg / L molybdic acid

[0074] 1.1% by volume of 50% hydrogen peroxide

[0075] Copper surfaces treated with this bath formed a uniform brown surface. About 25 microinches of copper were removed during processing.

Embodiment 2

[0077] An example bath of the following composition was prepared:

[0078] 2.0 volume% concentrated sulfuric acid

[0079] 1.2 g / L benzotriazole

[0080] 0.4 g / L 3,5-Dinitrosalicylic acid

[0081] 0.1 g / L cinnamic acid

[0082] 15 mg / L NaCl

[0083]10 mg / L molybdic acid

[0084] 1.2% by volume of 50% hydrogen peroxide

[0085] Copper surfaces treated with this bath formed a uniform purple / brown surface. Approximately 23 microinches of copper were removed during processing.

Embodiment 3

[0087] An example bath of the following composition was prepared:

[0088] 5.0 volume% concentrated sulfuric acid

[0089] 1.2 g / L benzotriazole

[0090] 0.6 g / L 3,5-Dinitrosalicylic acid

[0091] 0.8 g / L acetylene cyclohexanol

[0092] 15 mg / L NaCl

[0093] 10 mg / L molybdic acid

[0094] 1.1% by volume of 50% hydrogen peroxide

[0095] Copper surfaces treated with this bath developed a slightly uneven purple finish. About 25 microinches of copper were removed during processing.

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Abstract

A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing, an organic nitro compound, and a source of halide ions in order to increase the adhesion of polymeric materials to the metal surface.

Description

technical field [0001] This invention relates to printed circuits, and more particularly to methods of making multilayer printed circuit boards. Background technique [0002] Due to the increasing need for weight and space savings in electronic devices, printed circuits comprising one or more circuit inner layers are now widely used. [0003] In the manufacture of a typical multilayer printed circuit, a patterned circuit inner layer is first prepared by a process in which a resist is used to form a positive image of the desired circuit pattern on a copper-clad dielectric matrix material pattern, and then etch away the exposed copper. After removing the resist, the desired copper circuit pattern remains. [0004] Any one or more circuit inner layers having a particular form of circuit pattern, and circuit inner layers that may form ground planes and power planes, by sandwiching one or more partially cured dielectric matrix material layers between each inner circuit layer (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/40C23C22/52H05K3/38
CPCH05K2203/122C23C22/40H05K2203/0796H05K3/383C23C22/52H05K2203/124H05K3/385
Inventor 唐纳德·费莱尔
Owner MACDERMID INC
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