2results about How to "Etch stable" patented technology

The utility model discloses a precise etching machine for a glass-based chip, and relates to the technical field of etching machines. The device comprises a box body, an annular frame, a partition plate and an ejector, the partition plate is arranged in the box body, the annular frame is arranged in the box body, a gear ring is arranged on the inner wall of the annular frame, a motor is arranged on the inner wall of the lower end of the box body, a gear is arranged at the output end of the motor, and a material groove is formed in the upper end of the annular frame. A guide rail is arranged on the inner wall of the lower end of the box body, balls are rotationally installed at the lower end of the annular frame, a liquid box is arranged at the upper end of the box body, an ejector is arranged on the inner wall of the upper end of the box body, a conveying pipe is arranged at the lower end of the ejector, and an ejector head is arranged at the lower end of the conveying pipe. According to the utility model, the independent and relatively sealed chamber is arranged to carry out stable etching processing on the glass-based chip, so that the problems that the stable etching processing of the chip is influenced and the processing cost is increased due to the loss of a large amount of protective gas when equipment is frequently opened and closed to access the chip are solved.

This utility model relates to the field of solar cell technology, specifically disclosing an etching apparatus. The apparatus includes: an etching unit comprising a substrate, wherein a liquid flow channel is provided on the substrate, the liquid flow channel having a supply port for providing etching solution and a drain port for discharging etching solution; and a liquid flow generating device configured to generate a liquid flow of etching solution, the liquid flow direction being from at least one of the supply ports into the liquid flow channel and from at least one of the drain ports out of the liquid flow channel. Compared with the prior art, the contact interface between the etching solution and the silicon wafer of this utility model is more uniform and stable, which can effectively improve etching uniformity, reduce over-etching rate, improve etching effect, and thus improve the performance and quality of the processed silicon wafer. At the same time, the overall structure of this utility model is simpler, the production precision requirements of the apparatus are lower, effectively reducing equipment costs and manufacturing difficulty, and facilitating industrial production.