Fine-line PCB manufacturing method

Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a copper foil removal step, a copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-etching step and a common back-end work procedure. Outer layer copper foil arranged on a multi-layer board in a press-fit mode is removed, copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a copper deposition layer, and press-fit of a copper foil layer is omitted, so that a base copper layer is thin, a micro-etching mode is adopted in the outer layer etching process, and therefore the phenomenon of serious lateral erosion of the two sides of a line is avoided. The lateral erosion quantity of the two sides of the line is less than 1 micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the manufacturing quality of a fine-line PCB is guaranteed. The smooth surface of the copper foil and the prepreg are bonded together in a press-fit mode, the binding force between the copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.

Description

technical field [0001] The invention relates to the technical field of PCB production and preparation, in particular to a method for manufacturing a fine circuit PCB. Background technique [0002] The PCB is a support for electronic components and provides electrical connections for electronic components. The production process of PCB is generally: material cutting → inner layer pattern transfer → inner layer etching → lamination → drilling → sinking copper → whole board plating → outer layer pattern transfer → pattern plating → etching → solder mask → surface treatment → forming processing etc. [0003] In recent years, with the continuous development of light, thin, short and small electronic products, PCBs are also gradually developing towards high density. Therefore, the circuit patterns on the PCB need to have higher precision and density, that is, fine lines. At present, the general steps of the production method are to drill holes on the laminated multi-layer board ...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem of serious side erosion of fine lines in the production of existing fine line PCBs, and provides a production method that can avoid excessive side erosion of fine lines and improve the quality of fine line PCBs

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