The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a copper foil removal step, a copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-etching step and a common back-end work procedure. Outer layer copper foil arranged on a multi-layer board in a press-fit mode is removed, copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a copper deposition layer, and press-fit of a copper foil layer is omitted, so that a base copper layer is thin, a micro-etching mode is adopted in the outer layer etching process, and therefore the phenomenon of serious lateral erosion of the two sides of a line is avoided. The lateral erosion quantity of the two sides of the line is less than 1 micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the manufacturing quality of a fine-line PCB is guaranteed. The smooth surface of the copper foil and the prepreg are bonded together in a press-fit mode, the binding force between the copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.