The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a
copper foil removal step, a
copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-
etching step and a common back-end work procedure. Outer layer
copper foil arranged on a multi-layer board in a press-fit mode is removed,
copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a
copper deposition layer, and press-fit of a
copper foil layer is omitted, so that a base copper layer is thin, a micro-
etching mode is adopted in the outer layer
etching process, and therefore the phenomenon of serious lateral
erosion of the two sides of a line is avoided. The lateral
erosion quantity of the two sides of the line is less than 1
micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the
manufacturing quality of a fine-line PCB is guaranteed. The
smooth surface of the
copper foil and the prepreg are bonded together in a press-fit mode, the
binding force between the
copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.