Wire-width-variable laser galvanometer scanning quick etching method and device

Abstract

The invention discloses a wire-width-variable laser galvanometer scanning quick etching method and device. The principle that after laser beam is defocused, the power density gradient becomes small, and a light spot becomes large is used, a high-speed galvanometer scanning error accurate correcting method is used, by setting different focusing and defocusing laser processing distances and corresponding power parameters and laser galvanometer scanning parameters, the size of the laser light spot is controlled, large light spot raster scanning filling after defocusing is carried out is on an image filling zone, and then an image contour is subjected to vector scanning drawing. For different working distances, galvanometer scanning error correcting is carried out first, a high-accuracy galvanometer scanning locating table is formed, and the fact that the same high-accuracy galvanometer scanning locating effect is obtained at different laser processing distances is guaranteed. Quick accurate etching on images with different wire widths can be achieved, etching accuracy and processing speed are considered at the same time, the method and device can be widely used a plane etching system and a three-dimensional laser etching system, and the processing efficiency of equipment is improved.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and relates to a laser galvanometer scanning precision machining technology, in particular to a variable line width laser galvanometer scanning fast etching method and device. Background technique [0002] In the field of advanced laser manufacturing, more and more people are connecting the laser galvanometer scanning processing head to the robot or machine tool motion axis to form a more flexible three-dimensional laser processing system to complete more complex three-dimensional laser processing functions. For example, the Chinese patent document with the publication number CN201881047U titled "A Multi-Axis CNC Laser Processing Device" can complete the processing of larger-sized parts by connecting the laser processing head to the end of the CNC machine tool. The patent application number is CN102151984A, and the invention name is "a laser processing method and device suitable for comp...

AI Technical Summary

Problems solved by technology

[0004] However, with the increase of the laser power, the energy density of the laser is getting higher and higher. When using the laser focus to process and etch some multi-layer composite materials, the laser power density should not be too large, otherwise it is easy to damage the substrate material.

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