31results about How to "Excellent etch profile" patented technology

An exemplary semiconductor processing system may include a remote plasma source coupled with a processing chamber having a top plate. An inlet assembly may be used to couple the remote plasma source with the top plate and may include a mounting assembly, which in embodiments may include at least two components. The inlet assembly may further include a precursor distribution assembly defining a plurality of distribution channels fluidly coupled with an injection port.

An aromatic ring-containing compound for a resist underlayer and a resist underlayer composition, the aromatic ring-containing compound being represented by the following Chemical Formula 1:

wherein, in Chemical Formula 1, R₁ to R₆ are each independently a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C5 to C20 aromatic ring group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C3 to C20 cycloalkenyl group, a substituted or unsubstituted C2 to C20 heteroaryl group, or a substituted or unsubstituted C2 to C20 heterocycloalkyl group, X₁ to X₆ are each independently hydrogen, a hydroxy group (—OH), a substituted or unsubstituted alkyl amine group, a substituted or unsubstituted alkoxy group, or an amino group (—NH₂), n1 to n6 are each independently 0 or 1, and 1≦n1+n2+n3+n4+n5+n6≦6.

The invention discloses an etching agent composite used for etching conductive multi-layer film and an etching method using the same. The etching agent composite includes, by weight, 50 to 80 percents phosphoric acid of a total weight of the composite, 0.5 to 10 percents nitric acid, 5 to 30 percents acetic acid, 0.01 to 5 percents imidazole, and the rest is water. The multi-layer film includes at least one copper or copper alloy layer, and at least one molybdenum or molybdenum alloy layer. The multi-layer film can be a Cu/Mo lamination film, a Cu/Mo alloy lamination film or a Cu alloy/Mo alloy lamination film. The multi-layer film can be etched by the etching agent composite efficiently and well. Besides, a constitutional layer of the multi-layer film can be etched in batch. The imidazole is an annexing agent working as a reaction control agent of a Cu/Mo primary battery.

A lithographic apparatus comprising a patterning reticle which has an aluminium absorber layer which improves imaging by eliminating or at least minimising the formation of aberrations in a patterned beam.

The present invention relates to a wet etchant composition to a multilayer film comprising a copper-based metal layer and a titanium-based metal layer. The etchant composition of the present invention provides an excellent etching profile in case of etching said multilayer film, and minimizes the damage of a glass substrate and a lower insulating layer and the generation of residue, thereby enabling the stable performance of a subsequent process.

The invention relates to the etchant composition and display substrate using the same of the argentiferous thin film, more specifically, the phosphoric acid 45 about the total weight of composition, through 55 weight%, the nitric acid 2 through 9 weight%, the acetic acid 5 through 15 weight%, and the potassium nitrate 1 through 5 weight%, the etchant composition of the argentiferous thin film including the residual water, and the display substrate using the same.

The invention relates to an etchant composition, and a method for manufacturing an array substrate for a display device, and an array substrate and a display device. More specifically, the invention provides an etchant composition of a metal film uniformly etching the metal film, having the excellent etching speed and an excellent taper angle characteristic, and having an excellent etching profileof an interface unit in a case of etching of a multilayer when manufacturing an array substrate for a display device, a method for manufacturing an array substrate for a display device and an array for a display device. The etchant composition of the metal film is characterized by containing, with respect to the total weight of the composition, 5 to 25 wt% of hydrogen peroxide, 0.01 to 1 wt% of afluorine compound, 0.1 to 5 wt% of an azole compound, 0.1 to 5 wt% of a water-soluble compound having a nitrogen atom and a carboxyl group in one molecule is by weight, 0.001 to 5 wt% of a phosphatecontaining alkali metal or alkaline earth metal, 0.01 to 5 wt% of a polyol-type surfactant, 0.1 to 5 wt% of sulfate comprising alkali metal or alkaline earth metal, and the balance of water, the weight ratio of phosphate to sulfate being 1:3 to 1:20.

The present invention relates to a novel etching media in the form of printable, homogeneous etching pastes with non-Newtonian flow properties for the improved etching of inorganic oxides and silicon surfaces and which allow to prepare smaller features.

An etchant composition is provided. The etchant composition includes about 40 to about 65 wt % of phosphoric acid, about 2 to about 5 wt % of nitric acid, about 2 to about 20 wt % of acetic acid, about 0.1 to about 2 wt % of a compound containing phosphate, about 0.1 to about 2 wt % of a compound simultaneously containing an amino group and a carboxyl group, and a remaining weight percent of water for the total weight of the composition.

The etching liquid comprises the following components in percentage by mass: 12-22% of hydrogen peroxide; 0.5-4% by mass of a chelating agent; 0.1 to 2.5% by mass of an etching inhibitor; 0.1 to 5% by mass of an etching agent; 0.01-2% by mass of a residue removal agent; the etching agent can be used for etching a copper/molybdenum metal film layer with a multi-layer structure in a large area under the condition that the fluorine content does not need to be increased, not only can the phenomenon that copper metal is diffused on an insulating film be inhibited, but also molybdenum metal residues can be effectively removed, and the etching solution is stable in property, moderate in etching rate, good in etching outline and high in etching efficiency. And the yield of products can be effectively improved.