Etching Agent Composite Used For Etching Conductive Multi-layer Film And Etching Method Using The Same

A technology of composition and etchant, which is applied in the direction of surface etching composition, chemical instruments and methods, circuits, etc., can solve problems such as rising demand for metallization layers, and achieve the effect of simplifying production cost and time, and reducing process

Inactive Publication Date: 2012-04-11
PLANSEE SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for larger size touch sensors, the need for lower resistivity metallization layers rises, and as a result, multilayer films of Cu / Mo or Cu / Mo alloys must be used

Method used

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  • Etching Agent Composite Used For Etching Conductive Multi-layer Film And Etching Method Using The Same
  • Etching Agent Composite Used For Etching Conductive Multi-layer Film And Etching Method Using The Same
  • Etching Agent Composite Used For Etching Conductive Multi-layer Film And Etching Method Using The Same

Examples

Experimental program
Comparison scheme
Effect test

experiment Embodiment 1

[0058] A Cu / Mo bilayer film was deposited on a substrate and a photoresist (PR) was formed thereon to fabricate a sample. The etchant of Example 1 and Comparative Example 1 were each placed in a spray type etching system (FNS Tech.) and heated to 40°C. When the temperature reaches 40±0.1°C, etchant is used to etch the Cu / Mo bilayer film. Etch times were over 50% etch with endpoint detection (EPD). After the etching was completed, the substrate was taken out of the etching system, washed with deionized water, and dried using a hot air dryer. Use a photoresist stripper to remove the photoresist. Critical dimension (CD) skew (etch loss), step length as a width difference between copper and molybdenum layers, and etch residue of etched structures were evaluated using scanning electron microscopy (SEM, TESCAN).

Embodiment 1

[0061]Specifically, KR 2006-0082270 A discloses an etchant composition for etching metal electrodes to form thin film transistors for flat panel displays. In addition to phosphoric acid, nitric acid, acetic acid, and water, which are components of a typical etchant for etching aluminum, the etchant composition contains an etch rate control agent to form a desired pattern. According to Example 1 of this prior art, the etchant has the following composition:

[0062] h 3 PO 4 (55% by weight)+HNO 3 (8% by weight)+CH3COOH (10% by weight)+(NH 4 ) 2 HPO 4 (2wt%)+CH 3 COONH 4 (2% by weight)+H 2 O (surplus).

[0063] The etching properties of the etchant were tested. The results are shown in Figure 1a and 1b middle.

[0064] specifically, Figure 1a Shows the detailed results obtained when applying the etchant of Comparative Example 1 to a Cu / Mo bilayer film as proposed in the prior art (KR 2006-0082270 A) embodiment comprising phosphoric acid, nitric acid , acetic acid a...

Embodiment 2

[0073] h 3 PO 4 (70% by weight)+HNO 3 (2wt%)+CH 3 COOH (15% by weight) + imidazole (C 3 h 4 N 2 , 0.1 to 0.3% by weight) + distilled water (balance).

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Abstract

The invention discloses an etching agent composite used for etching conductive multi-layer film and an etching method using the same. The etching agent composite includes, by weight, 50 to 80 percents phosphoric acid of a total weight of the composite, 0.5 to 10 percents nitric acid, 5 to 30 percents acetic acid, 0.01 to 5 percents imidazole, and the rest is water. The multi-layer film includes at least one copper or copper alloy layer, and at least one molybdenum or molybdenum alloy layer. The multi-layer film can be a Cu/Mo lamination film, a Cu/Mo alloy lamination film or a Cu alloy/Mo alloy lamination film. The multi-layer film can be etched by the etching agent composite efficiently and well. Besides, a constitutional layer of the multi-layer film can be etched in batch. The imidazole is an annexing agent working as a reaction control agent of a Cu/Mo primary battery.

Description

technical field [0001] The present invention relates to etchant compositions for patterning conductive layers used in thin film transistors (TFTs) of flat panel displays or touch sensor panels. More specifically, the present invention relates to methods for etching conductive multilayer films comprising at least one layer of copper (Cu) or copper alloy (Cu alloy) and at least one layer of molybdenum (Mo) or molybdenum alloy (Mo alloy), especially for An etchant composition for etching a Cu / Mo bilayer film in one pass. The present invention also relates to a method of etching a conductive multilayer film using the etchant composition. Background technique [0002] A double-layer film consisting of a Cu layer and a molybdenum (Mo) or titanium (Ti) layer below the Cu layer as a diffusion barrier is currently used instead of a copper (Cu) single layer as a low-resistance metal electrode for TFTs , such as gate electrodes or source / drain electrodes. Many etchants for such bila...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/26C23F1/02
CPCC09K13/04C23F1/02C23F1/18C23F1/26H01L21/308
Inventor 徐宗铉
Owner PLANSEE SE
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