Etchant composition for copper-based metal layer, and method of manufacturing array substrate of display device

Abstract

The invention discloses an etchant composition for a copper-based metal layer comprising a predetermined amount of hydrogen peroxide, an azole compound, a water-soluble compound having a nitrogen atom and a carboxyl group in the molecule, a phosphate, an acetate, a polyol surfactant And water. There is also provided a method of manufacturing an array substrate for a display device using the etchant composition.

Description

technical field [0001] The present invention relates to an etchant composition for a copper-based metal layer and a method of manufacturing an array substrate for a display device using the etchant composition. Background technique [0002] In semiconductor devices, forming metal lines on a substrate typically involves forming a metal layer using sputtering, applying a photoresist, exposing and developing such that the photoresist is formed in selected areas and etching, where each A cleaning process is performed before and after a single process. The etching process is performed such that the metal layer is left in selected regions by using the photoresist as a mask, and the etching process may include dry etching using plasma or the like or wet etching using an etchant composition. [0003] Lines traditionally used for gate electrodes and source / drain electrodes are formed from metal layers including aluminum or its alloys and additional metals. Aluminum is cheap and has...

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Problems solved by technology

Otherwise, poor etch profiles and etch residues may occur

[0006] Furthermore, it is difficult to prevent damage to the metal oxide layer to be protected, other than the layer to be etched

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