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Etchant composition for copper-based metal layer, and method of manufacturing array substrate of display device

A technology of composition and etchant, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of poor etching profile and etching residue, and it is difficult to prevent metal oxide layer damage, and achieve excellent Etching linearity, excellent etching profile, no etching residue effect

Active Publication Date: 2017-10-10
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Otherwise, poor etch profiles and etch residues may occur
[0006] Furthermore, it is difficult to prevent damage to the metal oxide layer to be protected, other than the layer to be etched

Method used

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  • Etchant composition for copper-based metal layer, and method of manufacturing array substrate of display device
  • Etchant composition for copper-based metal layer, and method of manufacturing array substrate of display device
  • Etchant composition for copper-based metal layer, and method of manufacturing array substrate of display device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] Preparation of Etchant Compositions

[0066] 6 kg of each of the etchant compositions of Examples 1 to 7 and Comparative Examples 1 to 8 were prepared using the components in the amounts shown in Table 1 below.

[0067] [Table 1]

[0068]

[0069] Note that in Table 1,

[0070] ATZ: aminotetrazole

[0071] NHP: Monosodium Phosphate

[0072] APM: Ammonium Dihydrogen Phosphate

[0073] PA: Potassium acetate

[0074] AA: Ammonium acetate

[0075] SA: Sodium acetate

[0076] TEG: triethylene glycol

[0077] IDA: iminodiacetic acid

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Abstract

The invention discloses an etchant composition for a copper-based metal layer comprising a predetermined amount of hydrogen peroxide, an azole compound, a water-soluble compound having a nitrogen atom and a carboxyl group in the molecule, a phosphate, an acetate, a polyol surfactant And water. There is also provided a method of manufacturing an array substrate for a display device using the etchant composition.

Description

technical field [0001] The present invention relates to an etchant composition for a copper-based metal layer and a method of manufacturing an array substrate for a display device using the etchant composition. Background technique [0002] In semiconductor devices, forming metal lines on a substrate typically involves forming a metal layer using sputtering, applying a photoresist, exposing and developing such that the photoresist is formed in selected areas and etching, where each A cleaning process is performed before and after a single process. The etching process is performed such that the metal layer is left in selected regions by using the photoresist as a mask, and the etching process may include dry etching using plasma or the like or wet etching using an etchant composition. [0003] Lines traditionally used for gate electrodes and source / drain electrodes are formed from metal layers including aluminum or its alloys and additional metals. Aluminum is cheap and has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H01L21/3213H01L21/77
CPCC23F1/18H01L21/32134H01L27/1259
Inventor 梁承宰朴昇煜李恩远
Owner DONGWOO FINE CHEM CO LTD
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