Novel PCB copper reduction etching liquid and manufacturing technology

A new type of copper etching technology, applied in the field of copper reduction etching solution and its production process, can solve the problems of low copper ion tolerance, low etching rate, and easy occurrence of pinholes, etc., and achieve fast etching speed and tolerance High degree, not easy to be oxidized

Active Publication Date: 2019-04-19
湖南互连微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of low copper ion tolerance, low etching rate and easy occurrence of pinhol

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A new type of PCB copper-reducing etching solution, the concentration of its various components is: sulfuric acid 20mL / L, hydrogen peroxide 30mL / L, propylene glycol 15g / L, ethylenediamine tetramethylene phosphonic acid 10g / L, citric acid 5g / L, Sodium dodecylbenzenesulfonate 1g / L, perfluoroalkyl polyether 1g / L, malic acid 5g / L, silver ion 10ppm, cyclohexylamine 3g / L, benzotriazole 3g / L.

[0031] Among them, propylene glycol is hydrogen peroxide stabilizer, ethylenediamine tetramethylene phosphonic acid and citric acid are copper ion complexing agents, sodium dodecylbenzenesulfonate and perfluoroalkyl polyether are surfactants, malic acid and Silver ion is an etching accelerator, cyclohexylamine is a pinhole inhibitor on copper surface, and benzotriazole is a corrosion inhibitor on copper surface.

[0032] For copper reduction etching treatment, immerse the printed circuit board that has been electroplated copper in the copper reduction etching solution prepared according...

Embodiment 2

[0035] A new type of PCB copper-reducing etching solution, the concentrations of its various components are sulfuric acid 20mL / L, hydrogen peroxide 30mL / L, 1,4 butanediol 10g / L, ethylenediaminetetramethylenephosphonic acid 8g / L, citric acid 4g / L, sodium dodecylbenzenesulfonate 1g / L, perfluoroalkyl polyether 0.5g / L, propionic acid 5g / L, silver ion 12ppm, triethanolamine 5g / L, benzotriazole 5g / L L.

[0036] Among them, 1,4 butanediol is hydrogen peroxide stabilizer, ethylenediamine tetramethylene phosphonic acid and citric acid are copper ion complexing agents, sodium dodecylbenzenesulfonate and perfluoroalkyl polyether are surface active Propionic acid and silver ions are etching accelerators, triethanolamine is a pinhole inhibitor on copper surface, and benzotriazole is a corrosion inhibitor on copper surface.

[0037] Immerse the printed circuit board after filling the hole in the copper-reducing etching solution prepared above. The temperature of the copper-reducing etching...

Embodiment 3

[0040] A new type of PCB copper-reducing etching solution, the concentration of its various components is sulfuric acid 20mL / L, hydrogen peroxide 30mL / L, n-butanol 10g / L, ethylenediamine tetramethylene phosphonic acid 8g / L, citric acid 12g / L , sodium lauryl sulfate 1g / L, perfluoroalkyl polyether 1g / L, succinic acid 5g / L, platinum ion 10ppm, cyclohexylamine 5g / L, benzotriazole 5g / L.

[0041] Among them, n-butanol is hydrogen peroxide stabilizer, ethylenediamine tetramethylene phosphonic acid and citric acid are copper ion complexing agents, sodium dodecylbenzene sulfate and perfluoroalkyl polyether are surfactants, dibutylene Acid and platinum ions are etching accelerators, cyclohexylamine is a pinhole inhibitor on copper surface, and benzotriazole is a corrosion inhibitor on copper surface.

[0042] Immerse the printed circuit board after filling the hole in the copper-reducing etching solution prepared above. The temperature of the copper-reducing etching solution is 35°C, an...

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PUM

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Abstract

The invention discloses novel PCB copper reduction etching liquid. The novel PCB copper reduction etching liquid comprises components including 1-100 mL/L of sulfuric acid, 1-100 mL/L of hydrogen peroxide, 1 g/L-100 g/L of hydrogen peroxide stabilizer, 1 g/L-100 g/L of a copper ion complexing agent, 0.1 g/L-10 g/L of a surface active agent, 1 g/L-100 g/L of accelerator, 0.1 g/L-10 g/L of copper surface corrosion inhibitor and 0.1 g/L-10 g/L of needle hole inhibitor. The invention further provides a method for preparing the PCB copper reduction etching liquid. The tolerance of copper ions of the prepared PCB copper reduction etching liquid is high, the etching speed is high, the copper surface is bright and not prone to oxidization, and the needle hole defect is not likely to be generatedafter abnormally-crystallized copper crystals are subjected to copper reduction etching.

Description

technical field [0001] The invention relates to the technical field of etching solution compositions, in particular to a copper-reducing etching solution for etching substrates of PCBs and a manufacturing process thereof. Background technique [0002] PCB (Printed Circuit Board), printed circuit board in Chinese, is an important electronic component as a support for electronic components, and is often used as a carrier for electrical connections of electronic components. In the process of manufacturing fine lines of printed circuit boards, it is necessary to control the thickness of copper not to be too thick. There is a hole filling process in the HDI process. After hole filling, the surface copper thickness is generally thicker, in order to improve the subsequent production yield. It is generally necessary to thin the copper layer with a copper-reducing etching solution. With the further development of electronic products towards miniaturization, the interconnection produ...

Claims

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Application Information

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IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 张毅张新学刘龙平邹银超肖开球
Owner 湖南互连微电子材料有限公司
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