2 results about "Cuprous ion" patented technology

The invention discloses an electrolyte for a super-stable aqueous copper-sulfur battery as well as a preparation method and application of the electrolyte. The electrolyte comprises an aqueous solvent, AB type halide salt and cuprous ion halide salt CuB, the cation A of the AB type salt is selected from at least one of Li < + >, Na < + >, K < + >, choline cation and NH4 < + >, and the anion B is Cl <->, Br <-> or I <->; and the anion of the CuB is the same as the anion of the AB type salt. The preparation method comprises the following steps: dissolving AB type salt in a water-based solvent, and then adding CuB for dissolving. According to the electrolyte disclosed by the invention, the electrochemical reaction of the copper-sulfur battery is adjusted from two-step conversion to one-step conversion, so that shuttling of polysulfide is inhibited in mechanism, voltage polarization is reduced, the solubility of Cu < + > is improved, and the interface stability is enhanced. The water-based copper-sulfur battery containing the electrolyte has ultra-long cycle life and high capacity retention ratio, the capacity retention ratio still reaches 88% or above after 400 times of circulation under 1C multiplying power, and the preparation process is simple, adapts to various electrode and diaphragm materials and is suitable for large-scale application.

The application provides a brightener, a preparation method and application thereof. The brightener has a structure as shown in formula 1, wherein R is any one of CH3-(CH2) x -, Ph-(CH2) y - or an azacyclic group, x is 2-5, and y is 0-4. The brightener is connected with a functional group having strong polarity, has good inhibition effect on copper, and has a capturing cuprous ion at the other end of the structure, accelerates copper deposition, has certain leveling performance, can form leveling effect on the surface copper high potential, forms acceleration effect on the low point position in the hole, and can effectively improve the deep plating capacity of the acid copper plating solution, and the deep plating capacity can reach 79-85%.