Alkaline non-cyanide plating solution for copper-plating used on iron and steel base and preparation method thereof

Abstract

An alkaline non-cyanide plating solution for copper-plating used on iron and steel base and a preparation method thereof relate to a kind of plating solution. The invention provides the alkaline non-cyanide plating solution for copper-plating used on iron and steel base and the preparation method thereof. The plating solution comprises the following components: main salt, complexing agent, conductive salt, activator, cuprous ion complexing agent, pH stabilizer and brightening agent. The method comprises the following steps: adding complexing agent in water, stirring to dissolve complexing agent, obtaining a solution A; adding main salt in the solution A, stirring to dissolve main salt, obtaining a solution B; adding conductive salt in water, stirring to dissolve conductive salt, obtaininga solution C; mixing the solution B and solution C, adjusting the pH value to 2.0-4.5 with sulfuric acid or sodium hydroxide, obtaining a solution D; adding additive in the solution D, adding water toperform constant volume process and obtaining the alkaline non-cyanide plating solution for copper-plating in the desired volume for use, wherein the additive is activator, cuprous ion complexing agent, pH stabilizer and brightening agent.

Description

technical field [0001] The invention relates to an electroplating solution, in particular to an alkaline cyanide-free copper plating electroplating solution on a steel substrate and a preparation method thereof. Background technique [0002] When performing electroplating on the surface of active metals or alloys, such as iron, zinc and their alloys, and brass, in order to ensure the bonding force between the coating and the substrate, cyanide copper plating or cyanide-free copper plating or electroless nickel plating or immersion copper treatment is required . For a long time, the cyanide pre-copper plating process has been widely used, mainly in: [0003] 1) CN in the plating solution - The complexation between ions and copper ions is stable, avoiding displacement reactions; [0004] 2) Copper exists in a monovalent form in the copper plating solution. Due to the stability of copper cyanide complex ions, the polarization of its cathodic reduction increases, and the obt...

AI Technical Summary

Problems solved by technology

[0014] The purpose of the present invention is to provide an alkaline cyanide-free copper plating solution on a steel substrate and its preparation in view of the deficiencies in the existing cyanide-free copper plating process and the characteristics of high chemical activity and easy passivation of steel materials. method

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