Cyanide-free cuprous copper-plating surface modification method for steel matrix
A technology of surface modification and electroplating copper, applied in the field of surface modification of steel substrate, can solve problems such as poor adhesion of copper plating, and achieve the effect of overcoming poor adhesion, fine and tight crystallization, and good appearance
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specific Embodiment approach 1
[0021] Embodiment one: a kind of cyanide-free cuprous electroplating copper surface modification method of the iron and steel substrate of the present embodiment is carried out according to the following steps:
[0022] (1) Preparation of cyanide-free cuprous electroplating solution: a. Dissolve 10~150mL / L acetic acid in deionized water in advance, stir evenly to obtain solution A; b. ~200g / L, the concentration of organic acid complexing agent or its sodium salt is 10~120g / L, the concentration of stabilizer is 1~60g / L, and the concentration of pH buffer agent is 10~100g / L. Copper ion thiocarbonyl complexing agent, organic acid complexing agent or its sodium salt, stabilizer and pH value buffer; c. the stabilizer weighed in step b is dissolved in solution A to obtain solution B; d. step b The weighed cuprous ion thiocarbonyl complexing agent and organic acid complexing agent or its sodium salt are dissolved in solution B, heated and stirred until dissolved, then slowly add the ...
specific Embodiment approach 2
[0027] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the cuprous ion thiocarbonyl complexing agent described in b and d of step (1) is N-methylthiourea, tetramethylthiourea, One or a combination of ethylenethiourea, thiourea or thiosemicarbazide, the concentration is 60~180g / L. Others are the same as in the first embodiment.
[0028] When the cuprous ion thiol complexing agent of this embodiment is a composition, various cuprous ion thiol complexing agents are combined in arbitrary ratios.
specific Embodiment approach 3
[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the organic acid complexing agent described in b and d of step (1) is citric acid, ethylenediaminetetraacetic acid, gluconic acid, tartaric acid, One or a combination of aspartic acid or glutamic acid, the concentration of organic acid complexing agent or its sodium salt is 15~100g / L. Others are the same as in the first or second embodiment.
[0030] When the organic acid complexing agent or its sodium salt of this embodiment is a composition, various organic acid complexing agents or its sodium salt are combined in arbitrary ratios.
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