Cyanide-free cuprous copper-plating surface modification method for steel matrix

A technology of surface modification and electroplating copper, applied in the field of surface modification of steel substrate, can solve problems such as poor adhesion of copper plating, and achieve the effect of overcoming poor adhesion, fine and tight crystallization, and good appearance

Inactive Publication Date: 2014-10-29
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problem of poor bonding force of the copper coating obtained by the existing surface modification method of cyani

Method used

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  • Cyanide-free cuprous copper-plating surface modification method for steel matrix
  • Cyanide-free cuprous copper-plating surface modification method for steel matrix
  • Cyanide-free cuprous copper-plating surface modification method for steel matrix

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specific Embodiment approach 1

[0021] Embodiment one: a kind of cyanide-free cuprous electroplating copper surface modification method of the iron and steel substrate of the present embodiment is carried out according to the following steps:

[0022] (1) Preparation of cyanide-free cuprous electroplating solution: a. Dissolve 10~150mL / L acetic acid in deionized water in advance, stir evenly to obtain solution A; b. ~200g / L, the concentration of organic acid complexing agent or its sodium salt is 10~120g / L, the concentration of stabilizer is 1~60g / L, and the concentration of pH buffer agent is 10~100g / L. Copper ion thiocarbonyl complexing agent, organic acid complexing agent or its sodium salt, stabilizer and pH value buffer; c. the stabilizer weighed in step b is dissolved in solution A to obtain solution B; d. step b The weighed cuprous ion thiocarbonyl complexing agent and organic acid complexing agent or its sodium salt are dissolved in solution B, heated and stirred until dissolved, then slowly add the ...

specific Embodiment approach 2

[0027] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the cuprous ion thiocarbonyl complexing agent described in b and d of step (1) is N-methylthiourea, tetramethylthiourea, One or a combination of ethylenethiourea, thiourea or thiosemicarbazide, the concentration is 60~180g / L. Others are the same as in the first embodiment.

[0028] When the cuprous ion thiol complexing agent of this embodiment is a composition, various cuprous ion thiol complexing agents are combined in arbitrary ratios.

specific Embodiment approach 3

[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the organic acid complexing agent described in b and d of step (1) is citric acid, ethylenediaminetetraacetic acid, gluconic acid, tartaric acid, One or a combination of aspartic acid or glutamic acid, the concentration of organic acid complexing agent or its sodium salt is 15~100g / L. Others are the same as in the first or second embodiment.

[0030] When the organic acid complexing agent or its sodium salt of this embodiment is a composition, various organic acid complexing agents or its sodium salt are combined in arbitrary ratios.

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Abstract

The invention discloses a cyanide-free cuprous copper-plating surface modification method for a steel matrix, relating to a method for modifying the surface of a steel matrix by adopting a cyanide-free cuprous plating solution. The method solves the problem of poor coating bonding force caused by a loose displaced copper layer which is easily produced when the present cyanide-free copper-plating technology is applied to surface modification of the steel matrix. The cyanide-free cuprous copper-plating surface modification method for the steel matrix comprises the steps of (1) preparing the cyanide-free cuprous plating solution from cuprous oxide, a cuprous ion thiocarbonyl complexing agent, an organic acid complexing agent or a sodium salt thereof, a stabilizer, a pH value buffer, an inhibitor and an accelerant; (2) pre-treating the steel matrix; (3) performing cyanide-free cuprous copper-plating on the steel matrix to obtain a copper coating with good bonding force on the surface of the steel matrix. The cyanide-free cuprous copper-plating surface modification method for the steel matrix can solve the problem of cyanide-free treatment when copper is directly plated on the surface of the steel matrix at present, and is favorable for environment friendliness of a steel matrix copper-plated surface modification technology.

Description

technical field [0001] The invention belongs to the field of surface modification of iron and steel substrates, and relates to a method for surface modification of iron and steel substrates by using cyanide-free cuprous electroplating copper. Background technique [0002] Copper electroplating is an important means of steel surface treatment. Although copper plating is not commonly used as the final coating of steel substrates, it can improve the overall appearance and corrosion resistance of workpieces as an intermediate coating or primer coating for surface modification of steel substrates. play a huge role. For example, industrial valves, sliding bearings, molds and pipes are usually primed with copper plating before nickel / chrome plating to improve the corrosion resistance and brightness of the workpiece. In actual industrial production, cyanide system is mostly used in the surface modification process of electroplating copper for steel workpieces, which are highly acti...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 田栋夏方诠施昆雁张洋开泰王园周长利
Owner UNIV OF JINAN
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