Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof

Abstract

The present invention discloses a succinimide cyanogen-free monovalent copper plating electroplating liquid and an electroplating method thereof, wherein the succinimide cyanogen-free monovalent copper plating electroplating liquid comprises CuCl with a content of 10-25 g / L, succinimide with a content of 49-83 g / L, a sulfite with a content of 20-40 g / L, tetraethylenepentamine with a content of 0.15-0.5 g / L, and a citrate with a content of 10-20 g / L. According to the present invention, the cuprous salt of CuCl is adopted as the copper source, the sulfite is adopted as the stabilizer of the monovalent copper ions, the succinimide is adopted as the coordination agent of the cuprous ions, the tetraethylenepentamine is adopted as the brightener, and the citrate is adopted as the electric conduction salt, such that the plating liquid has characteristics of good dispersion capacity, good deep capacity, high cathode current efficiency, and excellent plating liquid performance; and the plating layer obtained through electroplating by using the plating liquid under the acid condition has the low porosity, and the plating layer obtained by using the plating liquid has the good quality.

Description

technical field [0001] The invention relates to the technical field of electroplating copper technology, in particular to an electroplating solution and an electroplating method for succinimide cyanide-free monovalent copper plating. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid and heated concentrated sulfuric acid, and acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright nickel and microcra...

AI Technical Summary

Problems solved by technology

[0005] The existing cyanide-free copper plating generally has the technical defects that the performance of the plating solution is not ideal and the quality of the coating is not strong, which seriously restricts the complete replacement of cyanide-free copper plating in the industry.

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