Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof

A succinimide and electroplating solution technology, applied in electrodes, electrolysis process, electrolysis components, etc., can solve the problems of poor coating quality and unsatisfactory bath performance, and achieve good coating quality, excellent bath performance, and porosity. low rate effect

Inactive Publication Date: 2016-01-27
WUXI HANKWANG ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing cyanide-free copper plating generally has the technical defects that the performance of the plating solution is not ideal a

Method used

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  • Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof
  • Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof
  • Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The formulation of the electroplating solution is as follows:

[0037]

[0038]

[0039]Plating process conditions: the pulse width of single pulse square wave current is 0.4ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 55°C, and the electroplating time is 40min.

Embodiment 2

[0041] The formulation of the electroplating solution is as follows:

[0042]

[0043] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 25%, and the average current density is 0.7A / dm 2 ; The pH is 8.5, the temperature is 50°C, and the electroplating time is 30min.

Embodiment 3

[0045] The formulation of the electroplating solution is as follows:

[0046]

[0047] Plating process conditions: the pulse width of single pulse square wave current is 0.7ms, the duty cycle is 20%, and the average current density is 0.9A / dm 2 ; The pH is 9, the temperature is 45° C., and the electroplating time is 20 minutes.

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PUM

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Abstract

The present invention discloses a succinimide cyanogen-free monovalent copper plating electroplating liquid and an electroplating method thereof, wherein the succinimide cyanogen-free monovalent copper plating electroplating liquid comprises CuCl with a content of 10-25 g/L, succinimide with a content of 49-83 g/L, a sulfite with a content of 20-40 g/L, tetraethylenepentamine with a content of 0.15-0.5 g/L, and a citrate with a content of 10-20 g/L. According to the present invention, the cuprous salt of CuCl is adopted as the copper source, the sulfite is adopted as the stabilizer of the monovalent copper ions, the succinimide is adopted as the coordination agent of the cuprous ions, the tetraethylenepentamine is adopted as the brightener, and the citrate is adopted as the electric conduction salt, such that the plating liquid has characteristics of good dispersion capacity, good deep capacity, high cathode current efficiency, and excellent plating liquid performance; and the plating layer obtained through electroplating by using the plating liquid under the acid condition has the low porosity, and the plating layer obtained by using the plating liquid has the good quality.

Description

technical field [0001] The invention relates to the technical field of electroplating copper technology, in particular to an electroplating solution and an electroplating method for succinimide cyanide-free monovalent copper plating. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid and heated concentrated sulfuric acid, and acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright nickel and microcra...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18C25D21/10C25D17/10
Inventor 王军
Owner WUXI HANKWANG ELECTRIC
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