The invention discloses a method for extracting gold, silver and copper from a mobile phone circuit board. The method comprises steps as follows: step one, pretreatment of the mobile phone circuit board: the circuit board is calcined, broken, screened and subjected to magnetic separation, and metal-enriched powder and non-metal impurities are obtained through pneumatic separation; step two, metal element analysis: content of metals such as silver, copper, aluminum, zinc and the like is tested by an atomic absorption spectrometer, and content of precious metals such as gold, platinum, palladium and the like is measured by an inductively coupled plasma emission spectrometer; step three, extraction and recovery of silver and copper; step four, thiourea leaching of gold: residues obtained after silver and copper leaching with nitric acid are put in a reactor and dissolved with thiourea and ferric sulfate, and content of gold is measured; step five, gold recovery: the solution obtained after thiourea leaching of gold is transferred to a reaction container, trisodium citrate and zinc powder are added, and filter residues are subjected to electrolytic refining of gold. According to the method, extraction and recovery rate of gold, silver and copper is high, the reaction speed is high, invested cost is low, little environmental pollution is produced, and industrialization is facilitated.