The invention discloses a method for extracting gold, silver and
copper from a
mobile phone circuit board. The method comprises steps as follows: step one, pretreatment of the
mobile phone circuit board: the circuit board is calcined, broken, screened and subjected to
magnetic separation, and
metal-enriched
powder and non-
metal impurities are obtained through pneumatic separation; step two,
metal element analysis: content of metals such as silver,
copper, aluminum,
zinc and the like is tested by an atomic absorption
spectrometer, and content of precious metals such as gold,
platinum,
palladium and the like is measured by an
inductively coupled plasma emission spectrometer; step three, extraction and
recovery of silver and
copper; step four,
thiourea leaching of gold: residues obtained after silver and
copper leaching with
nitric acid are put in a reactor and dissolved with
thiourea and
ferric sulfate, and content of gold is measured; step five, gold
recovery: the solution obtained after
thiourea leaching of gold is transferred to a reaction container,
trisodium citrate and
zinc powder are added, and filter residues are subjected to electrolytic refining of gold. According to the method, extraction and
recovery rate of gold, silver and copper is high, the
reaction speed is high, invested cost is low, little environmental
pollution is produced, and industrialization is facilitated.