Method for extracting gold, silver and copper from mobile phone circuit board

A circuit board, gold, silver and copper technology, applied to the improvement of process efficiency, photography technology, instruments, etc., can solve the problems of high cost, complex metal extraction process, environmental pollution, etc.

Inactive Publication Date: 2017-11-28
SICHUAN CHANGHONG ELECTRIC CO LTD
View PDF7 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a low-toxicity, low-pollution, high-efficiency, Industrialized method for extracting gold, silver and copper from mobile phone circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for extracting gold, silver and copper from mobile phone circuit board
  • Method for extracting gold, silver and copper from mobile phone circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] (1) Pretreatment of waste mobile phone circuit boards: in the fume hood, remove the batteries, resistors, capacitors and other components on the waste mobile phone circuit boards with pliers, and place the circuit boards in a thermal resistance furnace for aerobic calcination. Calcined at 600°C for 2 hours, cut the calcined sample into small pieces of about 1cm*1cm, weighed 400 grams of the sample, placed it in a sealed universal high-speed pulverizer for mechanical crushing, and pulverized at 2000r / min In 20 seconds, the sample is divided into 2 parts, 200 grams each, and screened through a standard grading sieve respectively. The particle size is larger than 35 mesh and then crushed again. Selection, air separation and other processes, in which the metal-rich part is reserved for later use.

[0054] (2) Chemical analysis of metal elements: take the pretreated mobile phone circuit board powder and put it in the reaction vessel, add 40% nitric acid solution into the rea...

Embodiment 2

[0059] The preparation method of Example 2 is the same as that of Example 1, and the specific raw material ratio is shown in Table 1;

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle size (mesh)aaaaaaaaaa
particle size (mesh)aaaaaaaaaa
Login to view more

Abstract

The invention discloses a method for extracting gold, silver and copper from a mobile phone circuit board. The method comprises steps as follows: step one, pretreatment of the mobile phone circuit board: the circuit board is calcined, broken, screened and subjected to magnetic separation, and metal-enriched powder and non-metal impurities are obtained through pneumatic separation; step two, metal element analysis: content of metals such as silver, copper, aluminum, zinc and the like is tested by an atomic absorption spectrometer, and content of precious metals such as gold, platinum, palladium and the like is measured by an inductively coupled plasma emission spectrometer; step three, extraction and recovery of silver and copper; step four, thiourea leaching of gold: residues obtained after silver and copper leaching with nitric acid are put in a reactor and dissolved with thiourea and ferric sulfate, and content of gold is measured; step five, gold recovery: the solution obtained after thiourea leaching of gold is transferred to a reaction container, trisodium citrate and zinc powder are added, and filter residues are subjected to electrolytic refining of gold. According to the method, extraction and recovery rate of gold, silver and copper is high, the reaction speed is high, invested cost is low, little environmental pollution is produced, and industrialization is facilitated.

Description

technical field [0001] The invention relates to a method for extracting gold, silver and copper, in particular to a method for extracting gold, silver and copper from mobile phone circuit boards, and belongs to the technical field of resource reuse. Background technique [0002] With the advent of the technological revolution, the rapid popularization and frequent replacement of mobile phones, the amount of scrapped mobile phones has also increased dramatically. However, because mobile phones contain heavy metals (Pb, Cr, Cd, Hg, etc.) Cause irreparable and immeasurable harm. In addition, waste mobile phone circuit boards have double-sidedness. In addition to environmental pollution caused by improper disposal, attention should also be paid to its potential value. Waste mobile phone circuit boards contain nearly 20 kinds of non-ferrous metals and rare and precious metals, and the grades of the metals contained are comparable Dozens or even hundreds of times the grade of me...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B11/00C22B15/00C25C1/12C25C1/20
CPCC22B7/007C22B11/046C22B15/0067C25C1/12C25C1/20Y02P10/20
Inventor 杜岩岩陈正彭玲徐军
Owner SICHUAN CHANGHONG ELECTRIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap