High-conductivity high-temperature-resisting copper alloy preparing method

Abstract

The invention discloses a high-conductivity high-temperature-resisting copper alloy preparing method, and belongs to the technical field of nonferrous metal material manufacturing. Prepared atomized copper powder is subjected to reducing into copper powder after being oxidized, roughness of the copper powder surface can be improved, reflectivity of the atomized copper powder surface for lasers during laser printing operation is reduced, and work reliability of laser printing equipment is guaranteed. A supersonic speed gas atomization method is used for preparing the atomized copper powder, andthe advantages that powder granularity is fine, and the degree of sphericity is high; in the smelting process, an electrolysis copper plate can be sufficiently smelted into liquid, and the situationthat due to incomplete smelting of the electrolysis copper plate, residual solid exists in liquid copper, and consequently the prepared atomized copper powder is uneven is avoided; and the copper alloy has high electricity and heat conducting performance and also has high high-temperature resisting softening performance, the mechanical strength can be kept not reduced or slightly reduced in the high-temperature work environment, and the market requirement for high-temperature-resisting high-conductivity copper alloys is met.

Description

technical field [0001] The invention belongs to the technical field of manufacturing nonferrous metal materials, and in particular relates to a method for preparing a high-conductivity and high-temperature-resistant copper alloy. Background technique [0002] Pure copper and copper alloys are widely used in fields such as electric power, heat dissipation, piping, and decoration due to their excellent electrical conductivity, thermal conductivity, corrosion resistance, and toughness, and have become the basis for the development of modern industrial technology. However, copper has a low softening temperature, so the strength will rapidly decrease to the mechanical strength of soft copper in high temperature environments. However, in some special work situations, pure copper or copper alloys are required to maintain high electrical and thermal conductivity, and also require Has high mechanical strength. For example, in the vacuum interrupter, the hardness of the pure copper c...

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Problems solved by technology

However, for the use occasions described in the technical background of this patent, the copper alloy prepared by this technology still cannot meet the working environment requirements of 700-900 ° C; Similar to the patent, pure copper is smelted by adding Ni, Si, Zn, Cr, P and other elements, and then undergoes homogenization treatment, hot rolling, rough cold rolling, quenching, finish rolling, aging and other processes, and finally obtains a copper with electrical conductivity. 50% IACS, copper alloy with strength up to 800Mpa

The feature of this patent is that the copper alloy has high strength, but the electrical conductivity is low, and it is not clear that the high temperature softening temperature has been improved; the above patents have optimized and improved the current existing copper alloys in design, but for On the one hand, it is

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