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High-conductivity high-temperature-resisting copper alloy preparing method

A technology of high temperature resistance and copper alloy, applied in the field of high conductivity and high temperature resistance copper alloy preparation, can solve the problems of high softening temperature, low electrical conductivity, reduced electrical conductivity, etc. fine-grained effects

Active Publication Date: 2019-07-05
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for the use occasions described in the technical background of this patent, the copper alloy prepared by this technology still cannot meet the working environment requirements of 700-900 ° C; Similar to the patent, pure copper is smelted by adding Ni, Si, Zn, Cr, P and other elements, and then undergoes homogenization treatment, hot rolling, rough cold rolling, quenching, finish rolling, aging and other processes, and finally obtains a copper with electrical conductivity. 50% IACS, copper alloy with strength up to 800Mpa
The feature of this patent is that the copper alloy has high strength, but the electrical conductivity is low, and it is not clear that the high temperature softening temperature has been improved; the above patents have optimized and improved the current existing copper alloys in design, but for On the one hand, it is still a single performance. For example, the high temperature softening temperature of the patent CN107287468A is only 35°C higher than that of the existing copper alloy, which cannot meet the requirements for special occasions; Effect of high temperature softening temperature element improvement
The existing copper alloys on the market currently have high electrical conductivity, but cannot guarantee a high softening temperature to meet the requirements for high-conductivity and high-strength copper alloys in high-temperature working environments.
Dispersion-strengthened copper alloy has a high softening temperature, but the material preparation process can only meet the performance requirements through hot extrusion and large deformation properties, so only small-diameter bars can be prepared, and structural and complex parts cannot be prepared

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0031] A method for preparing a high-conductivity and high-temperature-resistant copper alloy mainly includes the following steps:

[0032] (1) Raw material selection

[0033] Weighing 90wt% atomized copper powder and 10wt% WC as raw materials by weight, stand-by, wherein the atomized copper powder particle size is 5 μm, and the WC powder particle size is 0.3 μm. If the particle size is too large or too small, then The specific surface area of ​​the formed atomized copper powder is small or large, which cannot meet the requirements and affects the performance of the prepared copper alloy;

[0034] (2) Powder mixing

[0035] Put the copper powder, WC and AlN powder of the above weight into the atmosphere protection ball mill, the ball to material ratio is 1:2, vacuumize, when the vacuum pressure in the atmosphere protection ball mill is 1Pa, then fill the hydrogen to 0.6Mpa, and then ball mill for 1h;

[0036] (3) 3D modeling

[0037] Use 3D printing software to model accord...

Embodiment 2

[0045] A method for preparing a high-conductivity and high-temperature-resistant copper alloy mainly includes the following steps:

[0046] (1) Raw material selection

[0047] Weigh 95wt% atomized copper powder and 5wt% AlN as raw materials for use, wherein the atomized copper powder particle size is 25 μm, and the AlN powder particle size is 3 μm. If the particle size is too large or too small, it will form The specific surface area of ​​the atomized copper powder is small or large, which cannot meet the requirements and affects the performance of the prepared copper alloy;

[0048] (2) Powder mixing

[0049] Put the copper powder, WC and AlN powder of the above weight into the atmosphere protection ball mill, the ball to material ratio is 1:3, vacuumize, and when the vacuum pressure in the atmosphere protection ball mill is 5Pa, fill it with hydrogen to 0.6Mpa, and then ball mill for 3h;

[0050] (3) 3D modeling

[0051] Use 3D printing software to model according to the ...

Embodiment 3

[0059] A method for preparing a high-conductivity and high-temperature-resistant copper alloy mainly includes the following steps:

[0060] (1) Raw material selection

[0061] Weigh the mixture of 99.5wt% atomized copper powder and 0.5wt% WC and AlN as raw material by weight, and set aside for use, wherein the atomized copper powder has a particle size of 50 μm, and the powder particle size of the WC and AlN mixture is 5 μm. If the diameter is too large or too small, the specific surface area of ​​the formed atomized copper powder is small or large, which cannot meet the requirements and affects the performance of the prepared copper alloy;

[0062] (2) Powder mixing

[0063] Put the above-mentioned weight of copper powder, WC, and AlN powder into the atmosphere-protected ball mill, the ball-to-material ratio is 1:5, vacuumize, and when the vacuum pressure in the atmosphere-protected ball mill is 10Pa, fill it with hydrogen to 0.6Mpa, and then ball mill for 5h;

[0064] (3) ...

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Abstract

The invention discloses a high-conductivity high-temperature-resisting copper alloy preparing method, and belongs to the technical field of nonferrous metal material manufacturing. Prepared atomized copper powder is subjected to reducing into copper powder after being oxidized, roughness of the copper powder surface can be improved, reflectivity of the atomized copper powder surface for lasers during laser printing operation is reduced, and work reliability of laser printing equipment is guaranteed. A supersonic speed gas atomization method is used for preparing the atomized copper powder, andthe advantages that powder granularity is fine, and the degree of sphericity is high; in the smelting process, an electrolysis copper plate can be sufficiently smelted into liquid, and the situationthat due to incomplete smelting of the electrolysis copper plate, residual solid exists in liquid copper, and consequently the prepared atomized copper powder is uneven is avoided; and the copper alloy has high electricity and heat conducting performance and also has high high-temperature resisting softening performance, the mechanical strength can be kept not reduced or slightly reduced in the high-temperature work environment, and the market requirement for high-temperature-resisting high-conductivity copper alloys is met.

Description

technical field [0001] The invention belongs to the technical field of manufacturing nonferrous metal materials, and in particular relates to a method for preparing a high-conductivity and high-temperature-resistant copper alloy. Background technique [0002] Pure copper and copper alloys are widely used in fields such as electric power, heat dissipation, piping, and decoration due to their excellent electrical conductivity, thermal conductivity, corrosion resistance, and toughness, and have become the basis for the development of modern industrial technology. However, copper has a low softening temperature, so the strength will rapidly decrease to the mechanical strength of soft copper in high temperature environments. However, in some special work situations, pure copper or copper alloys are required to maintain high electrical and thermal conductivity, and also require Has high mechanical strength. For example, in the vacuum interrupter, the hardness of the pure copper c...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C32/00C22C1/05C22C1/10B22F9/08C22F1/08
CPCB22F9/082C22C1/05C22C9/00C22C32/0047C22F1/08
Inventor 王文斌刘凯王小军李鹏张石松师晓云赵俊杨斌
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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