Nano-copper soldering paste, preparing method thereof and copper-copper bonding method

A nano-copper and solder paste technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problem of easy oxidation of nano-copper solder paste sintering, and achieve the effects of easy acquisition, cost reduction, and oxidation avoidance.

Active Publication Date: 2019-02-12
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is to provide a kind of nano-copper solder paste, its preparation method and the method utilizing this kind of nano-copper solder paste to realize copper-copper bonding, so as to solve the problem that the existing nano-copper solder paste is sintered and easily oxidized in an air atmosphere. question

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  • Nano-copper soldering paste, preparing method thereof and copper-copper bonding method
  • Nano-copper soldering paste, preparing method thereof and copper-copper bonding method

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[0026] In some embodiments of the present invention, a method for preparing nano copper solder paste is also provided, comprising the steps of: cleaning the nano copper particles, ultrasonically treating them with an ethanol solution containing an organic acid, and then mixing with alcohol amine and a viscosity modifier Mix and grind to obtain the nano copper solder paste.

[0027] In some specific embodiments of the invention, the organic acid described in the above preparation method is selected from formic acid, acetic acid, glycolic acid, oxalic acid or lactic acid; the cleaning step can use dilute acid solution for stirring or ultrasonic cleaning.

[0028]In some embodiments of the present invention, there is also provided a method for copper-copper bonding using the above-mentioned nano-copper solder paste, including the following steps: (1) preparing a sample to be bonded: applying the nano-copper solder paste to The surface to be bonded of at least one copper sample, a...

Embodiment 1

[0034] The nano-copper soldering paste of this embodiment comprises: nano-copper particles: 80%, 3-dimethylamino-1,2-propanediol: 15%, and viscosity modifier ethylene glycol: 5%.

[0035] Nano-copper particles with a particle size of 90nm are used, and the surface oxide is removed by ultrasonic cleaning with 10% volume ratio of dilute sulfuric acid. After cleaning and centrifugation, 10% mass ratio of lactic acid alcohol solution is used for ultrasonic treatment. Amino-1,2-propanediol is mixed, fully ground in a mortar, and ethylene glycol is added in proportion as a viscosity regulator to obtain a nano-copper solder paste with a moderate viscosity. The mass percentage of nano-copper particles in the solder paste is 80% %, the rest are alcohol amines and viscosity modifiers.

[0036] The copper sample is a red copper column with a diameter of 5mm. After the surface is polished, treated with dilute sulfuric acid, and cleaned, a 150-micron nano-copper solder paste is applied to ...

Embodiment 2

[0039] The nano-copper solder paste of this embodiment comprises: nano-copper particles: 90%, 3-dimethylamino-1,2-propanediol: 10% in terms of mass percentage.

[0040] Using nano-copper particles with a particle size of 90nm, use 10% volume ratio of dilute sulfuric acid to ultrasonically clean to remove surface oxides. Amino-1,2-propanediol is mixed and thoroughly ground in a mortar to form a solder paste, the proportion of copper in the solder paste is 90%, and the rest is alcoholamine.

[0041] The copper sample is a copper column with a diameter of 5mm. After the surface is polished, treated with dilute sulfuric acid, and cleaned, a 150-micron-thick solder paste is applied to the surface to be bonded of at least one copper sample by scraping, and the two copper samples are paired. After sticking, a copper-solder paste-copper "sandwich" sample to be bonded is obtained. Preheat at 100°C for 3 minutes, then carry out thermocompression welding, the pressure is 4MPa, the tempe...

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Abstract

The invention belongs to the technical field of electronic materials, and discloses nano-copper soldering paste, a preparing method thereof and a copper-copper bonding method achieved through the nano-copper soldering paste. The nano-copper soldering paste comprises, by mass percent, 50 to 90% of nano-copper particles, 5 to 25% of hydramine and 0 to 45% of a viscosity modifier. The nano-copper soldering paste is used for copper-copper bonding, the sintering temperature can be reduced, oxidation and agglomeration of the nano-copper particles can be avoided, in the 200 DEG C air, sintering can be finished, and the copper-copper inter-connection structure with the higher shear strength can be obtained.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a nano-copper solder paste, a preparation method thereof and a method for realizing copper-copper bonding by using the nano-copper solder paste. Background technique [0002] With the improvement of electronic packaging density and the rapid development of wide bandgap semiconductor power devices, the use of traditional tin-based lead-free solders for copper-copper bonding has the following defects: (1) Solder will form a relatively small bond with copper materials during the process. Thick intermetallic compound (IMC) layer, IMC is brittle, and it is prone to fracture and failure during the use of the device; (2) The melting point of solder is low, and when it is used as a chip mounting material for wide bandgap semiconductor high-power chip packaging, it cannot Adapt to the high temperature environment when power devices work. [0003] Solder paste mad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/302B23K35/40
Inventor 张兆强亓恬珂肖斐
Owner FUDAN UNIV
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