This invention belongs to the field of
electronic packaging and
soldering materials technology, and relates to a lead-free solder
powder for
reflow soldering and its preparation method. This lead-free solder
powder is based on a Sn-Ag-Cu
alloy system, and achieves melt purification, β-Sn grain refinement, and interface IMC stabilization by adding
trace amounts of Ce and Ni elements. Its composition, by
mass percentage, is: Ag 2.9%–3.1%, Cu 0.45%–0.55%, Ce 0.01%–0.10%, Ni 0.01%–0.05%, with the balance being Sn and impurities. During preparation, a Ce-Ni master
alloy is used to introduce microalloying elements, followed by vacuum melting,
inert gas atomization, and surface treatment to obtain spherical solder
powder. The resulting solder powder has
low oxygen content, good wettability, slow interface IMC growth after reflow, high solder joint strength, and excellent thermal
cycling reliability, making it suitable for high-reliability
electronic packaging applications.