Preparation method for three-dimensional structure graphene reinforced copper matrix composite material

A copper-based composite material and three-dimensional structure technology, which is applied in metal material coating technology, ion implantation plating, gaseous chemical plating, etc., can solve the problem of thermal conductivity and electrical conductivity decline, insufficient contact of graphene, and easy formation of holes and other problems, to achieve the effect of improving strength, facilitating industrial production, and simple methods

Active Publication Date: 2016-03-09
HARBIN INST OF TECH
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem that in the existing graphene-reinforced copper-based composite materials, liquid copper is difficult to wet on the surface of graphene, and holes and defects are easily formed at the interface, which leads to insufficient contact b

Method used

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specific Embodiment approach 1

[0020] Specific embodiment one: the preparation method of a kind of three-dimensional structure graphene reinforced copper-based composite material described in this embodiment is specifically carried out according to the following steps:

[0021] 1. Put copper foam in acetone for ultrasonic pretreatment for 10-20 minutes to obtain pretreated copper foam. Place the pretreated copper foam in a chemical vapor deposition device. After vacuuming, introduce hydrogen gas to adjust the hydrogen gas. The flow rate is 2sccm~20sccm, and the pressure in the chemical vapor deposition device is adjusted to be 10 5 Pa, at a pressure of 10 5 Under Pa and hydrogen atmosphere, raise the temperature to 800°C-1000°C, and anneal at a temperature of 800°C-1000°C for 10min-30min;

[0022] 2. Introduce methane, adjust the gas flow rate of methane to 10 sccm ~ 100 sccm, when the pressure is 10 5 Deposition is carried out under the conditions of Pa and temperature of 800°C to 1000°C, and the deposit...

specific Embodiment approach 2

[0032] Specific embodiment two: the difference between this embodiment and specific embodiment one is: in step three, vacuumize to 5×10 -4 Below Pa, use copper as the evaporation material, adjust the evaporation current to 100A-120A, and the evaporation time to 5s-30s. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0033] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: in step three, vacuumize to 5×10 -4 Below Pa, use copper as the evaporation material, adjust the evaporation current to 100A-120A, and the evaporation time to 30s. Others are the same as in the first or second embodiment.

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Abstract

The invention provides a preparation method for a three-dimensional structure graphene reinforced copper matrix composite material, and relates to a preparation method for a composite electrode material. The problems that in an existing graphene reinforced copper matrix composite material, the contact of graphene and copper is insufficient, and the thermal conductivity and the electrical conductivity of the prepared graphene reinforced copper matrix composite material are reduced due to the fact that liquid copper is difficult to wet on the surface of the graphene, and holes, defects and the like are easily formed in the interface are solved. The method comprises the following steps that firstly, three-dimensional graphene is prepared on a foam copper matrix through the method of chemical vapor deposition; secondly, a layer of copper is evaporated on the surface of the graphene; and lastly, spark plasma sintering is conducted on the three-dimensional graphene/foam copper material evaporated with the copper and copper powder. The method is used for preparing the three-dimensional structure graphene reinforced copper matrix composite material.

Description

technical field [0001] The invention relates to a method for preparing composite materials. Background technique [0002] Pure copper has good thermal conductivity and electrical conductivity, but the strength of pure copper material itself is relatively low. Adding reinforcements to pure copper to prepare copper-based composite materials is an effective way to improve its strength without losing the excellent properties of pure copper itself. way. Traditional microcomposite copper alloys can improve the strength of copper alloys, but greatly reduce the electrical and thermal conductivity of copper alloys. [0003] Graphene is a two-dimensional carbon nanomaterial composed of a single layer of carbon atoms, which has excellent electrical, optical, thermal, mechanical and chemical properties. Because graphene has extremely high mean free path and elastic constant, its thermal conductivity can be as high as (4.84±0.44)×10 3 ~(5.30±0.48)×10 3 W / m -1 K -1 , and has very go...

Claims

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Application Information

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IPC IPC(8): C23C16/26C23C14/18C23C14/24B22F3/105
CPCB22F3/105C23C14/18C23C14/24C23C16/26
Inventor 亓钧雷罗大林陈树林林景煌王泽宇冯吉才
Owner HARBIN INST OF TECH
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