The invention discloses a preparation
system for forming a
liquid metal conductive pipeline through microfluidic injection, and belongs to the technical field of flexible electronic device manufacturing. According to the
system, a novel preparation method is adopted, and
liquid metal is directly injected into a biocompatible
polymer microchip through an air
diffusion mechanism, so that a conductive pipeline with excellent
conductivity and flexibility is formed. According to the
system disclosed by the invention, the
surface tension of the
polydimethylsiloxane chip is reduced by utilizing a
surface modification technology, and a constant low-
pressure injection mode is adopted, so that the problems that a micro-channel is difficult to completely fill with
liquid metal, bubbles are easy to generate and the filling efficiency is low in a traditional method are effectively solved. The liquid
metal conductive pipeline prepared by the system has
high conductivity, high
thermal conductivity, excellent
ductility and
repeatability, is suitable for manufacturing a flexible circuit board with a complex three-dimensional irregular pattern, and provides a brand new preparation technology for the fields of wearable equipment, flexible sensors and the like; meanwhile, the problem that a traditional circuit board is difficult to modify and repair is solved, the circuit is effectively protected, and
high fidelity is achieved.