Equipment for producing bonding wire for packaging semiconductor

Abstract

The invention discloses equipment for producing a bonding wire for packaging a semiconductor, which comprises a wire releasing device, a wire-drawing machine, a quenching and tempering device and a take-up device, wherein a metal wire in the wire releasing device is sent to the wire-drawing machine through a leading mechanism; the wire-drawing machine is arranged on one side of a wire outlet of the wire releasing device and comprises a wire-drawing component; the metal wire led out of the leading mechanism of the wire releasing device is connected to a wire-drawing component capable of gradually drawing the outer diameter of the metal wire small; the quenching and tempering device is arranged on one side of a wire outlet of the wire-drawing machine and comprises a wire sending device, a washing device, a coating device, an annealing device and a roasting oven; a thin metal wire conforming to specifications and pulling out of the wire-drawing machine is sent to the washing device through the wire sending device; the washed metal wire enters the annealing device for annealing; the annealed metal wire enters the coating device for coating; the coated metal wire enters the roasting oven for drying and then enters a cooling device for cooling; the wire take-up device is provided with a wire containing tray for collecting a finished wire, and the wire containing tray is connected with a driving device and driven by the driving device.

Description

[technical field] [0001] The invention relates to a production equipment for bonding wires for semiconductor packaging, which has the functions of wire drawing, quenching and tempering (annealing) and separation and winding. [Background technique] [0002] Semiconductor packaging is the process of arranging, fixing and connecting semiconductor components and other components on a frame or substrate by using film technology and micro-connection technology, leading out terminals, and potting and fixing them through plastic insulating media to form an overall three-dimensional structure. . Provide energy and control signals for the normal operation of the chip, and provide heat dissipation and protection functions. Lead frames and bonding wires play an important role in the semiconductor packaging process. Lead frame is used as an integrated circuit chip carrier, and with the help of bonding wires, the internal circuit leads (bonding points) of the chip are electrically conne...

AI Technical Summary

Problems solved by technology

This production method increases the number of repeated pay-offs, and the increase in the number of pay-offs leads to an increase in the probability of wire breakage and damage to the wire surface, and it is easy to increase the twist and curl of the bonding wire; at the same time, it also increases various The storage and turnover of standard bare wires; and the bare wires that have been placed for a long time and are in a tight state cause many quality problems due to their own physical changes (shape, internal structure, stress fracture, oxidation corrosion, etc.)

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