158 results about "Bare metal" patented technology

The invention relates to a sand feeding method for a diamond wire saw. The method comprises the following steps of: (1) preparing a diamond electroplating solution, wherein each litre of the electroplating solution comprises 10-20g of diamond, 100-240g of NiSO4, 40-100g of NiCl2, 10-50g of CoSO4 and 40-80g of H2BO3; (2) adding the electroplating solution to a sand feeding tower, wherein the sand feeding tower is in the shape of a column or polygon and is arranged vertically, and 2 to 8 Ni anodes are uniformly arranged on the inner wall of the sand feeding tower; and (3) making a bare metal wire penetrate into the bottom of the sand feeding tower and out of the tower top at a speed of 2-8 m/min; by adopting the bare metal wire as the cathode and Ni as the anode during the penetration of the bare metal wire, applying DC (Direct current) and plating diamond on the bare metal wire. The diamonds on the diamond wire saw prepared by the invention are uniformly distributed and are not accumulated.

A switch module of built-in anti-surge disconnection structure mainly comprises an overcurrent protection switch and has anti-surge and disconnection structures ingeniously built inside a fire-proof and heat-resisting housing. The present invention comprises a switch area formed by a binary alloy conductive spring leaf and two connecting points, an anti-surge area formed by at least one bare metal oxide varistor placed in the housing and a plurality of conductive plates, and a disconnection area formed by a spring element, a band, and a thermo-sensitive piece. When the connecting points in the switch area are contacting with each other—turning on the switch—and an overvoltage occurs, the temperature of the metal oxide varistor would suddenly rise up to a degree higher than a pre-determined number, melting the thermo-sensitive piece, loosening and displacing the band, thus ejecting the spring element and forcing the connecting points detaching from each other to turn off the switch, so as to ensure more of electricity safety.

The application discloses a private network access method and system based on virtual switches and SDN technology. The method comprises the steps of: dividing a physical server into a network node and a computing node; establishing a plurality of virtual switches on the network node; establishing a private network and allocating a virtual local area network in a corresponding computing node, so as to bind a port for connecting a second-layer switch and the computing node to the virtual local area network; setting the virtual local area network for a second virtual switch; setting a network mode of a tenant as a virtual extensible local area network; and allocating a network identifier, which is related to the virtual local area network, of the virtual extensible local area network of another virtual switch, so that the computing node and the network identifier communicates corresponding to a host or a virtual machine. The method conveniently separates different physical servers rented by different tenants, reduces the dependence to a physical hardware equipment for adding a bare metal physical server into the software defined network, and is unnecessary to use a programmable switch.

The invention provides a bare metal server deployment method and device. The method comprises the steps that a centralized deployment management device binds identification information of bare metal servers with corresponding configuration templates which at least include OS configuration templates; when the centralized deployment management device finds that one bare metal server has access to the network, the OS configuration template bound with the identification information of the bare metal server is found according to the identification information of the bare metal server; according to OS information needing to the installed when the bare metal server is deployed in the OS configuration template, a response file used during silent OS installation is generated for the bare metal server, and a PXE boot file is generated for the bare metal server; the centralized deployment management device logs into the bare metal server according to access information, stored in the centralized deployment management device, of the bare metal server, and a next first-choice boot entry is set on the bare metal server as PXE boot. According to the bare metal server deployment method and device, the bare metal servers can be automatically deployed in batches.

Grooves are formed along portions of the side edges of a turbine bucket platform and open through the side edges of the surface of the platform exposed to the hot gas path of the turbine. A bond coat is applied to the groove followed by a thermal barrier coating which is preferably plasma sprayed onto the bond coat. The thermal barrier coating thickness protects the coating beyond the surface of the bare metal of the platform side and is then abraded or ground to lie flush with the bare metal surface. Thus, the side faces of the platform have a thermal barrier coating to reduce oxidation.

A guidewire has a proximal portion and a distal portion. The distal portion may be coated, as with a hydrophilic or other coating, or may be uncoated. The proximal portion, however, is coated with a specially lubricious coating that serves to reduce resistance and to prevent lock up as the guidewire moves through a guiding catheter. The proximal portion may, for example, be coated with a base layer, such as TEFLON® (polytetrafluoroethylene), and one or more top layers, such as a silicone-based layer. In one approach, two silicone-based top layers are applied. Alternatively, a top layer of spray PTFE, paraffins, olefins, and/or fats may be applied. As an alternative, the base layer may be optional, such that the top layer or layers is coated onto bare metal, or a base other than TEFLON® may be used.

A stent having a drug eluting formulation has three components: 1) Anti-neointimal hyperplasia or anti-restenosis agent 2) Main polymer 3) Additive polymer

The anti-neointimal hyperplasia or anti-restenosis agent includes, but not limited to, Paclitaxel, Taxol, Rapamycin, Tacrolimus, Actinomycin D, Methotrexate, Doxorubicin, cyclophosphamide, and 5-fluorouracil, 6-mercapatopurine, 6-thioguanine, cytoxan, cyclosporine, cytarabinoside, cis-platin, chlorambucil, busulfan, and any other drug that can inhibit cell proliferation, and combinations thereof. The main polymer includes, but not limited to, polystyrene, parylene and polyurethane. The additive polymer includes, but not limited to, polyethylene glycol capped with diisocyanate moiety (NCO-PEG).

9.0 g of parylene, 0.6 g of tacrolimus, 0.4 g of NCO-PEG and 0.01 g of triethylene amine were dissolved in 90 g of tetrahydrofuran. The resulting mixture was heated at 40° C. for 30 minutes and cooled to room temperature. To the solution was added 0.1 g of pH 8.0 aqueous solution and mixed thoroughly. The resulting solution is applied to bare metal stents for coating.

A submersible electrical connector intended for use in a power distribution network permits a metal to stripped metal conductor connection to be visually inspected and verified by the installer while eliminating many opportunities for human error present with existing connectors. The connector in one embodiment includes a generally cup or dome-shaped enclosure which is preferably transparent. An open end of the enclosure mates with an upper seal body and a connector plate has a number of apertures adapted to receive the bare metal ends of conductors or wires inserted through the upper seal body. Each aperture in the connector has an associated set screw for securing the conductor thereto. A molded seal member is adapted to mate with the upper seal body and to provide a water-tight connection when mated with the enclosure. The seal member has a number of seal ducts each aligned with one of the apertures in the connector. The seal ducts provide a water-tight seal around the plastic sheath of the conductor when installed in the assembly. Each seal duct initially includes a missile-shaped wire way guide plug inserted therein. Each wire way guide plug can be opened at the bottom to receive the exposed end of the conductor therein. The wire way guide plugs remain installed in the seal ducts to seal them until a conductor is inserted through the associated seal duct.

The intravascular adult stem cell rack for preventing and treating angiostenosis includes one bare metal rack and one protein coating coated to the surface of the bare metal rack to promote the adhesion, proliferation and directional differentiation into endothelial cell of the adult stem cell. There may be also one polymer coating in between. The protein coating includes one antibody layer, one polypeptide/medicine layer and one cell factor layer. The present invention can form endothelium in the surface of the rack, decrease injury to endothelium, and prevent and treat angiostenosis.

Some embodiments provide a method for a compute manager that manages (i) virtual machines executing on host computers and (ii) physical computers. The method uses a first set of application programming interfaces (APIs) to communicate with a virtual machine (VM) executing on a host first computer via a hypervisor executing on the host first computer. The method uses the first set of APIs to communicate with a second computer via a smart network interface controller (NIC) of the second computer, wherein the smart NIC translates the first set of APIs into a different, second set of APIs for the second computer so that the compute manager manages the VM and the second computer with the same first set of APIs.

The invention provides a vertebral artery stent and a manufacturing method thereof. The vertebral artery stent comprises multiple unit ring structures, multiple connection structures and a medicament coating. The multiple unit ring structures are arrayed in an axial direction. The multiple connection structures are connected to the multiple unit ring structures to form a net-post-shaped structure. The medicament coating is only coated on the outer surface of the net-post-shaped structure. The medicament coating contains anti-stenosis medicament components. The vertebral artery stent and the manufacturing method thereof have the following beneficial effects: by coating the medicament coating on the outer surface of the net-post-shaped structure, anti-stenosis medicament can be released by the medicament coating as compared with a conventional bare metal support used for vertebral artery so that restenosis is effectively prevented; in addition, the medicament coating is only coated on the outer surface of the net-post-shaped structure; compared with an intravascular stent with inner and outer sides having coatings or the overall coating, the control releasing capability of medicament is enhanced by a single-layer coating; adverse effect of medicament is reduced; and treatment efficiency of medicament is improved.

Some embodiments provide a method for operating a physical server in a network. The method stores multiple copies of a virtual machine (VM) image at a network-accessible storage. The method uses a first copy of the VM image as a virtual disk to execute a VM on a hypervisor of a first physical computing device. The method uses a second copy of the VM image as a virtual disk accessible via a smart network interface controller (NIC) of a second physical computing device to execute an operating system of the second physical computing device.

Apparatus and methods for evenly distributing electric current density over a surface of at least one of an active electrode and a return electrode during electrosurgery, wherein the active and/or return electrode includes a spiral inductor. The spiral inductor may include a low electrical resistivity material or a spiral bare metal surface for contacting the patient's body. In a multi-layer spiral inductor having a plurality of stacked spirals, each turn of a first spiral may be electrically coupled in series to a radially corresponding turn of each successive one of the stacked spirals; and each turn of the innermost spiral may be electrically coupled to an adjacent, radially outward turn of the outermost spiral.

The embodiment of the invention provides a bare metal server network configuration method and system and related equipment, which are used for realizing network configuration and network isolation ofbare metal servers of different tenants. In the embodiment of the invention, a unified deployment network is set, the bare metal servers of all tenants are located in the same deployment network in the deployment process, and when the deployment of the bare metal servers is completed, the bare metal servers are switched from the deployment network to tenant networks. In the whole network configuration process, a controller adaptively controls ip allocation of a dhcp server of the deployment network and dhcp servers of the tenant networks to the bare metal servers in sequence, and adaptively controls network switching. After the deployment is completed, the bare metal servers of different tenants are located in different tenant networks, are isolated from each other and cannot communicate with each other, so that the network isolation of the bare metal servers of different tenants is realized.

This invention is about a packaging manufacturing process of semiconductor chip and its structure, and its manufacturing process includes: provide a substrate containing an image sensor chip and insulation colloid, and its image sensor chips contains solder pad and active region; cover a transparent insulator on the active region; form an insulating layer on the surface of the substrate; open a number of openings to expose welding pad; form a number of cross-cutting holes on the outer surface of the image sensor chips, and these holes run through insulation layer and insulation colloid; form a metal layer on the surface of the insulation layer, opening, solder pad surface, pass through holes and the basement, and extend the solder pad to the bottom surface of the basement; pattern the bare metal layers to expose the top region of transparent insulation layer and remove part of the metal layer on the bottom surface of the substrate; cut and form packaging structure containing a single image sensor chip.

A microcode (uCode) hot-upgrade method for bare metal cloud deployment and associated apparatus. The uCode hot-upgrade method applies a uCode patch to a firmware storage device (e.g., BIOS SPI flash) through an out-of-band controller (e.g., baseboard management controller (BMC)). In conjunction with receiving a uCode patch, a uCode upgrade interrupt service is triggered to upgrade uCode for one or more CPUs in a bare-metal cloud platform during runtime of a tenant host operating system (OS) using an out-of-bound process. This innovation enables cloud service providers to deploy uCode hot-patches to bare metal servers for persistent storage and live-patch without touching the tenant operating system environment.

The invention discloses a method, a system and equipment for installing a pre-start running environment, and a storage medium. The method comprises the following steps: deploying Openstack at a deployment node, and installing a network card at a bare metal node; respectively creating a first network port and a second network port of a deployment network at the deployment node, adding the second bare metal port to a first network bridge of the bare metal node, binding a unique identification code of the first network port to the second bare metal port, and issuing flow tables of the first network port and the deployment network to the first network bridge at the bare metal node; creating a second network bridge at the deployment node, setting the mac address of the second network bridge as the mac address of the second network port, binding the unique identification code of the second network port to the second network bridge, and issuing the flow table of the second network port and the deployment network to the second network bridge at the deployment node; and receiving a request of installing according to the pre-starting operation environment sent by the bare metal node at the deployment node based on the first network bridge and the second network bridge, and installing according to the request.