ReBCO high temperature superconducting wire bonding device and bonding method using same

Abstract

Disclosed are a second generation ReBCO high temperature superconducting wire bonding device and a bonding method using the same. The apparatus is capable of manufacturing a persistent current mode and a sufficiently long superconducting wire with nearly zero resistance at a bonding portion, compared to prior normal conductive bonding, by subjecting only superconductive layer materials to micro part melting diffusion or solid diffusion pressure welding in a state where the surfaces of ReBCO high temperature superconducting layers are in direct contact with each other, without an intermediate medium such as a solder or filler.

Description

Technical field [0001] The present invention relates to a ReBCO high-temperature superconducting wire bonding device and a bonding method using the same. More specifically, it relates to the following ReBCO high-temperature superconducting wire bonding device and a bonding method using the same. Under vacuum conditions, only partial pressure and heating of the second generation After the superconducting layer of the high-temperature superconducting wire is joined, the superconductivity that disappears during the joining process can be restored by repressing it in an oxygen atmosphere. Background technique [0002] Generally, the thickness of a superconducting wire is 60-90μm, and there are multiple layers of lamination. Among them, the substance flowing into the superconducting superconductor layer is made of ReBCO (ReBa 2 Cu 3 O 7-x , Where Re is a ceramic composite compound composed of RareEarth rare earth elements, 0=x=0.6). The thickness of the ReBCO layer is 1 to 3 μm. As ra...

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Problems solved by technology

[0004] Therefore, even if a superconductor with a resistance of "0" is developed, it is meaningless if a high resistance is displayed at the junction, and Joule heat is generated due to the resistance of the junction, and quenching (quenching) (conversion from superconducting to normal conduction) occurs, causing refrigeration agent evaporation loss, and it is impossible to use the continuous current mode. Due to the power loss of the junction, additional external power needs to be supplied, which will eventually make the system unstable.

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