Substrate, flexible electronic component and manufacturing method of flexible electronic component

A technology for flexible electronic devices and electronic components, which is applied in the manufacture of extensible conductors/cables, extensible conductors, extensible conductor cables, etc. problem, to achieve the effect of improving tensile properties

Active Publication Date: 2018-09-11
浙江荷清柔性电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the strain is too large, the interconnection 100 will be damaged due to this interfaci

Method used

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  • Substrate, flexible electronic component and manufacturing method of flexible electronic component
  • Substrate, flexible electronic component and manufacturing method of flexible electronic component
  • Substrate, flexible electronic component and manufacturing method of flexible electronic component

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no. 1 approach

[0032] figure 2 The schematic three-dimensional structure of the flexible electronic component according to the first embodiment of the present invention is shown in , which is the interconnection wire and the corresponding base part of the flexible electronic device. figure 2 The left-right direction in is the lengthwise direction of the flexible electronic component, and in this embodiment, it is desired to improve the stretchability of the flexible electronic component in its lengthwise direction. Below, will figure 2 The left-right direction in is used as an example of "first direction".

[0033] figure 2 The illustrated flexible electronic component includes interconnection wires 100 and a substrate 300 for carrying the interconnection wires 100 . The interconnection wire 100 is, for example, a wire made of metal, and the substrate 300 is, for example, a flexible substrate made of PDMS. The base 300 is provided with a plurality of bosses 301 arranged along the fir...

no. 2 approach

[0055] The present embodiment is a manufacturing method for manufacturing the flexible electronic component according to the first embodiment. Specifically, the manufacturing method of this embodiment includes the following steps: a base forming step, a wire manufacturing step, and a transfer printing step.

[0056] In the base forming step, the specific size of the base 300 is determined according to the first embodiment, and a mold corresponding to the base 300 is prefabricated, and the base 300 is cast in the mold.

[0057] In the wire manufacturing step, the specific size of the interconnection line 100 is determined according to the first embodiment, and the interconnection line 100 is prepared by means of, for example, a photolithography process.

[0058] In the transfer step, the interconnection 100 is transferred onto the substrate 300 by, for example, a transfer method.

[0059] The above-mentioned substrate forming step and lead manufacturing step are not in sequenc...

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Abstract

The invention relates to a substrate used for a flexible electronic device, a flexible electronic component and a manufacturing method of a flexible electronic component. The substrate is made of stretchable flexible material and is used for holding conductors. The substrate has a surface and a plurality of bosses arranged on the surface. The plurality of bosses are arranged in a first direction,and a recessed portion is arranged between every two adjacent bosses in the first direction. When the substrate is holding the conductors, the conductors are attached to the bosses and parts of the conductors, extending in the recessed portion between every two adjacent bosses, will not touch the bottom surface of the recessed portion. According to the invention, the tensile performance of the whole flexible electronic device can be improved while the safety of the interconnection lines is guaranteed.

Description

technical field [0001] The present invention relates to a substrate capable of improving the stretchability of flexible electronic devices, a flexible electronic component with improved stretchability, and a method for manufacturing the flexible electronic component. Background technique [0002] Since the birth of stretchable flexible electronic devices, higher flexibility and stretchability (also known as ductility) have been the constant pursuit of device structure designers. Current stretchable and flexible electronic devices are mainly realized through the integration of functional hard thin film devices and flexible substrates (hereinafter referred to as substrates). The hard film devices are connected by metal interconnection lines. The substrate is for example made of a flexible polymer such as polydimethylsiloxane (PDMS). [0003] Both metal interconnects and flexible substrates contribute to the stretchability of flexible electronics. The stretchability is usual...

Claims

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Application Information

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IPC IPC(8): H01B7/06H01B13/008
CPCH01B7/06H01B13/008
Inventor 冯雪赵倩马寅吉梁紫微
Owner 浙江荷清柔性电子技术有限公司
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