Technique for preparing tungsten copper heat-sink and electric packaging material

Abstract

The invention provides a novel process for preparing tungsten-copper heat sink and electronic package materials, in order to overcome the problems that the prior tungsten-copper heat sink and electronic package materials are not excellent enough in quality, high in preparation cost and low in production efficiency. The process comprises the steps of preparing powder, adding inducers, mixing materials, molding for automatic forming, performing isostatic pressing and covering, presintering and infiltrating liquid copper. The process which is adopted to prepare the tungsten-copper heat sink and electronic package materials has the advantages of low cost and high production efficiency; in addition, the prepared tungsten-copper heat sink and electronic package materials are compact in structure and show excellent properties in all aspects.

Description

technical field [0001] The invention belongs to the field of preparation technology of intermetallic composite materials, and in particular relates to a technology for preparing tungsten-copper composite materials. Background technique [0002] Tungsten-copper alloy is a kind of composite material composed of tungsten and copper, which is uniformly distributed in two phases and neither solid solution nor compound. It has the high electrical conductivity and thermal conductivity of copper, and the high melting point and low thermal expansion of tungsten. . Due to the ideal heat sink and electronic packaging materials, the following basic requirements must be met: the thermal conductivity of the material is good, and the heat generated by the semiconductor chip can be dissipated in time; the thermal expansion coefficient of the material should be comparable to that of single crystal silicon and arsenic Gallium and other chips are matched to avoid thermal stress damage to the ...

AI Technical Summary

Problems solved by technology

The tungsten-copper alloy produced by the mixed method has a low density (only 95% of the theoretical density), and poor electrical and thermal conductivity, which limits the large-scale promotion and application of this technology and materials.

The infiltration method is easy to produce micropores, holes and oxide residues, etc., which will greatly reduce the stability of the material, and has great restrictions on the composition of the material

Nano-composite powder is used for sintering, in which nano-scale alloy powder needs to be ball milled, which is costly, easy to introduce new impurities, and difficult to remove the forming agent, so it is difficult to achieve mass production

In addition, the tungsten-copper alloy prepared by any process is very prone to thermal deformation in the subsequent grinding process. In order to avoid this thermal deformation, the currently commonly used surface grinding method can only reduce the feed rate and also reduce the feed rate. The grinding process needs to be changed frequently, which seriously affects the efficiency of the grinding process; moreover, the tungsten-copper alloy is not magnetic, and it is difficult to effectively clamp the heat sink and the packaging material sheet on the grinding machine, which also brings difficulties to the grinding process