Technique for preparing tungsten copper heat-sink and electric packaging material

An electronic packaging material, tungsten-copper technology, applied in the technical field of preparing tungsten-copper composite materials, can solve the problems of difficult grinding, high cost, and non-magnetism of tungsten-copper alloy, and achieve reasonable production process, low production cost, and high structure Uniform and dense effect

Active Publication Date: 2009-06-10
安泰天龙钨钼科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The tungsten-copper alloy produced by the mixed method has a low density (only 95% of the theoretical density), and poor electrical and thermal conductivity, which limits the large-scale promotion and application of this technology and materials.
The infiltration method is easy to produce micropores, holes and oxide residues, etc., which will greatly reduce the stability of the material, and has great restrictions on the composition of the material
Nano-composite powder is used for sintering, in which nano-scale alloy powder needs to be ball milled, which is costly, easy to introduce new impurities, and difficult to remove the forming agent, so it is diffi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039]A tungsten-copper alloy comprises the following components and contents (weight): 85% tungsten and 15% copper. Its preparation process comprises the following steps:

[0040] (1) Powder preparation

[0041] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3 to 8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0042] (2) Mixing

[0043] The tungsten powder in step (1) is used without adding inducer (electrolytic copper powder), and mixed uniformly on a powder mixer.

[0044] (3) Compression molding

[0045] The mixture processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a press, and the pressure of the press is 180MPa;

[0046] After vacuum packaging the automatically molded tungsten-copper green body with an aluminum-plastic composite film, it is isostatically pressed on an isostatic press. Take it out o...

Embodiment 2

[0055] A tungsten-copper alloy comprises the following components and content (weight): 80% tungsten and 20% copper. Its preparation process comprises the following steps:

[0056] (1) Powder preparation

[0057] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3 to 8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0058] (2) Add inducer and mixture

[0059] The above-mentioned tungsten powder and electrolytic copper powder (as inducer) are uniformly mixed on a powder mixer, wherein the addition of electrolytic copper powder accounts for 2% of the total weight of the tungsten-copper alloy, and the addition of tungsten powder accounts for 2% of the total weight of the tungsten-copper alloy. 80%.

[0060] (3) Compression molding

[0061] The mixed material processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a pre...

Embodiment 3

[0071] A tungsten-copper alloy comprises the following components and content (weight): 75% of tungsten and 25% of copper. Its preparation process comprises the following steps:

[0072] (1) Powder preparation

[0073] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3 to 8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0074] (2) Add inducer and mixture

[0075] The above-mentioned tungsten powder and electrolytic copper powder (as inducer) are uniformly mixed on a powder mixer, wherein the addition of electrolytic copper powder accounts for 6% of the total weight of the tungsten-copper alloy, and the addition of tungsten powder accounts for 6% of the total weight of the tungsten-copper alloy. 75%.

[0076] (3) Compression molding

[0077] The mixture processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a pres...

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Abstract

The invention provides a novel process for preparing tungsten-copper heat sink and electronic package materials, in order to overcome the problems that the prior tungsten-copper heat sink and electronic package materials are not excellent enough in quality, high in preparation cost and low in production efficiency. The process comprises the steps of preparing powder, adding inducers, mixing materials, molding for automatic forming, performing isostatic pressing and covering, presintering and infiltrating liquid copper. The process which is adopted to prepare the tungsten-copper heat sink and electronic package materials has the advantages of low cost and high production efficiency; in addition, the prepared tungsten-copper heat sink and electronic package materials are compact in structure and show excellent properties in all aspects.

Description

technical field [0001] The invention belongs to the field of preparation technology of intermetallic composite materials, and in particular relates to a technology for preparing tungsten-copper composite materials. Background technique [0002] Tungsten-copper alloy is a kind of composite material composed of tungsten and copper, which is uniformly distributed in two phases and neither solid solution nor compound. It has the high electrical conductivity and thermal conductivity of copper, and the high melting point and low thermal expansion of tungsten. . Due to the ideal heat sink and electronic packaging materials, the following basic requirements must be met: the thermal conductivity of the material is good, and the heat generated by the semiconductor chip can be dissipated in time; the thermal expansion coefficient of the material should be comparable to that of single crystal silicon and arsenic Gallium and other chips are matched to avoid thermal stress damage to the ...

Claims

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Application Information

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IPC IPC(8): B22F3/16B22F3/26C22C1/04
Inventor 苏国平刘俊海苏国军王峥
Owner 安泰天龙钨钼科技有限公司
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